A material including a transparent substrate coated with a stack acting on infrared radiation includes at least one functional layer and at least one upper protective layer deposited above at least a part of the functional layer. The upper protective layer is a hydrogenated carbon layer, within which layer the carbon atoms form carbon-carbon and carbon-hydrogen bonds and are essentially in an sp.sup.2 hybridization state.

Certain example embodiments of this invention relate to techniques for converting sputter-deposited TiNx or TiOxNy layers into TiOx layers via activation with electromagnetic radiation. An intermediate layer including TiOxNy, 0<y≦1 is formed on a substrate. The intermediate layer is exposed to the radiation, which is preferentially absorbed by the intermediate layer in an amount sufficient to heat the intermediate layer to a temperature of 500-650 degrees C. while keeping the substrate at a significantly lower temperature. A flash light operated with a series of millisecond or sub-millisecond length pulses may be used in this regard. The converting removes nitrogen from, and introduces oxygen into, the intermediate layer, causing the layer to expand beyond its initial thickness. At least some of the final layer may have an anatase phase, and it may be photocatalytic. These layers may be used in low-maintenance glass, antireflective, and/or other applications.

A transparent substrate with a thin film multilayer coating, and the thin film multilayer coating includes a lower dielectric layer, a lower metal protective layer, a metal functional layer having an infrared reflecting function, an upper metal protective layer, and an upper dielectric layer, which are sequentially laminated on the transparent substrate, wherein the lower metal protective layer is thicker than the upper metal protective layer, and the thickness of the upper metal protective layer is 0.3 nm to 0.7 nm.

An electronic device may include electrical components and other components mounted within a housing. The device may have a display on a front face of the device and may have a glass layer that forms part of the housing on a rear face of the device. The glass layer and other glass structures in the electronic device may be provided with coatings. An interior coating on a glass layer may include multiple layers of material such as an adhesion promotion layer, thin-film layers of materials such as silicon, niobium oxide and other metal oxides, and metals to help adjust the appearance of the coating. A metal layer may be formed on top of the coating to serve as an environmental protection layer and opacity enhancement layer. In some configurations, the coating may include four layers.

A material includes one or more transparent substrates comprising two main faces, wherein one of the faces of one of the substrates is coated with a functional coating which can have an effect on solar radiation and/or infrared radiation, and a face not coated with the functional coating of one of the substrates includes a reflective color-adjustment coating comprising at least one dielectric layer including a reflective dielectric layer with a thickness of between 2 and 100 nm, all the dielectric layers of the reflective color-adjustment coating have a thickness of less than 100 nm.

Mesoporous nanostructured coatings are disclosed. The coatings comprise particles of a refractory material, the particles having diameters <200 nm, connected by a material that is formed from a precursor that is deposited on the substrate with the particles, typically by oxidation of the precursor. The material that connects the particles enhances their necking and adhesion to the substrate. In preferred embodiments, the coatings are multi-functional, combining anti-reflective properties with a second property such as self-cleaning or anti-soiling. A novel method for making the coatings, based on inkjet technology, is also disclosed.

Provided is a Low-E glass plate protection method capable of preventing or inhibiting Low-E layer alteration. In the protection method, a protective sheet having a substrate and a PSA layer provided to at least one face of the substrate is applied for protection via the PSA layer to a Low-E glass plate having a Low-E layer that comprises a zinc component. The method is characterized by using the protective sheet wherein the PSA layer is formed from a water-dispersed PSA composition and includes less than 850 μg ammonia per gram of PSA layer weight.

A laminate including a glass plate and a coating layer, wherein the coating layer includes one or more components selected from the group consisting of silicon nitride, titanium oxide, alumina, niobium oxide, zirconia, indium tin oxide, silicon oxide, magnesium fluoride, and calcium fluoride, wherein a ratio (dc/dg) of a thickness dc of the coating layer to a thickness dg of the glass plate is in a range of 0.05×10.sup.−3 to 1.2×10.sup.−3, and wherein a radius of curvature r1 of the laminate with negating of self-weight deflection is 10 m to 150 m.

The invention provides a glazing comprising first glass sheet comprising a printed layer on a portion of a surface of the glass sheet and a conductive coating on the surface of the first glass sheet. The conductive coating extends over at least a portion of the printed layer to form a coated print portion and extends over a portion of the surface of the glass sheet to form a coated glass portion. The coated print portion has a Developed Interfacial Area Ratio Sdr less than 27.45%. A method for producing the glazing and use of the glazing in a vehicle is also disclosed.

The present disclosure relates to a method for forming a glass structure having a metallized surface portion. The method may comprise forming a structure using a flowable first material, adapted to form a glass, which includes a metal component. The structure is then treated to remove substantially all solvents and organic components contained in the first flowable material. Finally, the structure is exposed to a bath of a metal salt during which nucleation occurs and a metallized surface coating is formed on at least a portion of an outer surface of the structure.