A method produces a housing with at least one hermetically sealed receiving space for an electronic component, the receiving space including at least a part of the interior of the housing. In the method, a hollow body made of glass and having at least one opening is produced/provided, at least one electronic device is introduced through the at least one opening, and the receiving space is hermetically sealed by melting the housing, or the at least one opening is sealed by laser radiation. A device has an at least partially hermetically sealed housing made of silicon, particularly a housing produced according to the above-mentioned method.

A method for manufacturing an all-glass solar heat collecting tube without a tail pipe. The bottom of one end of an inner glass tube plated by a selective absorbing coating layer is rounded, the other end is connected to a first glass outer tube. The bottom of one end of a second glass outer tube is rounded and the other end is flared. The connected inner glass tube/first glass outer tube is inserted into the second glass outer tube. A gap is formed between the first glass outer tube and the second glass outer tube to serve as an air exhausting channel. The first glass outer tube is inserted into the flared opening of the second glass outer tube. The contact point between the first glass outer tube and the second glass outer tube is heated to frit seal and butt joint.

A method for manufacturing an all-glass solar heat collecting tube without a tail pipe. The bottom of one end of an inner glass tube plated by a selective absorbing coating layer is rounded, the other end is connected to a first glass outer tube. The bottom of one end of a second glass outer tube is rounded and the other end is flared. The connected inner glass tube/first glass outer tube is inserted into the second glass outer tube. A gap is formed between the first glass outer tube and the second glass outer tube to serve as an air exhausting channel. The first glass outer tube is inserted into the flared opening of the second glass outer tube. The contact point between the first glass outer tube and the second glass outer tube is heated to frit seal and butt joint.

A method produces a housing with at least one hermetically sealed receiving space for an electronic component, the receiving space including at least a part of the interior of the housing. In the method, a hollow body made of glass and having at least one opening is produced/provided, at least one electronic device is introduced through the at least one opening, and the receiving space is hermetically sealed by melting the housing, or the at least one opening is sealed by laser radiation. A device has an at least partially hermetically sealed housing made of silicon, particularly a housing produced according to the above-mentioned method.

A method produces a housing with at least one hermetically sealed receiving space for an electronic component, the receiving space including at least a part of the interior of the housing. In the method, a hollow body made of glass and having at least one opening is produced/provided, at least one electronic device is introduced through the at least one opening, and the receiving space is hermetically sealed by melting the housing, or the at least one opening is sealed by laser radiation. A device has an at least partially hermetically sealed housing made of silicon, particularly a housing produced according to the above-mentioned method.