Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

A curable epoxy composition comprising a polyvalent epoxy compound (A) having a biphenyl structure and/or condensed polycyclic structure, a phosphorus-containing epoxy compound (B) having a structure shown by the following formula (1) or (2), and a triazine structure-containing phenol resin (C) and a film, laminated film, prepreg, laminate, cured article, and composite article obtained using the same are provided.

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Where, in the formula (1), each of R.sup.1 and R.sup.2 respectively independently represents a hydrocarbon group having 1 to 6 carbon atoms, the pluralities of R.sup.1 and R.sup.2 may be the same or different, and each of “m” and “n” respectively independently represents an integer of 0 to 4, and where, in the formula (2), each of R.sup.1 and R.sup.2 respectively independently represents a hydrocarbon group having 1 to 6 carbon atoms, the pluralities of R.sup.1 and R.sup.2 may be the same or different, and each of “m” and “n” respectively independently represents an integer of 0 to 5.

A polymer formed of at least one phenylphosphine oxide functional epoxide crosslinked with at least one phenylphosphine oxide amine such that the polymer has phosphorous concentrations of at least about 8 percent by weight, at least about 8.5 percent by weight, or any value or range of values therebetween.

This invention provides a coating composition that contains an aromatic adhesion promoter. Containers and other articles comprising the coatings and methods of making such containers and other articles are also provided. The invention further provides compositions including the adhesion promoter, which have utility in a variety of coating end uses, including, for example, valve and pipe coatings.

A high-CTI and halogen-free epoxy resin composition for copper-clad plates and uses thereof is provided. The formula of the high-CTI and halogen-free epoxy resin composition for copper-clad plates comprises 100˜140 parts of halogen-free phosphorous epoxy resin, 10˜35 parts of dicyclopentadiene phenolic epoxy resin, 32˜60 parts of benzoxazine, 1˜5 parts of phenolic resin, 0.05˜0.5 parts of accelerants; and 25˜70 parts of fillers, by weight. The copper-clad plates, prepared according to embodiments of the present invention, can reach the requirements of high CTI (CTI≧500V), high heat resistance(Tg≧150 ° C., PCT, 2 h>6 min) and the level of flame retardance of UL-94 V0, and they are widely used in the electronic materials of electric machines, electric appliances, white goods and so on.

This invention relates to a flame-retardant epoxy resin, to a method of preparing the same, and to a flame-retardant epoxy resin composition including the same, and more specifically to a flame-retardant epoxy resin, which satisfies properties while improving flame retardancy by increasing the phosphorus content, to a method of preparing the same, and to a flame-retardant epoxy resin composition including the same.

An example method to prepare a prepreg is disclosed. In one embodiment, the method includes applying a mixture on a fibrous material and heating the mixture and the fibrous material to a temperature greater than about 225 degrees Celsius during a process of preparing the prepreg. The mixture includes an epoxy compound, a compound having a ring structure, and a crosslinking agent.

To show a curable resin composition suitable as an adhesive for bonding a structural material having good adhesiveness to aluminum in particular. A curable resin composition containing (A1) phosphoric acid-modified epoxy resin obtained by reacting a phosphoric acid (a1) and an epoxy compound (a2) (excluding a urethane-modified epoxy resin and a urethane-modified chelate epoxy resin); and (A2) an epoxy resin (excluding component (A1)); (B) a block urethane; and (C) a latent curing agent, in which a phosphorus content in a total mass of component (A1) and component (A2) is 0.01 to 2.0% by mass.

A thermoset epoxy resin, its preparing composition and making process are disclosed. In particular, the thermoset epoxy resin is glycidyl ether of diphenolic bis-carbamate and formed by curing a one component epoxy composition and has a general structure as shown in formula (1).

A resin composition contains an epoxy compound and a curing agent. The epoxy compound includes a phosphorus-containing epoxy compound having a phosphorus atom in its molecule. The curing agent includes a phosphorus-containing acid anhydride having a phosphorus atom and an acid anhydride group in its molecule.