An epoxy compound, composition and cured product thereof are provided. The epoxy compound has a structure represented by Formula (I)

##STR00001##

wherein R.sup.1 and R.sup.2 are each independently cyano group, isocyanate group, oxiranyl, methyloxiranyl group, glycidyl group, methylglycidyl group, epoxypropyl group, oxetanyl group, oxetanemethyl group, or C.sub.1-C.sub.10 alkoxy group; Z is —O—,

##STR00002##

R.sup.3 and R.sup.4 are each independently hydrogen, fluorine, methyl, fluoromethyl, or ethyl; n and m are each independently 3, 4, 5, 6, 7, 8, 9, or 10; and i and j are each independently 1, 2, or 3.

Provided is a thermosetting resin composition which achieves both high heat resistance and high bending strength as a fiber-reinforced composite material, and also has rapid curability that enables high cycle press forming, thermal stability, and storage stability. The thermosetting resin composition of the present invention is a thermosetting resin composition comprising an epoxy resin, an epoxy resin curing agent, an imidazole compound, and an epoxy resin curing accelerator, in which the epoxy resin curing agent is dicyandiamide or a derivative thereof, and the epoxy resin curing accelerator comprises a urea derivative having two or more dimethylureido groups in a molecule.

An aliphatic epoxy-terminated polysulfide polymer has the formula R″—CHOH—CH2-S—R—(Sy-R)t-S—CH2-CHOH—R″ and is formed by a process, where each R is independently chosen from branched alkanediyl or branched arenediyl groups and groups with the structure —(CH2)a-O—(CH2)b-O—(CH2)c- and about 0 to about 20% of the number of R-groups are branched alkanediyl or branched arenediyl groups and about 80 to about 100% of the number of R-groups have the structure —(CH2)a-O—(CH2)b-O—(CH2)c-, where t is from about 1 to about 60, y is an average value of from about 1.0 to about 2.5, b is an integer value of from about 1 to about 8, and a and c are independently integers from about 1 to about 10, and where each R″ is independently a particular radical where, m, n, o, p, q and r independently have a value of from about 1 to about 10.

Epoxide functionalized polyaromatic feedstocks and processes for their preparation are described. The processes involve functionalizing polyaromatic hydrocarbon molecules and/or polyheterocyclic molecules present in petroleum or petrochemical streams with epoxide. The epoxide functionalized poly aromatic feedstock can be further treated so as to effect oligomerization or polymerization. The oligomers or polymers may be thermoplastic or thermoset materials and may find use in, for example, infrastructure applications, composites, fillers, fire retardants and 3-D printing materials.

Provided is a thermosetting resin composition which achieves both high heat resistance and high bending strength as a fiber-reinforced composite material, and also has rapid curability that enables high cycle press forming, thermal stability, and storage stability. The thermosetting resin composition of the present invention is a thermosetting resin composition comprising an epoxy resin, an epoxy resin curing agent, an imidazole compound, and an epoxy resin curing accelerator, in which the epoxy resin curing agent is dicyandiamide or a derivative thereof, and the epoxy resin curing accelerator comprises a urea derivative having two or more dimethylureido groups in a molecule.

Provided is a thermosetting resin composition which achieves both high heat resistance and high bending strength as a fiber-reinforced composite material, and also has rapid curability that enables high cycle press forming, thermal stability, and storage stability. The thermosetting resin composition of the present invention is a thermosetting resin composition comprising an epoxy resin, an epoxy resin curing agent, an imidazole compound, and an epoxy resin curing accelerator, in which the epoxy resin curing agent is dicyandiamide or a derivative thereof, and the epoxy resin curing accelerator comprises a urea derivative having two or more dimethylureido groups in a molecule.

The present invention provides an epoxy resin composition including tetraglycidyl-3,4-diaminodiphenyl ether, and a curing agent composed of an aromatic polyamine having a predetermined substituent in at least one ortho position with respect to an amino group, a predetermined aromatic epoxy resin having a glycidyl ether group, or an epoxy resin having a predetermined epoxy equivalent weight.

Provided is an epoxy resin composition that has excellent electric characteristics (particularly low dielectric tangent), and that can achieve high adhesive strength to metal. Specifically, provided is an epoxy resin composition comprising an active ester compound and an epoxy resin having a specific structure.

Provided are a 2-mercaptobenzothiazole modified graphene oxide anti-corrosion coating and a preparation method thereof, the raw materials of which comprising, by mass ratio: 2-mercaptobenzothiazole modified graphene oxide 5-20; a matrix resin 30-70; a leveling agent 0.5-1.0; a defoamant 0.5-1.0; a dispersant 0.5-1.0; a film-forming additive 0.5-1.0; a diluent 20-35. The method for the 2-mercaptobenzothiazole modified graphene oxide comprises first reacting graphene oxide with cyanuric chloride, then reacting with 2-mercaptobenzothiazole.

Degradable sulfur-containing hyperbranched epoxy resin and a preparation method thereof. The preparation method comprises initiating a reaction of a mercaptocyclotriazine compound and a binary olefin by ultraviolet light to prepare a mercapto hyperbranched polymer; then reacting with glycidyl methacrylate to obtain a degradable sulfur-containing hyperbranched epoxy resin of which the molecular weight is about 3,000-35,400 g/mol. After the degradable sulfur-containing hyperbranched epoxy resin is cured, a cyclotriazine structure can be completely degraded within 1.5 h in a phosphoric acid solution at the temperature of 80 DEG C, thus realizing the recycle of the epoxy resin. The invention is simple in process, low in reaction temperature, rapid in reaction and high in yield, the sulfur-containing structure lowers curing temperature and realizes rapid curing, and cyclotriazine structure has a degradation function, and is expected to be used in the fields of strengthening and toughening of the epoxy resins, solvent-free coatings, electronic packaging.