An epoxy resin composition comprises the following components [A] to [E]: [A] epoxy resin, [B] amine-type curing agent, [C] cure accelerator, and [D] red phosphorus. The epoxy resin composition contains, per 100 mass parts for the total amount of [A], 25-45 mass parts of [A1] a liquid bisphenolic epoxy resin and 20-40 mass parts of [A2] a phenol novolac-type epoxy resin, and has a content ratio of [E] to [D] ([E]/[D]) of at least 1. Provided are a light-weight fiber-reinforced composite material that exhibits an excellent flame retardancy and mechanical properties and does not produce halogen gas during combustion, and an epoxy resin composition that has a viscosity suitable for obtaining the fiber-reinforced composite material as well as prepregs.

The present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a thermally curable resin; a thermal curing initiator for the thermally curable resin; a radiation self-polymerizable multi-functional compound comprising a polyether oligomeric backbone and at least one free-radical (co)polymerizable reactive group at each terminal position of the oligomer backbone; and a free-radical polymerization initiator for the radiation self-polymerizable multi-functional compound.

This disclosure generally provides compositions with improved thermal aging resistance, crack resistance and flux compatibility, wherein the resin composition comprising: (a) an epoxy resin comprising a compound having two or more epoxy groups per molecule; (b) a binder comprising a compound having at least one carboxyl group per molecule; (c) a photopolymerization initiator; and (d) a filler composition comprising silica, talc and wollastonite.

Disclosed is a polyurethane-modified epoxy resin composition capable of satisfying both high toughness and high elasticity. This epoxy resin composition is an epoxy resin composition, in which (A) a polyurethane-modified epoxy resin having a polycarbonate structure in the molecule and having a urethane modification rate of 20 to 60% by weight, (B) a non-polyurethane-modified epoxy resin that is liquid at 30° C., (C) a solid epoxy resin having a glass transition temperature or melting point of 50° C. or higher and (D) an amine-based curing agent that is dicyandiamide or a derivative thereof are as essential components, and 20.0 to 50.0% by weight of (A), 0.1 to 50.0% by weight of (B) and 0.1 to 50.0% by weight of (C) are contained relative to the total of (A) to (D).

The present invention relates to a thermosetting material for use in a 3D printing process comprising: a) at least one epoxy resin A, b) at least one elastomer-modified epoxy resin B, c) at least one resin C with a dynamic viscosity of below 4 Pas at 150° C., d) at least one of a curing agent D capable of reacting with A, B and optionally C, e) and optionally additional compounds,
wherein the glass transition temperature of the uncured material is at least 30° C., preferably at least 40° C. as measured with DSC at a heating rate of 20° C./min.

The invention further relates to a method of producing a cured 3D thermoset object and the use of the above-mentioned thermosetting material in a 3D printing process.

A high-temperature-resistant insulating polymer composite is provided, including the following components in parts by mass: 3-12 parts of cyanate ester resin, 3-20 parts of epoxy resin, 5-15 parts of an inorganic filler, 0.1-2 parts of an epoxy resin curing agent, 0.0001-0.005 parts of a curing accelerant, and 0.1-2 parts of a dispersant. A glass transition temperature of the cured high-temperature-resistant insulating polymer composite is higher than 120° C.

Compositions and methods are described which provide a protective coating to coils or springs via a polymerization process such as by covalent bonding that includes grafting to the metal surface.

The insulation adhesive film material is composed of a three-layer structure, its insulation polymer composite is supported by a thin film material, and a surface of the insulation polymer composite is covered with a layer of protective film. A release force of a support film is 25-60 μN/mm, and a release force of the protective film is 2-60 μN/mm. A thickness of the insulation polymer composite is 1-300 μm. The insulation adhesive film material is prepared as follows: after a high molecular polymer, an inorganic filler, a high molecular polymer curing agent, a molding auxiliary agent, and a solvent are mixed, dispersion technologies such as ball milling, sand milling, ultrasound are conducted to prepare an electronic paste of the insulation polymer composite, and the electronic paste is then applied to a surface of a support film material, and bonded with the protective film to form the insulation adhesive film material.

An expandable structural adhesive film for bonding metal parts. The adhesive film comprises at least one first epoxy compound; at least one epoxy curing agent; at least one blowing agent; at least one film-forming agent; and at least one impact modifier. The structural adhesive film exhibits an elongation at break of at least 300% according to tensile test DIN EN ISO 527 and a free expansion rate according to EN 2667-3 of at least 45%.

A one-part primer composition is provided. The one-part primer composition includes a first epoxy resin that is a liquid under ambient conditions a particulate corrosion inhibitor present in an amount of from 5 wt % to 30 wt % relative to the overall weight of the composition excluding carrier solvents and water, a curative comprising a primary aromatic amine, a silane coupling agent, a carrier solvent; and water homogeneously mixed with the carrier solvent and present in an amount sufficient to hydrolyze the silane coupling agent while preserving solubility of the first epoxy resin and curative in the carrier solvent/water mixture. The corrosion inhibitor is pre-dispersed in a liquid epoxy to break the agglomeration of the inhibitors, mitigate settling of the pigment and improve primer performance.