A method of manufacturing a nozzle for a droplet generator for a laser-produced plasma radiation source is disclosed. The method comprises disposing a glass capillary in a throughbore of a metal fitting, heating the metal fitting; and applying a pressure to the glass capillary such that the glass capillary conforms to the shape of, and forms a direct glass-to-metal seal with, the throughbore. Also disclosed is a nozzle for a droplet generator for a laser-produced plasma radiation source, and the radiation source itself, wherein the nozzle comprises the glass capillary for emitting fuel as droplets and the metal fitting for coupling the glass capillary to a body of the droplet generator, the glass capillary being conformed to a shape of a throughbore of the metal fitting, and wherein the glass capillary forms a direct glass-to-metal seal with the throughbore.

A vehicle window glass comprises a glass substrate layer, an electrically conductive layer forming a conductive pattern over the glass substrate, a lead-free solder layer on the conductive layer and a metal plate element of an electrical connector on the solder layer. Optionally a coloured ceramic band layer is sintered between the glass substrate layer and the conductive layer. The thickness of the metal plate element is between 0.5 mm and 0.7 mm.

What is disclosed is a lead-free glass, which is a V.sub.2O.sub.5—TeO.sub.2—RO (at least one selected from the group consisting of MgO, CaO, SrO, and BaO)—ZnO glass and has a low softening point, comprising: 5-55 wt % of V.sub.2O.sub.5, 5-75 wt % of TeO.sub.2, 1-25 wt % of RO (at least one selected from the group consisting of MgO, CaO, SrO, and BaO) in total, 0.1-6 wt % of ZnO, and 0.1-3 wt % of R.sub.2O (at least one selected from the group consisting of Li.sub.2O, Na.sub.2O, and K.sub.2O) in total. This glass can be used as a sealing material providing fluidity which is capable of being sealed at a temperature of 400° C. or less

Contact pins for glass seals is provided having an iron alloy and a method for their production. The contact pins are provided with a nickel layer and coated with rhodium and/or platinum or with palladium. The contact pins may be additionally provided with a layer of gold. The contact pins are first cleaned by degreasing and activating, preferably by activating through acid etching. Thereafter, the application of a nickel layer is performed under a protective gas atmosphere, followed by formatting at 850 to 1050° C. The protective gas atmosphere is preferably made up of 10 to 100% hydrogen, with the balance formed of nitrogen. This is followed by a coating with palladium or with rhodium and platinum, or with platinum, or with rhodium and gold.

Electronic device encapsulation process, assisted by a laser, for obtaining a sealed electronic device, wherein said process comprises: providing a first substrate and a second substrate, the second substrate being transparent in the emission wavelength of the laser, depositing an intermediate bonding contour layer on one or both of the substrates; depositing electronic device components on one or both of the substrates; joining the first substrate and second substrate with the electronic device components in-between the substrates; using the laser to direct a laser beam onto the intermediate bonding contour layer with a predefined progressive scan pattern, such that the intermediate bonding contour layer is progressively melted and forms a seal, bonding the substrates together. Preferably, each linear laser pass overlaps longitudinally the previous and the following linear laser passes along said contour. Preferably, each linear laser pass is followed by a partial backtrack of the each linear laser pass, such that a part of the linear laser pass overlaps longitudinally the previous linear laser pass.

A method of manufacturing a glass article comprises: (A) forming a first layer of catalyst metal on a glass substrate; (B) heating the glass substrate; (C) forming a second layer of an alloy of a first metal and a second metal on the first layer; (D) heating the glass substrate, thereby forming a glass article comprising: (i) the glass substrate; (ii) an oxide of the first metal covalently bonded thereto; and (iii) a metallic region bonded to the oxide, the metallic region comprising the catalyst, first, and second metals. In embodiments, the method further comprises (E) forming a third layer of a primary metal on the metallic region; and (F) heating the glass article thereby forming the glass article comprising: (i) the oxide of the first metal covalently bonded the glass substrate; and (ii) a new metallic region bonded to the oxide comprising the catalyst, first, second, and primary metals.

A vehicle window glass comprises a glass substrate layer, an electrically conductive layer forming a conductive pattern over the glass substrate, a lead-free solder layer on the conductive layer and a metal plate element of an electrical connector on the solder layer. Optionally a coloured ceramic band layer is sintered between the glass substrate layer and the conductive layer. The thickness of the metal plate element is between 0.5 mm and 0.7 mm.

The purpose of the invention is to manufacture the device having a resin substrate without using expensive machine like laser apparatus and so forth, and to raise a yield rate of the material. The structure is as follows.

A device having a resin substrate:

in which the resin substrate has a surface, on which a functional layer is formed, and a back surface, which is rear side from the surface,

the back surface has a peripheral area and an inner area, which is located inner side than the peripheral area in a plan view,

the peripheral area has a rough surface whose surface roughness is larger compared with a surface roughness of the inner area.

A method of processing a double sided wafer of a microelectromechanical device includes spinning a resist onto a first side of a first wafer. The method further includes forming pathways within the resist to expose portions of the first side of the first wafer. The method also includes etching one or more depressions in the first side of the first wafer through the pathways, where each of the depressions have a planar surface and edges. Furthermore, the method includes depositing one or more adhesion metals over the resist such that the one or more adhesion metals are deposited within the depressions, and then removing the resist from the first wafer. The method finally includes depositing indium onto the adhesion metals deposited within the depressions and bonding a second wafer to the first wafer by compressing the indium between the second wafer and the first wafer.

A method of manufacturing a glass article comprises: (A) forming a first layer of catalyst metal on a glass substrate; (B) heating the glass substrate; (C) forming a second layer of an alloy of a first metal and a second metal on the first layer; (D) heating the glass substrate, thereby forming a glass article comprising: (i) the glass substrate; (ii) an oxide of the first metal covalently bonded thereto; and (iii) a metallic region bonded to the oxide, the metallic region comprising the catalyst, first, and second metals. In embodiments, the method further comprises (E) forming a third layer of a primary metal on the metallic region; and (F) heating the glass article thereby forming the glass article comprising: (i) the oxide of the first metal covalently bonded the glass substrate; and (ii) a new metallic region bonded to the oxide comprising the catalyst, first, second, and primary metals.