Patent classifications
C08F255/026
Cyanoacrylate compositions
Cyanoacrylate compositions, methods for forming same, and applications thereof are disclosed. The compositions demonstrate improved thermal ageing performance, including improved tensile strength performance after heat ageing in high humidity.
Cyanoacrylate compositions
Cyanoacrylate compositions, methods for forming same, and applications thereof are disclosed. The compositions demonstrate improved thermal ageing performance, including improved tensile strength performance after heat ageing in high humidity.
Adhesive film, anti-PID encapsulation adhesive film, composition forming adhesive film, and photovoltaic module and laminated glass
Disclosed are an adhesive film, an anti-PID encapsulation adhesive film, a composition forming the adhesive film, and a photovoltaic module and laminated glass. The composition includes: an ethylene copolymer matrix resin, an amide organic compound, a metal oxide and/or metal hydroxide, the metal oxide is selected from one or more of the components aluminum oxide, calcium oxide, zinc oxide, banum oxide, magnesium oxide, zirconium oxide, titanium oxide, tin oxide, vanadium oxide, antimony oxide, tantalum oxide, niobium oxide, layered transition metal oxide, or ZnO-doped Al.sub.2O.sub.3, CaO/SiO.sub.2-doped Al.sub.2O.sub.3, MgO-doped Al.sub.2O.sub.3, SiO.sub.2-doped ZrO.sub.2, and TiO.sub.2-doped ZrO.sub.2, and the metal hydroxide is selected from one or more of the components calcium hydroxide, magnesium hydroxide, zinc hydroxide, aluminum hydroxide, iron hydroxide and barium hydroxide. Alternatively, the composition includes: a matrix resin, a metal ion trapping agent and an organic co-crosslinker. The adhesive film has a better anti-PID effect, photoelectric conversion efficiency and encapsulation performance.
Adhesive film, anti-PID encapsulation adhesive film, composition forming adhesive film, and photovoltaic module and laminated glass
Disclosed are an adhesive film, an anti-PID encapsulation adhesive film, a composition forming the adhesive film, and a photovoltaic module and laminated glass. The composition includes: an ethylene copolymer matrix resin, an amide organic compound, a metal oxide and/or metal hydroxide, the metal oxide is selected from one or more of the components aluminum oxide, calcium oxide, zinc oxide, banum oxide, magnesium oxide, zirconium oxide, titanium oxide, tin oxide, vanadium oxide, antimony oxide, tantalum oxide, niobium oxide, layered transition metal oxide, or ZnO-doped Al.sub.2O.sub.3, CaO/SiO.sub.2-doped Al.sub.2O.sub.3, MgO-doped Al.sub.2O.sub.3, SiO.sub.2-doped ZrO.sub.2, and TiO.sub.2-doped ZrO.sub.2, and the metal hydroxide is selected from one or more of the components calcium hydroxide, magnesium hydroxide, zinc hydroxide, aluminum hydroxide, iron hydroxide and barium hydroxide. Alternatively, the composition includes: a matrix resin, a metal ion trapping agent and an organic co-crosslinker. The adhesive film has a better anti-PID effect, photoelectric conversion efficiency and encapsulation performance.
FILM AND ELECTRONIC DEVICE COMPRISING SAME
Provided are a film and an electric device comprising the same. The film comprises at least one modified polyolefin resin layer. A resin forming the modified polyolefin resin layer comprises 1-100% of modified polyolefin resin. A main chain in the modified polyolefin resin is an ethylene-α-olefin copolymer. A grafted branched chain in the modified polyolefin resin is selected from a compound formed by a vinyl monomer comprising one or more of anhydride group, hydroxyl, ester group, carbonyl, acylamino, pyridyl, epoxy, pyrrolidonyl and glycidyl. A molecular weight of the grafted branched chain is 150-8000 g/mol. The film prepared from the modified POE layer with the main chain and the grafted branched chain has excellent anti-PID performance. The layers have a better adhesive property without a laminated interface therebetween. The co-extruded film further has an excellent water vapor barrier property, a relatively high insulating property and a relatively high light transmittance.
FILM AND ELECTRONIC DEVICE COMPRISING SAME
Provided are a film and an electric device comprising the same. The film comprises at least one modified polyolefin resin layer. A resin forming the modified polyolefin resin layer comprises 1-100% of modified polyolefin resin. A main chain in the modified polyolefin resin is an ethylene-α-olefin copolymer. A grafted branched chain in the modified polyolefin resin is selected from a compound formed by a vinyl monomer comprising one or more of anhydride group, hydroxyl, ester group, carbonyl, acylamino, pyridyl, epoxy, pyrrolidonyl and glycidyl. A molecular weight of the grafted branched chain is 150-8000 g/mol. The film prepared from the modified POE layer with the main chain and the grafted branched chain has excellent anti-PID performance. The layers have a better adhesive property without a laminated interface therebetween. The co-extruded film further has an excellent water vapor barrier property, a relatively high insulating property and a relatively high light transmittance.
ETHYLENE VINYL ACETATE COPOLYMER RESIN COMPOSITION, GRAFT COPOLYMER, THERMOPLASTIC RESIN COMPOSITION, AND MOLDED RESIN ARTICLE
An ethylene-vinyl acetate copolymer resin composition includes: an (A) ethylene-vinyl acetate copolymer; a (B) vinyl copolymer; and a (C) organic peroxide. The (B) vinyl copolymer and the (C) organic peroxide are impregnated in the (A) ethylene-vinyl acetate copolymer. The (A) ethylene-vinyl acetate copolymer includes 1 to 20 wt % of a vinyl acetate. The (B) vinyl copolymer is formed of a (b-1) styrene, (b-2) at least one of acrylonitrile and glycidyl methacrylate, a (b-3) t-butylperoxymethacryloyloxyethyl carbonate, and a (b-4) polymerization initiator. A content of the (C) organic peroxide is 0.1 to 3 parts by weight relative to 100 parts by weight of the (A) ethylene-vinyl acetate copolymer.
ETHYLENE VINYL ACETATE COPOLYMER RESIN COMPOSITION, GRAFT COPOLYMER, THERMOPLASTIC RESIN COMPOSITION, AND MOLDED RESIN ARTICLE
An ethylene-vinyl acetate copolymer resin composition includes: an (A) ethylene-vinyl acetate copolymer; a (B) vinyl copolymer; and a (C) organic peroxide. The (B) vinyl copolymer and the (C) organic peroxide are impregnated in the (A) ethylene-vinyl acetate copolymer. The (A) ethylene-vinyl acetate copolymer includes 1 to 20 wt % of a vinyl acetate. The (B) vinyl copolymer is formed of a (b-1) styrene, (b-2) at least one of acrylonitrile and glycidyl methacrylate, a (b-3) t-butylperoxymethacryloyloxyethyl carbonate, and a (b-4) polymerization initiator. A content of the (C) organic peroxide is 0.1 to 3 parts by weight relative to 100 parts by weight of the (A) ethylene-vinyl acetate copolymer.
AQUEOUS COPOLYMER DISPERSIONS AND THEIR USE IN COATING COMPOSITIONS
An aqueous copolymer dispersion is obtained by a multi-stage emulsion polymerization process comprising polymerizing in a reaction zone in a first polymerization stage a first monomer composition comprising at least 88 wt % of a vinyl ester of a C.sub.1 to C.sub.18 carboxylic acid and up to 12 wt % ethylene to produce a first stage polymer having Tg>20° C.; and polymerizing in the reaction zone, in a second polymerization stage and in the presence of the first stage polymer, a second monomer composition comprising a vinyl ester of a C.sub.1 to C.sub.18 carboxylic acid and a C.sub.2 to C.sub.8 alkyl ester of (meth)acrylic acid to produce a second stage polymer having Tg≤20° C. Each of the polymerization stages is conducted in the presence of a stabilizing system comprising at least 0.1 wt % of a protective colloid and at least 0.05 wt % of an ionic surfactant.
AQUEOUS COPOLYMER DISPERSIONS AND THEIR USE IN COATING COMPOSITIONS
An aqueous copolymer dispersion is obtained by a multi-stage emulsion polymerization process comprising polymerizing in a reaction zone in a first polymerization stage a first monomer composition comprising at least 88 wt % of a vinyl ester of a C.sub.1 to C.sub.18 carboxylic acid and up to 12 wt % ethylene to produce a first stage polymer having Tg>20° C.; and polymerizing in the reaction zone, in a second polymerization stage and in the presence of the first stage polymer, a second monomer composition comprising a vinyl ester of a C.sub.1 to C.sub.18 carboxylic acid and a C.sub.2 to C.sub.8 alkyl ester of (meth)acrylic acid to produce a second stage polymer having Tg≤20° C. Each of the polymerization stages is conducted in the presence of a stabilizing system comprising at least 0.1 wt % of a protective colloid and at least 0.05 wt % of an ionic surfactant.