An adhesion promoter comprises a reaction product of: a) a polyepoxide; b) an aminosilane represented by the formula HNR.sup.1R.sup.2. R.sup.1 and R.sup.2 independently represent —Z—SiL.sub.3. Each Z independently represents a divalent linking group having from 1 to 12 carbon atoms, and each L independently represents a hydrolyzable group; and c) an isocyanatosilane represented by the formula O═C═N—Z—SiL.sub.3, wherein Z and L are as previously defined. The adhesion promoter may be used to treat a surface of a substrate such as an abrasive particle, which may be included in a resin-bond abrasive article.

An epoxy-functionalized polyorganosiloxane toughener providing toughening properties for thermosetting resins is described. The epoxy-functionalized polyorganosiloxane toughener is an epoxy-functionalized siloxane polyether with a siloxane backbone, at least one epoxy-containing alkyl chain, and at least one alkoxyl polyether chain, each said at least one epoxy-containing alkyl chain and at least one alkoxyl polyether chain grafted to the siloxane backbone. Also disclosed is a thermosetting resin-based composition comprising the epoxy-functionalized polyorganosiloxane toughener of claim 1 and at least one of an epoxy resin, a hardener, and an accelerator.

A composition of the present disclosure includes an aqueous dispersion of epoxy resin particles. The epoxy resin particles include at least two 1,2-epoxide groups. The composition further includes one or more anti-adhesive agents, one or more anti-microbial agents, or a combination of one or more anti-adhesive agents and one or more anti-microbial agents.

Provided is an epoxy resin composition that can achieve excellent low dielectric characteristics and high adhesive strength to metal. Specifically, provided is an epoxy resin composition comprising organic fine particles and an epoxy resin having a specific structure.

Provided is a resin composition having excellent dielectric characteristics, i.e., low dielectric characteristics, in the high-frequency region, and excellent dielectric characteristics, i.e., low dielectric characteristics, under high humidity, and having practical adhesion to metal and resin substrates. More specifically, provided is a resin composition comprising an acid-modified polyolefin, an epoxy resin, and an inorganic filler, wherein a cured product of the resin composition has a dielectric loss tangent of 0.003 or less at a frequency of 10 GHz at 25° C. after storage for 168 hours under conditions of 85° C. and 85% RH (relative humidity).

A curable composition is provided that includes an alkenyl phenol A, an epoxy-modified silicone B, an epoxy compound C other than the epoxy-modified silicone B, and a thermosetting resin E, in which the thermosetting resin E contains one or more selected from the group consisting of a maleimide compound, a cyanate ester compound, a phenolic compound, an alkenyl-substituted nadimide compound, and an epoxy compound.

A photocurable liquid silicone composition, that has low viscosity that facilitates injection into a small gap, cures quickly by irradiating with a high energy beam such as ultraviolet light or the like, has a refractive index after curing that is high not only in a visible region but also in an infrared region, in which composition design is possible to provide an arbitrarily low dielectric constant, and is particularly useful as a material for a device using an infrared LED light source, is provided. The composition comprises: (A) one or more type of an organosilane or organopolysiloxane having on average one or more photoreactive functional groups and two or more monovalent functional groups selected from aromatic groups with 6 to 12 carbon atoms and aralkyl groups with 7 to 12 carbon atoms in a molecule and having 1 to 5 silicon atoms, and optionally further comprising (C) a curing catalyst.

A curable composition containing an alkenyl phenol A, an epoxy-modified silicone B, and an epoxy compound C other than the epoxy-modified silicone B.

An epoxy resin represented by the following formula (1) ##STR00001## wherein R.sup.1 represents an alkylene group having 2 to 6 carbon atoms and optionally containing an ester or ether bond; R.sup.2 represents a monovalent aliphatic hydrocarbon group having 1 to 6 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; R.sup.3 represents an oxygen atom or a phenylene group; k represents 1 to 10 as an average value; m represents an integer of 0 to 2; n represents 0 to 10 as an average value; and a plurality of groups R.sup.1, R.sup.2, R.sup.3, k, or m present in the formula may be the same or different from each other.

Provided are alkoxysilylated epoxy compounds, a composite of which exhibits good heat resistance properties, low CTE and increased glass transition temperature, and a cured product thereof exhibits good flame retardancy without requiring separate coupling agent, a method for preparing the same and a composition and a cured product including the same. An alkoxysilylated epoxy compound including an epoxy group and at least one alkoxysilyl group of an S1 substituent selected from Formulae S11 to S15 or an S2 substituent selected from Formulae S21 to S25; a method for preparing the same by epoxy ring-opening reaction of starting material and alkoxysilylation, an epoxy composition including the epoxy compound, and a cured product and a use of the composition, are provided. Since chemical bonds may be formed between alkoxysilyl group and filler and between alkoxysilyl groups, chemical bonding efficiency of the composite may be improved.