A photosensitive resin composition is provided comprising (A) 100 pbw of a phenolic hydroxyl group-containing resin, and (B) 0.1-18 pbw of an epoxy additive in the form of a compound containing 1-8 epoxy groups per molecule, containing nitrogen, sulfur or phosphorus, and having a molecular weight of 50-6,000. The composition has an improved bonding force to metal wirings.

Provided is a composition comprising one or more epoxy phosphate esters wherein the structure comprises two or more polyester linkages. Also provided is a method of making the epoxy phosphate esters that comprises reacting one or more epoxy-terminated polyesters with one or more phosphoric acids. Further provided is an adhesive composition that comprises one or more epoxy phosphate esters, one or more multifunctional isocyanate prepolymers, and one or more multifunctional isocyanate-reactive compounds.

To show a curable resin composition suitable as an adhesive for bonding a structural material having good adhesiveness to aluminum in particular. A curable resin composition containing (A1) phosphoric acid-modified epoxy resin obtained by reacting a phosphoric acid (a1) and an epoxy compound (a2) (excluding a urethane-modified epoxy resin and a urethane-modified chelate epoxy resin); and (A2) an epoxy resin (excluding component (A1)); (B) a block urethane; and (C) a latent curing agent, in which a phosphorus content in a total mass of component (A1) and component (A2) is 0.01 to 2.0% by mass.

A photosensitive resin composition is provided comprising (A) 100 pbw of a phenolic hydroxyl group-containing resin, and (B) 0.1-18 pbw of an epoxy additive in the form of a compound containing 1-8 epoxy groups per molecule, containing nitrogen, sulfur or phosphorus, and having a molecular weight of 50-6,000. The composition has an improved bonding force to metal wirings.

To show a curable resin composition suitable as an adhesive for bonding a structural material having good adhesiveness to aluminum in particular. A curable resin composition containing (A1) phosphoric acid-modified epoxy resin obtained by reacting a phosphoric acid (a1) and an epoxy compound (a2) (excluding a urethane-modified epoxy resin and a urethane-modified chelate epoxy resin); and (A2) an epoxy resin (excluding component (A1)); (B) a block urethane; and (C) a latent curing agent, in which a phosphorus content in a total mass of component (A1) and component (A2) is 0.01 to 2.0% by mass.

The present invention is directed to an electrodepositable coating composition comprising a main vehicle comprising a phosphatized epoxy resin, a plasticizer, and a curing agent, wherein the main vehicle comprises a low-VOC main vehicle. The present invention is also directed to coatings and coated substrates.

The present invention is directed to an electrodepositable coating composition comprising a main vehicle comprising a phosphatized epoxy resin, a plasticizer, and a curing agent, wherein the main vehicle comprises a low-VOC main vehicle. The present invention is also directed to coatings and coated substrates.

A coating composition comprising a polyglycidyl ether of a 2,2-biphenol that is substantially free of bisphenol A, bisphenol F and their derivatives and residues is disclosed. Food packages coated at least in part with such coatings are also disclosed.

Provided is a composition comprising one or more epoxy phosphate esters wherein the structure comprises two or more polyester linkages. Also provided is a method of making the epoxy phosphate esters that comprises reacting one or more epoxy-terminated polyesters with one or more phosphoric acids. Further provided is an adhesive composition that comprises one or more epoxy phosphate esters, one or more multifunctional isocyanate prepolymers, and one or more multifunctional isocyanate-reactive compounds.

A coating composition comprising a resinous binder and up to 10 percent by weight of the reaction product of (i) a phosphorus acid, and (ii) a polyglycidyl ether of cyclohexane dimethanol. The compositions are useful for coating containers of all sorts, such as food and beverage containers, and the reaction product provides enhanced adhesion of the coating to the substrate. The compositions can be formulated to be substantially free of bisphenol A (BPA) and derivatives thereof such as bisphenol A diglycidyl ether (BADGE).