The invention provides a composition for forming an organic film, which generates no by-product even under such a film formation condition in an inert gas to prevent substrate corrosion, which is capable of forming an organic film not only excellent in properties of filling and planarizing a pattern formed on a substrate but also favorable for dry etching resistance during substrate processing, and further which causes no fluctuation in film thickness of the film due to thermal decomposition even when a CVD hard mask is formed on the organic film. The composition for forming an organic film includes (A) a polymer having a repeating unit shown by the following general formula (1) and (B) an organic solvent. ##STR00001##

Resins are provided including bisphenol M diphthalonitrile ether resin or bisphenol P diphthalonitrile either resin. Compositions are also provided, including a primary amine curative and the bisphenol M diphthalonitrile ether resin or the bisphenol P diphthalonitrile either resin. Further, polymerized products are provided of the bisphenol M diphthalonitrile ether resin or the bisphenol P diphthalonitrile either resin. In addition, a method of making a polymerized network is provided. A two component system is further provided, including a curative in one of the components and the bisphenol M diphthalonitrile ether resin or the bisphenol P diphthalonitrile either resin in the other component. In addition, a resin blend is provided, including a blend of at least two of bisphenol M diphthalonitrile ether resin, bisphenol P diphthalonitrile either resin, or bisphenol T diphthalonitrile ether resin.

Polyhemiaminal (PHA) and polyhexahydrotriazine (PHT) materials are modified by 1,4 conjugate addition chemical reactions to produce a variety of molecular architectures comprising pendant groups and bridging segments. The materials are formed by a method that includes heating a mixture comprising solvent(s), paraformaldehyde, aromatic amine groups, aliphatic amine Michael donors, and Michael acceptors, such as acrylates. The reaction mixtures may be used to prepare polymer pre-impregnated materials and composites containing PHT matrix resin.

A hard-mask forming composition including a resin (P1) containing a structural unit (u11) represented by General Formula (u11-1), and a resin (P2) containing an aromatic ring and a polar group, provided that the resin (P1) is excluded from the resin (P2), wherein R.sup.11 represents an aromatic hydrocarbon group which may have a substituent, Rp.sup.11 is an aldehyde group, a group represented by Formula (u-r-1), a group represented by Formula (u-r-2), or a group represented by Formula (u-r-3)

##STR00001##

The present disclosure provides a resin blend containing a blend of a first phthalonitrile resin, a filler, and a bisphenol M diphthalonitrile ether resin. Suitable fillers include at least one of nanoparticles, microparticles, or fibers. The present disclosure also provides an article including a polymerization product of such a resin blend. The resin blends can be prepared at lower temperatures than phthalonitrile resin blends without a bisphenol M diphthalonitrile ether resin.

The present disclosure provides a resin blend containing a blend of a first phthalonitrile resin, a filler, and a bisphenol M diphthalonitrile ether resin. Suitable fillers include at least one of nanoparticles, microparticles, or fibers. The present disclosure also provides an article including a polymerization product of such a resin blend. The resin blends can be prepared at lower temperatures than phthalonitrile resin blends without a bisphenol M diphthalonitrile ether resin.

The present invention provides a novel cyanic acid ester compound that has excellent solvent solubility and provides a cured product having a low rate of thermal expansion and having excellent flame retardance and heat resistance, and a resin composition containing the compound, etc. The present invention provides a resin composition whose cured product obtained by curing can achieve a printed circuit board excellent in peel strength, glass transition temperature, rate of thermal expansion, rate of water absorption, and thermal conductivity. The present invention provides a resin composition whose cured product obtained by curing can achieve a printed circuit board not only having a high glass transition temperature and low thermal expansibility but being also excellent in flexural modulus and thermal conductivity. The cyanic acid ester compound is represented by the general formula (1):

##STR00001##

Methods of preparing poly(cyanocinnamate)s are provided, with those involving mild conditions and resulting in a soluble polymer that is stable at room temperature and can be coated onto microelectronic substrates. The polymer includes at least one bis(cyanoacetate) monomer and at least one aromatic dialdehyde monomer. The polymer exhibits good thermal and structural properties and high absorbance in the UV range.

A resin blend is provided including a blend of resorcinol diphthalonitrile ether resin and a bisphenol M diphthalonitrile ether resin. Another resin blend is provided including a blend of resorcinol diphthalonitrile ether resin and a bisphenol T diphthalonitrile ether resin. The resin blends prior to cure have more favorable processing and curing properties compared to the resorcinol diphthalonitrile resin alone, enabling greater ease in manufacturing.

A thermoset material obtained from a curing by heat treatment of a resin that can be obtained by polycondensation, in basic medium, of at least one phthalonitrile compound bearing on its benzene ring at least one hydroxyl group.