C04B2237/341

Indirect laser brazing of SiC/SiC CMCs for manufacturing and repair

A method of connecting two CMC substrates that includes providing two substrates; placing one substrate approximate to the other substrate, such that at least a portion of the two substrates overlap and define a brazing area; placing a brazing material approximate the brazing area; defining a primary raster pattern that encompasses the brazing area and a portion of the two substrates outside the brazing area; defining a secondary raster pattern that encompasses the brazing area; allowing a laser to scan the primary raster pattern to preheat the brazing area to a temperature below the brazing material's melting point; allowing the laser to scan the secondary raster pattern to heat the brazing area to a temperature that is above the brazing material's melting point; melting and allowing the brazing material to flow within the brazing area; and cooling the brazing area to form a brazed joint connecting the two substrates.

Three-dimensional shaped article production method

A three-dimensional shaped article production method for producing a three-dimensional shaped article by stacking layers to form a stacked body includes a first layer formation step of forming a first layer on a support by supplying a first composition containing first particles and a binder, a second layer formation step of forming a second layer composed of one layer or a plurality of layers on the first layer by supplying a second composition containing second particles and a binder, and a separation step of separating the second layer from the support through the first layer, wherein after the separation step, a sintering step of sintering the second layer is performed.

Thermal insulation
11702372 · 2023-07-18 · ·

A process for the manufacture of inorganic fibres comprises: (a) selecting a composition and proportion of: (i) silica sand; (ii) lime comprising at least 0.10 wt % magnesia; and (iii) optional additives comprising a source of oxides or non-oxides of one or more of the lanthanides series of elements, or combinations thereof; (b) mixing the silica sand; lime; and optional additives to form a mixture; (c) melting the mixture in a furnace; and (d) shaping the molten mixture into inorganic fibres. The raw materials selection comprises composition selection and proportion selection of the raw materials to obtain an inorganic fibre composition comprising a range of from 61.0 wt % and 70.8 wt % silica; less than 2.0 wt % magnesia; less than 2.0% incidental impurities; and no more than 2.0 wt % of metal oxides and/or metal non-oxides derived from said optional additives; with calcia providing the balance up to 100 wt %; and wherein the inorganic fibre composition comprises no more than 0.80 wt % Al.sub.2O.sub.3 derived from the incidental impurities and/or the optional additives.

PLASMA RESISTANT CERAMIC BODY FORMED FROM MULTIPLE PIECES
20230212082 · 2023-07-06 ·

Disclosed is a joined ceramic body comprising a first ceramic portion comprising a first ceramic, a second ceramic portion comprising a second ceramic, and a joining layer formed between the first ceramic portion and the second ceramic portion. The joining layer has a bond thickness of from 0.5 to 20 um and comprises silicon dioxide having a total impurity content of 20 ppm and less. A method of making the joined ceramic body and a joining material are also disclosed.

FRANGIBLE AIRFOIL

An airfoil including a plurality of composite plies extending from a leading edge to a trailing edge and between a tip and a root. The airfoil further includes a frangible airfoil portion at the tip extending between the leading edge and the trailing edge and extending between the tip and a frangible line along a span including a first plurality of composite plies. The frangible airfoil portion includes a first plurality of composite plies including fibers having a first fiber modulus. The airfoil further includes a residual airfoil portion extending from the frangible line to the root along the span including a second plurality of composite plies. The second plurality of composite plies including one or more plies having a second fiber modulus. The second fiber modulus is greater than the first fiber modulus. Further, the residual airfoil portion meets the frangible airfoil portion at the frangible line.

Polycrystalline ceramic substrate, bonding-layer-including polycrystalline ceramic substrate, and laminated substrate

Provided is a polycrystalline ceramic substrate to be bonded to a compound semiconductor substrate with a bonding layer interposed therebetween, wherein at least one of relational expression (1) 0.7<α.sub.1/α.sub.2<0.9 and relational expression (2) 0.7<α.sub.3/α.sub.4<0.9 holds, where α.sub.1 represents a linear expansion coefficient of the polycrystalline ceramic substrate at 30° C. to 300° C. and α.sub.2 represents a linear expansion coefficient of the compound semiconductor substrate at 30° C. to 300° C., and α.sub.3 represents a linear expansion coefficient of the polycrystalline ceramic substrate at 30° C. to 1000° C. and α.sub.4 represents a linear expansion coefficient of the compound semiconductor substrate at 30° C. to 1000° C.

HONEYCOMB STRUCTURE, EXHAUST GAS PURIFICATION CATALYST, AND EXHAUST GAS PURIFICATION SYSTEM

A pillar shaped honeycomb structure for induction heating, the honeycomb structure being made of ceramics and including: an outer peripheral wall; and a partition wall disposed on an inner side of the outer peripheral wall, the partition wall defining a plurality of cells, each of the cells penetrating from one end face to other end face to form a flow path, wherein a composite material containing a conductor and a non-conductor is provided in the cells in a region of 50% or less of the total length of the honeycomb structure from one end face, and wherein the conductor is a conductor that generates heat in response to a change in a magnetic field.

COMPLIANT SUTURE-BASED JOINERY

Methods of forming joinery between components formed from dissimilar materials, and assemblies utilizing the joinery. The components include interface surfaces having complementary peaks and valleys that interlock. A compliant interface is formed between the interface surfaces and the interface can be configured to provide functionality.

METHOD FOR PRODUCING AN ADDITIVELY MANUFACTURED PRODUCT FROM A MINERAL STARTING MATERIAL BY MEANS OF DIRECT LASER SINTERING, AND LIGHTWEIGHT PART PRODUCED BY MEANS OF SAID METHOD
20220347882 · 2022-11-03 ·

The invention relates to a method for utilizing mineral materials for additive manufacturing that can be implemented more quickly, more economically and with greater technical simplicity, in comparison with common additive manufacturing, by virtue of controlled expansion in the sintering process by means of a laser source. The entire production process is free of organic materials and allows previously unfeasible end uses in the fields of acoustic insulation, thermal insulation, fire protection, filtration, design objects and lightweight components to be realized. In particular, the invention relates to a method for producing a product by means of 3-D printing or additive manufacturing, wherein an open-pore lightweight part is constructed layer-by-layer, without the use of organic binders or other organic auxiliary agents, from a pulverous mineral starting raw substance of natural origin, which raw substance is obtained without chemical alteration of the solid constituents of the natural material, and wherein, beginning with the second layer, the most recently applied layer is bonded to the surface of the existing body of the lightweight part by means of immediately subsequently performed direct selective laser sintering.

METHOD FOR ATOMIC DIFFUSION BONDING AND BONDED STRUCTURE

Atomic diffusion bonding is carried out using a bonding film comprising a nitride formed at a bonding surface. Operating in a vacuum chamber, a bonding film comprising a nitride is formed on each of flat surfaces of two substrates that each have the flat surface, and, by overlapping the two substrates so the bonding films formed on the two substrates are in contact with each other, the two substrates are joined by the generation of atomic diffusion at a bonding interface between the bonding films.