An electronic device may include electrical components and other components mounted within a housing. The device may have a display on a front face of the device and may have a glass layer that forms part of the housing on a rear face of the device. The glass layer and other glass structures in the electronic device may be provided with coatings. An interior coating on a glass layer may include multiple layers of material such as an adhesion promotion layer, thin-film layers of materials such as silicon, niobium oxide and other metal oxides, and metals to help adjust the appearance of the coating. A metal layer may be formed on top of the coating to serve as an environmental protection layer and opacity enhancement layer. In some configurations, the coating may include four layers.

A method for manufacturing a wiring board capable of improving adhesion between an underlayer and a seed layer. An electrically conductive underlayer is disposed on the surface of an insulating substrate and a seed layer containing metal is disposed on the surface of the underlayer to prepare a substrate with seed-layer. A diffusion layer in which elements forming the underlayer and seed layer are mutually diffused is formed between the underlayer and the seed layer, by irradiating the seed layer with a laser beam. A metal layer is formed on the surface of the seed layer by disposing a solid electrolyte membrane between an anode and the seed layer as a cathode and applying voltage between the anode and the underlayer. An exposed portion without the seed layer of the underlayer is removed from the insulating substrate.

A material includes a transparent substrate coated with a stack including at least one functional metal layer based on silver and at least two dielectric coatings, each dielectric coating including at least one dielectric layer, in such a way that each functional metal layer is positioned between two dielectric coatings, wherein the stack includes a layer based on silicon oxide having a thickness of greater than or equal to 12 nm located directly in contact with the substrate.

The invention concerns reflective opaque panels that can be used as facing panels or decorative panels. They consist of a substrate coated with a stack of layers comprising, in the following order, at least (i) a transparent substrate (S), (ii) a first dielectric layer which is a high refractive index dielectric layer (H1), (iii) a second dielectric layer which is a low refractive index dielectric layer (L1), and (vi) a single chromium-based layer.

A glass article having anti-sun properties includes a glass substrate having a stack of layers, which includes, successively from the surface of the substrate: a first module M.sub.1 having a layer based on a dielectric material with a thickness e.sub.1 or of a set of layers, a layer TN.sub.1 including titanium nitride with a thickness of between 2 nanometers and 80 nanometers, a second module M.sub.2 including a layer based on a dielectric material with a thickness e.sub.2 or of a set of layers based on dielectric materials with a cumulative thickness e.sub.2, an intermediate layer including at least one element selected from silicon, aluminum, titanium or a mixture of at least two of these elements is deposited between the layer TN.sub.1 and the first module M.sub.1 and/or between the layer TN.sub.1 and the second module M.sub.2, the intermediate layer having a thickness of between 0.2 nm and 6 nm.

A preparation method for a high-refractive index hydrogenated silicon film, a high-refractive index hydrogenated silicon film, a light filtering lamination and a light filtering piece. The method includes: (a) by magnetic controlled Si target sputtering, Si deposits on a base body, forming a silicon film, which (b) forms an oxygenic hydrogenated silicon film in environment of active hydrogen and active oxygen, the amount of active oxygen accounts for 4%-99% of the total amount of active hydrogen and active oxygen, or, a nitric hydrogenated silicon film in environment of active hydrogen and active nitrogen, the amount of active nitrogen accounts for 5%-20% of the total amount of active hydrogen and active nitrogen. Sputtering and reactions are separately conducted, Si first deposits on the base body by magnetic controlled Si target sputtering, and then plasmas of active hydrogen and active oxygen/nitrogen react with silicon for oxygenic or nitric SiH.

Techniques, processes and structures are disclosed for providing markings on products, such as electronic devices. For example, the markings can be formed using physical vapor deposition (PVD) processes to deposit a layer of material. The markings or labels may be textual and/or graphic. The markings are deposited on a compliant layer that is disposed on a surface to be marked. The compliant layer is arranged to isolate the surface to be marked from the layer of material deposited using the PVD process.

The object is to provide a mask blank substrate, a mask blank, and a transfer mask which can achieve easy correction of a wavefront by a wavefront correction function of an exposure apparatus. The further object is to provide methods for manufacturing them.

A virtual surface shape, which is an optically effective flat reference surface shape defined by a Zernike polynomial, is determined, wherein the Zernike polynomial is composed of only terms in which the order of variables related to a radius is second or lower order and includes one or more terms in which the order of the variables related to a radius is second-order; and the mask blank substrate, in which difference data (PV value) between the maximum value and the minimum value of difference shape between a virtual surface shape and a composite surface shape obtained by composing respective surface shapes of two main surfaces is 25 nm or less, is selected.

A low-E (low emissivity) coating includes a multilayer overcoat designed for reducing fingerprints. The multilayer overcoat includes a layer comprising an oxide of zirconium (e.g., ZrO.sub.2) sandwiched between and contacting first and second layers of or including silicon nitride (e.g., Si.sub.3N.sub.4, SiO.sub.xN.sub.y, SiZrO.sub.xN.sub.y, or the like). The uppermost layer comprising silicon nitride modifies the surface energy of the layer comprising the oxide of zirconium so as to make the uppermost surface of the coating more hydrophilic, thereby reducing or minimizing interaction between zirconium oxide and finger oil to reduce fingerprints on the uppermost surface of the coating.

A material includes a transparent substrate coated with a stack including at least one silver-based functional metal layer and at least two dielectric coatings, each dielectric coating including at least one dielectric layer, so that each functional metal layer is placed between two dielectric coatings, wherein the dielectric coating located in contact with the substrate includes an intermediate coating including two different layers containing silicon, the two layers containing silicon consist of different chemical elements or composed of the same elements in different proportions.