A photosensitive resin composition is provided comprising (A) 100 pbw of a phenolic hydroxyl group-containing resin, and (B) 0.1-18 pbw of an epoxy additive in the form of a compound containing 1-8 epoxy groups per molecule, containing nitrogen, sulfur or phosphorus, and having a molecular weight of 50-6,000. The composition has an improved bonding force to metal wirings.

The present invention relates to a bio-based polyol comprising a thiol-epoxy reaction product of an epoxidized nut or seed oil derivative, and a thiol-containing reactant. The bio-based polyol of the present invention can then be combined with a diisocyanate or a polymeric isocyanate to create a polyurethane material.

An ion exchange resin and a method for preparing the same are provided. An ion exchange resin is formed by a composition, and the composition includes a crosslinking agent and an ionic compound with sulfonate ions. The ionic compound with sulfonate ions is formed by reacting an epoxy resin with an ionic monomer with sulfonate ions or an ionic polymer having sulfonate ions. The ionic monomer and the ionic polymer each has a hydroxyl group or an acid group at the ends. The ionic monomer or the ionic polymer is 40 to 80 parts by weight, and the epoxy resin is 15 to 25 parts by weight, based on 100 parts by weight of the ion exchange resin. An ion exchange resin with a network structure is formed after the ionic compound with sulfonate ions reacts with the crosslinking agent.

Provided is a sealant sheet formed in a sheet shape. The sealant sheet comprises an epoxy group-containing polysulfide polymer (AB) having two or more epoxy groups per molecule, a thiol compound (C) having two or more thiol groups per molecule, and a photobase generator (D); or a thiol group-containing polysulfide polymer (AC) having two or more thiol groups per molecule, an epoxy compound (B) having two or more epoxy groups per molecule, and a photobase generator (D).

Provided is a sealant sheet formed in a sheet shape. The sealant sheet comprises an epoxy group-containing polysulfide polymer (AB) having two or more epoxy groups per molecule, and a thiol compound (C) having two or more thiol groups per molecule. In the sealant sheet, sulfur atoms in organic components of the sealant sheet has a weight fraction of 32.0% or higher and 36.0% or lower.

An ion exchange resin and a method for preparing the same are provided. An ion exchange resin is formed by a composition, and the composition includes a crosslinking agent and an ionic compound with sulfonate ions. The ionic compound with sulfonate ions is formed by reacting an epoxy resin with an ionic monomer with sulfonate ions or an ionic polymer having sulfonate ions. The ionic monomer and the ionic polymer each has a hydroxyl group or an acid group at the ends. The ionic monomer or the ionic polymer is 40 to 80 parts by weight, and the epoxy resin is 15 to 25 parts by weight, based on 100 parts by weight of the ion exchange resin. An ion exchange resin with a network structure is formed after the ionic compound with sulfonate ions reacts with the crosslinking agent.

The present invention relates to a bio-based polyol comprising a thiol-epoxy reaction product of an epoxidized nut or seed oil derivative, and a thiol-containing reactant. The bio-based polyol of the present invention can then be combined with a diisocyanate or a polymeric isocyanate to create a polyurethane material.

A photosensitive resin composition is provided comprising (A) 100 pbw of a phenolic hydroxyl group-containing resin, and (B) 0.1-18 pbw of an epoxy additive in the form of a compound containing 1-8 epoxy groups per molecule, containing nitrogen, sulfur or phosphorus, and having a molecular weight of 50-6,000. The composition has an improved bonding force to metal wirings.

Provided is a sealant sheet formed in a sheet shape. The sealant sheet comprises an epoxy group-containing polysulfide polymer (AB) having two or more epoxy groups per molecule, and a thiol compound (C) having two or more thiol groups per molecule. In the sealant sheet, sulfur atoms in organic components of the sealant sheet has a weight fraction of 32.0% or higher and 36.0% or lower.