Patent classifications
C08G59/308
Fluorine-containing ether compound, lubricant for magnetic recording medium, and magnetic recording medium
A fluorine-containing ether compound according to the present invention is a fluorine-containing ether compound represented by the following General Formula (1). ##STR00001##
Antimony free flame-retarded epoxy compositions
A curable epoxy composition suitable for surface application, comprising one or more epoxy resin (s); 2, 4, 6-tribromophenyl end-capped tetrabromobisphenol A epoxy-based flame retardant; and phosphorus-containing compound selected from the group consisting of one or more of: ammonium polyphosphate; resorcinol bis (diphenyl phosphate); and liquid alkylated triphenyl phosphate ester. The composition is substantially Sb.sub.2O.sub.3-free.
Curable Resin, Curable Resin Composition, Cured Product, Electronic Device, Laminated Board Material, Electronic Component Encapsulant, and Method for Producing Curable Resin
A curable resin represented by General Formula (1). In General Formula (1), R.sub.1 each independently represent a monovalent substituent (an alkyl group, an alkoxy group, a fluorine atom, and the like), m is 0 to 4, n is 0 to 40, and R.sup.2's are each independently a monovalent group including a polymerizable functional group.
##STR00001##
ANTIMONY FREE FLAME-RETARDED EPOXY COMPOSITIONS
A curable epoxy composition suitable for surface application, comprising one or more epoxy resin(s); 2,4,6-tribromophenyl end-capped tetrabromobisphenol A epoxy-based flame retardant; and phosphorus-containing compound selected from the group consisting of one or more of: ammonium polyphosphate; resorcinol bis (diphenyl phosphate); and liquid alkylated triphenyl phosphate ester. The composition is substantially Sb.sub.2O.sub.3-free.
Novolak Resin, Epoxy Resin, Photosensitive Resin Composition, Curable Resin Composition, Cured Substance, Electronic Device, Production Method for Novolak Resin, and Production Method for Epoxy Resin
A novolak resin including a partial structure represented by —C(CF.sub.3)H—. In addition, there are provided a photosensitive resin composition containing the above-described novolak resin and a photosensitizing agent. In addition, there is provided an epoxy resin having a partial structure represented by —C(CF.sub.3)H—. In addition, there is provided a curable resin composition containing the novolak resin or the epoxy resin. In addition, there is provided a cured substance obtained by curing the composition. In addition, there is provided a production method for a novolak resin, including reacting an aromatic compound with fluoral in a presence of an acid catalyst to produce a novolak resin having a partial structure represented by —C(CF.sub.3)H—. Further, there is provided a production method for an epoxy resin, including an epoxidation step of reacting a novolak resin having a partial structure represented by —C(CF.sub.3)H— with epihalohydrin in a presence of a base.
Fluorine-modified epoxy acrylic resin, UV-curable varnish and method for preparing the same, and method for coating the varnish on a substrate
The present invention discloses a fluorine-modified epoxy acrylic resin, an UV-curable varnish and a method for preparing the same, and a method for coating the varnish on a substrate. The fluorine-modified epoxy acrylic resin is prepared by a process including the following steps: generating an epoxy acrylic resin via a ring-opening esterification reaction between an unsaturated mono-carboxylic acid and at least one epoxy group in an epoxy resin; and generating an epoxy acrylic resin containing fluorinated side groups via an esterification reaction between a fluorocarboxylic acid or a fluorocarboxylic acid anhydride and at least one hydroxy group in the epoxy acrylic resin. The UV-curable varnish according to the invention is prepared based on the fluorine-modified epoxy acrylic resin. When the varnish is applied to the surface of a substrate, at least one performance of the material, thereby the service life of the material itself may be improved.
Epoxy resin blend
An example method to prepare a prepreg is disclosed. In one embodiment, the method includes applying a mixture on a fibrous material and heating the mixture and the fibrous material to a temperature greater than about 225 degrees Celsius during a process of preparing the prepreg. The mixture includes an epoxy compound, a compound having a ring structure, and a crosslinking agent.
THERMALLY EXPANDABLE FIRE RESISTANT RESIN COMPOSITION
This invention relates to a thermally expandable fire-resistant resin composition comprising a resin component in an amount of 100 parts by weight, thermally expandable graphite in an amount of 3 to 300 parts by weight, and an inorganic filler in an amount of 2 to 200 parts by weight, wherein the thermally expandable graphite has an average aspect ratio of 20 or more.
Thermoset epoxy resin, its preparing composition and making process thereof
A thermoset epoxy resin, its preparing composition and making process are disclosed. In particular, the thermoset epoxy resin is glycidyl ether of diphenolic bis-carbamate and formed by curing a one component epoxy composition and has a general structure as shown in formula (1).
EPOXY RESIN, RESIN COMPOSITION, RESIN SHEET, RESIN CURED PRODUCT, RESIN SUBSTRATE AND MULTILAYER SUBSTRATE
An epoxy resin having end groups each having an epoxy group that are disposed at both ends respectively, and between the end groups, either or both of a first structure in which an aromatic cyclic group, an ether oxygen, a methylene group, an aromatic cyclic group, a methylene group, an ether oxygen and an aromatic cyclic group are bonded together in this order and a second structure in which an aromatic cyclic group, a methylene group, an ether oxygen, an aromatic cyclic group, an ether oxygen, a methylene group and an aromatic cyclic group are bonded together in this order.