C08F20/14

Inorganic nanoparticle-coated hollow particles, method for producing the same, and aqueous dispersion containing the hollow particles
11707722 · 2023-07-25 · ·

Provided are hollow particles which are more excellent in heat resistance and dispersibility than ever before and which are lightweight. The hollow particles containing hollow resin particles having a surface covered with inorganic fine particles, wherein a volume average particle diameter of the hollow particles is from 0.1 μm to 9.0 μm, and a void ratio thereof is from 55% to 95%; wherein a repeating unit constituting the resin of the hollow resin particles contains a crosslinkable monomer unit, and a content of the crosslinkable monomer unit is from 25 to 100 parts by mass, with respect to 100 parts by mass of the resin; wherein a primary particle diameter of the inorganic fine particles is from 10 nm to 120 nm; and wherein the inorganic fine particles are contained at from 5 to 180 parts by mass, with respect to 100 parts by mass of the hollow resin particles.

Inorganic nanoparticle-coated hollow particles, method for producing the same, and aqueous dispersion containing the hollow particles
11707722 · 2023-07-25 · ·

Provided are hollow particles which are more excellent in heat resistance and dispersibility than ever before and which are lightweight. The hollow particles containing hollow resin particles having a surface covered with inorganic fine particles, wherein a volume average particle diameter of the hollow particles is from 0.1 μm to 9.0 μm, and a void ratio thereof is from 55% to 95%; wherein a repeating unit constituting the resin of the hollow resin particles contains a crosslinkable monomer unit, and a content of the crosslinkable monomer unit is from 25 to 100 parts by mass, with respect to 100 parts by mass of the resin; wherein a primary particle diameter of the inorganic fine particles is from 10 nm to 120 nm; and wherein the inorganic fine particles are contained at from 5 to 180 parts by mass, with respect to 100 parts by mass of the hollow resin particles.

Continuous inverse emulsion polymerization process for uniform polymer size distribution

A continuous inverse emulsion polymerization process may involve combining an aqueous monomer composition with an oil composition in a premix vessel and allowing the aqueous monomer composition to interact with the oil composition in the premix vessel for a period of time effective to form a stable pre-emulsion. The stable pre-emulsion may then be homogenized to form a homogenized emulsion that is then polymerized to form a water-in-oil inverse emulsion polymer. By forming a stable pre-emulsion that is then homogenized, the resulting water-in-oil inverse emulsion polymer may have uniform and consistent polymer size distribution.

INK COMPOSITION, WINDOW USING THE SAME, AND MANUFACTURING METHOD OF WINDOW USING THE SAME
20230235188 · 2023-07-27 ·

An ink composition includes an acrylic resin including a polymerization product of a first monomer having a hydroxyl group, a second monomer having an epoxy group, a third monomer having an acrylate group, and a fourth monomer having a substituted or unsubstituted phenyl group, a first curing agent having an isocyanate group, and a second curing agent having an amine group. Durability and abrasion resistance of a window may be improved.

Method for producing organic tellurium compound and method for producing vinyl polymer
11713294 · 2023-08-01 · ·

Provided is a method for producing an organic tellurium compound that enables the production of an organic tellurium compound in high yield using metallic tellurium as a source material and produces less amount of side products. A method for producing an organic tellurium compound includes the steps of: (A) reacting metallic tellurium with a compound represented by a general formula (1) below; and (B) reacting a compound obtained by the step (A) with an organic halogen compound, the metallic tellurium having a copper content of less than 100 ppm,
M(R.sup.1)m   Formula (1)
where R.sup.1 represents an alkyl group having 1 to 8 carbon atoms, an aryl group or an aromatic heterocyclic group, M represents an alkali metal or an alkaline earth metal, m represents 1 when M is an alkali metal, and m represents 2 when M is an alkaline earth metal.

Method for producing organic tellurium compound and method for producing vinyl polymer
11713294 · 2023-08-01 · ·

Provided is a method for producing an organic tellurium compound that enables the production of an organic tellurium compound in high yield using metallic tellurium as a source material and produces less amount of side products. A method for producing an organic tellurium compound includes the steps of: (A) reacting metallic tellurium with a compound represented by a general formula (1) below; and (B) reacting a compound obtained by the step (A) with an organic halogen compound, the metallic tellurium having a copper content of less than 100 ppm,
M(R.sup.1)m   Formula (1)
where R.sup.1 represents an alkyl group having 1 to 8 carbon atoms, an aryl group or an aromatic heterocyclic group, M represents an alkali metal or an alkaline earth metal, m represents 1 when M is an alkali metal, and m represents 2 when M is an alkaline earth metal.

SOLVENT-FREE AND LIGAND-FREE BALL MILLING METHOD FOR PREPARATION OF CESIUM LEAD TRIBROMIDE QUANTUM DOT

A solvent-free and ligand-free ball milling method for preparation of cesium lead tribromide (CsPbBr.sub.3) quantum dot is provided. First, mixing a Cs source, a Pb source, and a Br source as per a molar ratio of Cs source:Pb source:Br source is 1:1˜6:1˜9, and then adding polymethyl methacrylate (PMMA) to obtain a mixture. The mixture is milled for 1-2 hours at a rotation speed in a range of 360˜630 revolutions per minute (r/min) in a ball milling device, obtaining CsPbBr.sub.3 quantum dot. The method has advantages such as simple process, easy industrial production, no solvent, no organic ligand, low cost, and environmental protection. A quantum yield of product obtained by the method is up to 78%, and the product has a strong environmental stability. A preparation temperature of the product is low, and the reaction can be completed at a room temperature without a high temperature treatment.

SOLVENT-FREE AND LIGAND-FREE BALL MILLING METHOD FOR PREPARATION OF CESIUM LEAD TRIBROMIDE QUANTUM DOT

A solvent-free and ligand-free ball milling method for preparation of cesium lead tribromide (CsPbBr.sub.3) quantum dot is provided. First, mixing a Cs source, a Pb source, and a Br source as per a molar ratio of Cs source:Pb source:Br source is 1:1˜6:1˜9, and then adding polymethyl methacrylate (PMMA) to obtain a mixture. The mixture is milled for 1-2 hours at a rotation speed in a range of 360˜630 revolutions per minute (r/min) in a ball milling device, obtaining CsPbBr.sub.3 quantum dot. The method has advantages such as simple process, easy industrial production, no solvent, no organic ligand, low cost, and environmental protection. A quantum yield of product obtained by the method is up to 78%, and the product has a strong environmental stability. A preparation temperature of the product is low, and the reaction can be completed at a room temperature without a high temperature treatment.

THERMOPLASTIC MOULDING COMPOSITION WITH IMPROVED WEATHERING RESISTANCE
20230212333 · 2023-07-06 · ·

A thermoplastic moulding composition has improved weathering resistance. A process for producing the thermoplastic moulding composition involves providing a thermoplastic polymer and adding at least one colouring preparation. Injection moulded parts and extruded parts can be composed of the thermoplastic moulding composition.

THERMOPLASTIC MOULDING COMPOSITION WITH IMPROVED WEATHERING RESISTANCE
20230212333 · 2023-07-06 · ·

A thermoplastic moulding composition has improved weathering resistance. A process for producing the thermoplastic moulding composition involves providing a thermoplastic polymer and adding at least one colouring preparation. Injection moulded parts and extruded parts can be composed of the thermoplastic moulding composition.