Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

Epoxy curing agents are disclosed having an epoxy curing agent comprising at least one room temperature ionic liquid salt, the room temperature ionic liquid salt being a reaction product of (a) at least one polyalkylene polyamine compound represented by formula (I):

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wherein x, y, and z are integers of 2 and 3, m and n and integers of 1-3; and (b) an organic acid having pKa (the negative of the logarithm of the acid dissociation constant) less than 6. The liquid salt is a stable liquid at a temperature greater than 15° C. Curable epoxy-based compositions including the curing agent and articles formed by the curable epoxy-based compositions are also disclosed.

Embodiments include curable compositions including an epoxy resin and a hardener component including a polymer having first constitutional unit, a second constitutional unit, and a third constitutional unit, where the epoxy group to the second constitutional unit has a molar ratio in a range of 0.5:1 to 5:1. Embodiments include prepregs that include a reinforcement component and the curable composition and an electrical laminate formed with the curable composition.

The instant invention provides a curable composition suitable for electrical laminate applications, and electrical laminates made therefrom. The curable composition suitable for electrical laminate applications according to the present invention comprises a) an epoxy resin; and b) a hardener compound for curing with the epoxy resin; and c) titanium dioxide.

Disclosed is an antifogging film-forming material obtained by reacting, in the presence of a quaternary ammonium salt or quaternary phosphonium salt, a copolymer represented by a certain general formula with a multifunctional epoxy compound having a solubility of 40-100 mass % in 25° C. water. The antifogging film-forming material is characterized by having a weight average molecular weight of 100,000-5,000,000. With this material, it becomes possible to obtain an antifogging article excellent in antifogging property, heat resistance, chemical resistance and abrasion resistance.

The present invention relates to a powder coating composition for preparing a dielectric coating. The powder coating composition includes: (a) an epoxy functional polymer; (b) a poly-carboxylic acid functional polyester polymer reactive with the epoxy functional polymer and which has an acid value of less than 100 mg KOH/g; and (c) a poly-carboxylic acid functional (meth)acrylate polymer reactive with the epoxy functional polymer. Further, if a colorant is present, the powder coating composition comprises 35 weight % or less of the colorant, based on the total solids weight of the coating composition.

A two-component adhesive includes agent A containing an epoxy resin and agent B containing a polymer having a crosslinkable silicon group and an epoxy resin curing agent, wherein agent A and/or agent B contain(s) a core-shell rubber particle, and a condensation catalyst for the crosslinkable silicon group. Another adhesive contains an epoxy resin, a core-shell rubber particle, a polymer having a crosslinkable silicon group, an epoxy resin curing agent, and a condensation catalyst for the crosslinkable silicon group, wherein a cured product of the adhesive has a breaking strength (tensile strength at rupture) of 5 MPa or more and an elongation at break (elongation at rupture) of 30% or more, and has storage elastic moduli at 1 Hz in tensile mode of 100 to 1000 MPa at 20° C. and 50 to 1000 MPa at 80° C.

The present invention provides aqueous compositions for making damage tolerant coatings comprising a blend of (i) from 2 to 30 wt. %, based on the total weight of solids in the composition, of an acid or anhydride functionalized polyolefin dispersion having an average particle size of from 0.2 to 5 microns, and (ii) a film forming dispersion of one or more epoxy resins chosen from epoxy resins having an epoxy equivalent weight (EEW) of from 150 to 4,000 having an average particle size of from 0.2 to 1.0 microns, wherein the polyolefin dispersion is stabilized with from 2 to 8 wt. %, based on the total weight of solids in the composition, one or more anionic surfactants, such as a sulfate containing surfactant, and, further wherein, the compositions have a pH of from 3 to 8.

The present invention relates to a powder coating composition for preparing a dielectric coating. The powder coating composition includes: (a) an epoxy functional polymer; (b) a poly-carboxylic acid functional polyester polymer reactive with the epoxy functional polymer and which has an acid value of less than 100 mg KOH/g; and (c) a poly-carboxylic acid functional (meth)acrylate polymer reactive with the epoxy functional polymer. Further, if a colorant is present, the powder coating composition comprises 35 weight % or less of the colorant, based on the total solids weight of the coating composition.

Provided are a sheet molding compound having good handleability and good reinforcing fiber filling properties; and a molded article having good mechanical properties and good heat resistance.

The sheet molding compound comprises a thermosetting resin composition and reinforcing fiber bundles, in which the thermosetting resin composition comprises an epoxy resin component (E) comprising a reaction product (1) of the following component (A) and the following component (B), and the following component (C). The molded article is an article obtained by press-molding the sheet molding compound.