Patent classifications
C08G59/1466
COMPOSITION INCLUDING UNSATURATED POLYESTER RESIN, EPOXY RESIN, AND PHOTOINITIATOR AND METHOD OF USING THE SAME
The composition includes a polyester resin comprising at least one α,β-unsaturated ester group, an epoxy resin, a compound comprising at least one hydroxyl group; and a photoinitiator that generates acid on exposure to actinic radiation. A method of repairing a damaged surface using the composition is also described.
QUANTUM DOT COMPOSITE MATERIAL, AND OPTICAL FILM AND BACKLIGHT MODULE USING SAME
A quantum dot composite material, and an optical film and a backlight module using the same are provided. The quantum dot composite material includes a curable polymer and a plurality of quantum dots dispersed in the curable polymer. Based on the total weight of the curable polymer being 100%, the curable polymer includes 15 wt % to 40 wt % of monofunctional group acrylic monomer, 15 wt % to 40 wt % of multifunctional group acrylic monomer, 5 wt % to 35 wt % of mercaptan functional group monomer, 1 wt % to 5 wt % of photoinitiator, 10 wt % to 30 wt % of acrylic oligomer, and 5 wt % to 25 wt % of scattering particles.
Method for improving corrosion resistance of vinyl ester resin
A method for improving corrosion resistance of vinyl ester resin is provided, which belongs to the technical field of polymer materials. The method includes adding vinyl ester resin into a MXene nanosheet solution and evaporating the solvent; then adding cobalt isooctoate promoter and butanone peroxide initiator in sequence, standing for curing after defoaming, and then heating.
EPOXY RESIN COMPOSITION, PREPREG, AND FIBER REINFORCED COMPOSITE MATERIAL
An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications and is excellent in elastic modulus, strength, and pot life.
The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (3): [A]: epoxy resin [B]: polyamine curing agent, and [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin, and (1): at least a part of the component [C] has two or more alcoholic hydroxyl groups in the molecule. (2): the ratio C/E of the amount by mole, E, for epoxy groups of the component [A] to the amount by mole, C, of the component [C] satisfying the condition (1) is 0.01 or more and 0.20 or less. (3): the viscosity at 70° C. for 2 hours is 5.0 times or less the initial viscosity at 70° C.
Curable Resin, Curable Resin Composition, Cured Product, Electronic Device, Laminated Board Material, Electronic Component Encapsulant, and Method for Producing Curable Resin
A curable resin represented by General Formula (1). In General Formula (1), R.sub.1 each independently represent a monovalent substituent (an alkyl group, an alkoxy group, a fluorine atom, and the like), m is 0 to 4, n is 0 to 40, and R.sup.2's are each independently a monovalent group including a polymerizable functional group.
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NETWORK TOUGHENING OF ADDITIVELY MANUFACTURED, HIGH GLASS TRANSITION TEMPERATURE MATERIALS VIA SEQUENTIALLY CURED, INTERPENETRATING POLYMERS
Resins and formulations of individual monomers bearing both vinyl ester and epoxy functionality were either synthesized or formulated such that vinyl ester components capable of polymerizing by photo-induced, free radical polymerization were mixed with step-growth epoxy-amine systems, facilitating sequential cure. The vinyl ester component was photopolymerized using vat photopolymerization (VPP). Additionally, the preparation of bio-based photo curable thermosetting resins that have tailorable thermal and mechanical properties is provided. All monomers and polymers described herein are useful in a variety of applications, including additive manufacturing applications.
One Component Liquid Resin Composition
The present invention is directed to a liquid one component (1 K) composition comprising, based on the weight of the composition: from 10 to 90 wt.% of a) at least one epoxy resin; from 0.5 to 30 wt.% of b) at least one organoboron compound selected from tetrasubstituted borate salts of monovalent cations of tertiary amines; from 10 to 50 wt.% of c) at least one (meth)acrylamide monomer of Formula (VII):
POLYMERIZABLE THERMOSETTING RESINS FROM TALL OIL
Presently described are curable compounds and curable compositions. Thermosets including the curable compounds and curable compositions described herein are derived from bio-based components and have improved mechanical properties. The described compositions can also be applicable to rosin derivatives and fatty acid derivatives.
Acrylic polyol resins compositions
The invention relates to compositions of hydroxyl functional acrylic resins (acrylic polyols) comprising a mixture of α,α-branched alkane carboxylic glycidyl esters derived from butene oligomers characterized in that the sum of the concentration of the blocked and of the highly branched isomers is at least 50%, preferably above 60% and most preferably above 75% on total composition.
Preparation Of Thermoplastic Epoxidized Polymers And Thermosetting Materials From Triglycerides
A method i for forming an epoxidized polymer is provided. The method may include mixing an epoxidized plant oil with a synthetic epoxy resin and crosslinking the epoxidized plant oil and the synthetic epoxy resin using a curing agent. The epoxidized plant oil may be formed via: converting plant oil triglycerides to fatty amide alcohols via aminolysis using primary or secondary amines, converting the fatty amide alcohols to epoxidized fatty amide alcohols, and reacting the epoxidized fatty amide alcohols with vinyl monomers to obtain epoxidized plant oil monomers.