The present disclosure provides a method for preparing a MEMS micro mirror with electrodes on both sides. The method includes: providing a first base, forming an electrode lead groove in the first base; forming an insulating groove, a plurality of lower comb plates and a moving space groove in a first device layer to obtain a bonded structure layer; providing a second base bonded with the bonded structure layer to obtain a bonded piece; forming a frame, upper comb plates, movable micro light reflector, and elastic beams in a second device layer, with the movable micro light reflector located inside the frame, and the elastic beam connected with the frame and/or the movable micro light reflector; forming a metal reflecting layer, a first upper comb plate electrode, a first lower comb plate electrode, a second upper comb plate electrode and a second lower comb plate electrode.

Embodiments provide a method for acoustically testing at least one MEMS device of a plurality of MEMS devices. The method comprises a step of providing at least one MEMS device. Additionally, the method comprises a step of exciting the at least one MEMS device to an acoustic vibration. Additionally, the method comprises a step of detecting the acoustic vibration of the at least one MEMS device by at least one sound sensor. Additionally, the method comprises a step of evaluating the acoustic vibration of the at least one MEMS device detected by the at least one sound sensor to test the at least one MEMS device as to an intended functionality.

A Micro-Electro-Mechanical Systems (MEMS) device includes a substrate, an electronic circuit mounted on the substrate, a movable element mounted on the substrate whose movement is controlled by application of an operating voltage by the electronic circuit, a stopper mounted on the substrate that stops the movement of the movable element through mechanical contact of the stopper with the movable element, and an auto-inspection mechanism that applies a test voltage between the movable element and the stopper and determines whether or not a leak current is present. The auto-inspection mechanism is mounted, at least in part, on the substrate. The test voltage is lower than the operating voltage.

A method for detecting contamination of a microelectromechanical sensor element. The method includes the following steps: outputting heating control signals for controlling a heating device in order to heat the sensor element, receiving measuring signals that represent a physical variable that is measured with the aid of the heated sensor element, ascertaining, based on the measured physical variable, whether the sensor element has contamination or is free of contamination, outputting result signals that represent a result indicating whether the sensor element has contamination or is free of contamination. Moreover, a device is described.

A device includes a micro-electromechanical system (MEMS) element configured to sense acoustic signals. The device also includes a circuitry configured to enable the microphone element to sense the acoustic signals. The circuitry is further configured to disable the microphone element to prevent the microphone element to sense the acoustic signals. It is appreciated that the circuitry is further configured to apply a test signal to the MEMS element when the microphone element is disabled. The microphone element outputs a signal in response to the test signal to the circuitry. The circuitry in response to the output signal with a first value determines that a diaphragm of the MEMS element is nonoperational and the circuitry in response to the output signal with a second value determines that the diaphragm of the MEMS element is operational.

Methods and apparatuses are provided for evaluating or testing stiction in Microelectromechanical Systems (MEMS) devices utilizing a mechanized shock pulse generation approach. In one embodiment, the method includes the step or process of loading a MEMS device, such as a multi-axis MEMS accelerometer, into a socket provided on a Device-Under-Test (DUT) board. After loading the MEMS device into the socket, a series of controlled shock pulses is generated and transmitted through the MEMS device utilizing a mechanized test apparatus. The mechanized test apparatus may, for example, repeatedly move the DUT board over a predefined motion path to generate the controlled shock pulses. In certain cases, transverse vibrations may also be directed through the tested MEMS device in conjunction with the shock pulses. An output of the MEMS device is then monitored to determine whether stiction of the MEMS device occurs during each of the series of controlled shock pulses.

A method for a MEMS device includes receiving a diced wafer having a plurality devices disposed upon an adhesive substrate and having an associated known good device data, removing a first set of devices from the plurality of devices from the adhesive substrate in response to the known good device data, picking and placing a first set of the devices into a plurality of sockets within a testing platform, testing the first set of integrated devices includes while physically stressing the first set of devices, providing electrical power to the first set of devices and receiving electrical response data from the first set of devices, determining a second set of devices from the first set of devices, in response to the electrical response data, picking and placing the second set of devices into a transport tape media.

For a small sensor produced through a MEMS process, when an electrode pad, wiring, or a shield layer is formed in a final step, it is difficult to nondestructively investigate whether a structure for sensing a physical quantity has been processed satisfactorily. In the present invention, in a physical quantity sensor formed from an MEMS structure, in a structure in which a surface electrode having through wiring is formed on the surface of an electrode substrate and the periphery thereof is insulated, forming a shield layer comprising a metallic material on the surface of the electrode substrate in a planar view and providing a space for internal observation inside the shield layer makes it possible to check for internal defects.

A method of detecting whether a microelectromechanical system (MEMS) device is hermetic includes applying at least three voltage differences between a movable part and a sensor electrode of the MEMS device to measure at least three effective capacitances, calculating a capacitance-to-voltage curve and an offset voltage of the MEMS device according to the at least three effective capacitances; and determining whether the offset voltage is within a predetermined range to determine whether MEMS device is hermetic.

A device includes a micro-electromechanical system (MEMS) element configured to sense acoustic signals. The device also includes a circuitry configured to enable the microphone element to sense the acoustic signals. The circuitry is further configured to disable the microphone element to prevent the microphone element to sense the acoustic signals. It is appreciated that the circuitry is further configured to apply a test signal to the MEMS element when the microphone element is disabled. The microphone element outputs a signal in response to the test signal to the circuitry. The circuitry in response to the output signal with a first value determines that a diaphragm of the MEMS element is nonoperational and the circuitry in response to the output signal with a second value determines that the diaphragm of the MEMS element is operational.