A glass container that includes a base defining a hole, and methods of manufacturing and using the glass container, is disclosed. The glass container is manufactured by providing the container and cutting a hole in a wall of the container. The hole may be cut into the wall by any technique in which glass material is separated from the wall including by mechanical shearing, thermal energy, and/or fluid impingement. To use the glass container, a deformable blow-out plug may be inserted into the hole to fluidly seal the hole, a liquid beverage may be introduced into the container, a closure may be coupled to the container to close the container and provide a pressurizable package, and thereafter the package may be internally pressurized by introducing a pressurizing gas into the package.

A cleaving assembly and a method for cleaving a glass body having a face at a desired angle greater than 0 degrees are disclosed. The assembly comprises a laser device for emitting a laser beam, a rotating device, and a positioning fixture. The rotating device has a head that rotates about a central axis that is orthogonal to the laser beam. The positioning fixture is operatively mounted to the head and centered axially along the central axis and is also rotatably driven by the rotating device. The positioning fixture has a tapered surface that is transverse to the central axis and that supports the glass body at a predetermined angle relative to the central axis. Rotation of the positioning fixture about the central axis when the glass body is exposed to the laser beam, cleaves the face of the glass body at the desired angle due to the glass body being supported transverse to the central axis.

Embodiments of the present method of laser cutting a laser wavelength transparent glass article comprises feeding at least one glass article to a pulsed laser assembly having at least one pulsed laser, wherein the pulsed laser defines a laser beam focal line with a length of 0.1-100 mm, the glass article being comprised of two end sections, and at least one lateral surface disposed lengthwise between the end sections. The method further comprises laser cutting at least one perforation line onto the lateral surface of the glass article while there is relative motion between the glass article and the pulsed laser and separating the glass article along the at least one perforation line to yield a laser cut glass article.

The invention relates to a system for producing a particularly rotationally symmetrical glass container, such as a glass syringe, a glass carpule, a glass vial, or a glass ampoule, from a particularly rotationally symmetrical glass tube blank, which defines a rotational axis, comprising a chuck for mounting the glass tube blank in a rotating manner, a length-cutting device for cutting to length glass containers of predetermined length from the glass tube blank, and an air bearing, which is arranged downstream of the chuck and upstream of the length-cutting device, for contactlessly mounting the glass tube blank.

A cleaving assembly and a method for cleaving a glass rod and end cap having diameters of at least 125 μm and a face at a desired angle greater than 0 degrees are disclosed. The assembly comprises a laser device for emitting a laser beam, a rotating device, and a positioning fixture. The rotating device has a head that rotates about a central axis that is orthogonal to the laser beam. The positioning fixture is operatively mounted to the head and centered axially along the central axis and is also rotatably driven by the rotating device. The positioning fixture has a tapered surface that is transverse to the central axis and that supports the glass rod at a predetermined angle relative to the central axis. Rotation of the positioning fixture about the central axis when the glass rod and end cap is exposed to the laser beam, cleaves the face at the desired angle.

A brittle object cutting apparatus and the method thereof are disclosed. Wherein, the brittle object cutting apparatus comprises a first heating laser unit, a second heating laser unit, a scribing laser unit, two cooling units and a processing module. A heating laser from the heating laser units respectively located on opposite sides of a scribing laser from the scribing laser unit, and a coolant of the cooling unit followed behind the heating laser. In the moving process of the brittle object, the processing module controls the scribing laser for a scribing operation, and controls one of the heating lasers and the coolant form one of the cooling units to heat and cool the brittle object. As a result, the machining time of dicing the brittle objects may be effectively reduced.

The invention relates to a method and a device for separating the excess glass (32) in the production of hollow glass products (12), wherein the method comprises: centring a hollow glass product (12) in a receiving device (10), which is designed to hold the hollow glass (12) and to rotate about a rotational axis in such a way that a separation line (24) along which the excess glass (32) is to be separated from the hollow glass product (12) to be produced is centred in relation to the rotational axis; processing the hollow glass product (12) in a plurality of positions along the separation line (24) by means of a laser beam in order to generate local filaments with a weakened glass structure during a rotation of the hollow glass product (12) about the rotational axis; and introducing energy along the separation line (24) in order to separate the excess glass (32) along the weakened glass structure.

A method for machining and releasing closed forms from a transparent, brittle substrate includes using a burst of ultrafast laser pulses to drill patterns of orifices in the substrate. Orifices are formed by photoacoustic compression and they extend completely or partially in the transparent substrate. A scribed line of spaced apart orifices in the transparent substrate comprise a closed form pattern in the substrate. A heat source is applied in a region about said scribed line of spaced apart orifices until the closed form pattern releases from the transparent substrate.

A method for processing glass elements is provided. The method includes introducing a perforation line for parting a glass element introduced into the glass element during or after a hot processing process at an elevated temperature of at least 100 C. Spaced-apart filamentary flaws are introduced into the glass element along the predetermined course of the perforation line by a pulsed laser beam of an ultrashort pulse laser, and, during or after the introduction of the filamentary flaws, the glass element is cooled down so as to produce a temperature gradient, which induces a mechanical stress at the filamentary flaws, whereby the breaking force required for parting the glass element along the perforation line is reduced.

With a method of cutting a tube glass (G1) according to the present invention, the tube glass (G1) is irradiated with laser light (L) having a focal point (F) adjusted to an inside of the tube glass (G1), to thereby form an inner crack region (C1) including one or more cracks in a portion of the tube glass (G1) in a circumferential direction of the tube glass (G1) through multiphoton absorption that occurs in an irradiation region of the laser light (L). Then, in the tube glass (G1), there is generated a stress that urges the one or more cracks in the inner crack region (C1) to propagate in the circumferential direction of the tube glass (G1) to cause the one or more cracks to propagate throughout an entire circumference of the tube glass (G1), to thereby cut the tube glass (G1).