C08G59/4276

CROSS-LINKED POLYMERIC MATERIALS AND ARTICLES

Reprocessable materials are provided that include a product of cross-linking a glycidyl methacrylate grafted high-density polyethylene (HDPE-g-GMA) with a polymacrolactone of formula (II) to form a cross-linked polymer exhibiting vitrimer characteristics. Methods for preparing the cross-linked polymer materials include reacting the glycidyl methacrylate grafted high-density polyethylene of with the polymacrolactone in the presence of a first catalyst under conditions that initiate cross-linking of HDPE-g-GMA with the polymacrolactone. Mechanically reprocessable articles include a structural element that is or includes the cross-linked polymer material. Examples of the mechanically reprocessable articles include pallets or molded structures formed from the material and configured to support a load of at least 1000 kg without bending.

POLYOL-EPOXIDE POLYMERS FOR NVH DAMPING APPLICATIONS

Noise, vibration, or harshness (NVH) properties of an industrial or consumer product are reduced by incorporating therein an effective amount of a polyether- or polyester-epoxide polymer (PEEP) composition. The PEEP compositions are one-component or two-component reaction products of a polyepoxide compound and a polyol composition. The PEEP compositions have a glass-transition temperature within the range of −50° C. to 50° C. and a loss factor of at least 0.5 by ASTM D5992 over a temperature range of at least 15 Celsius degrees at one or more frequencies within the range of 0.1 to 10,000 Hz. The PEEP compositions provide NVH damping over a broad temperature range, have improved flexibility compared with conventional epoxy technologies, avoid amine and isocyanate reactants, and can be tailored to meet target specifications.

CONDUCTIVE METAL RESIN MULTILAYER BODY AND MOLDED BODY OF SAME

The present invention provides a conductive metal resin multilayer body that comprises: a metal foil; and a resin layer which is arranged on at least one surface of the metal foil, and which contains a resin, organic fibers and a conductive filler that is formed of a non-metal material.

STRUCTURAL ADHESIVE COMPOSITIONS

Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.

Method for connecting molded bodies by injecting a single-component heat-curing epoxy resin composition into cavities

A method of bonding two shaped bodies S1 and S2 including the steps of: a) providing shaped body S1; b) arranging shaped body S2 wherein shaped body S1, forming cavity between two shaped bodies, c) introducing one-component thermosetting epoxy resin compositions into cavity, wherein one-component thermosetting epoxy resin composition is one-component thermosetting epoxy resin composition including: at least one epoxy resin A having average of more than one epoxy group per molecule; at least one curing agent B for epoxy resins activated by elevated temperature; at least one polyester polyol PP obtainable by reaction of at least one diol having structure HO—(CH.sub.2).sub.x′—OH the value of x′=2-10, and —at least one dicarboxylic acid having structure HOOC—(CH.sub.2).sub.y′—COOH and derivatives of dicarboxylic acid, value of y′=8-18, and wherein proportion of polyester polyol PP is 1.5% to 20% by weight, based on total weight of one-component thermosetting epoxy resin composition.

ANTISTATIC AGENT, ANTISTATIC COMPOSITION COMPRISING SAME, ANTISTATIC RESIN COMPOSITION COMPRISING SAME, AND MOLDED ARTICLE THEREOF
20220177757 · 2022-06-09 · ·

Provided are: an antistatic agent which can continuously impart an excellent antistatic effect to a synthetic resin and has excellent storage stability and productivity (cutting property); an antistatic agent composition containing the same; an antistatic resin composition containing the antistatic agent or the antistatic agent composition; and a molded article thereof. The antistatic agent contains at least one polymer compound (E) which is obtained by a reaction of a polyester (a) obtained by a reaction between a diol (a1) and a dicarboxylic acid (a2), a compound (b) containing at least one ethyleneoxy group and having hydroxy groups at both ends, and an epoxy compound (D) containing two or more epoxy groups. The diol (a1) is at least either of 1,4-butanediol and ethylene glycol, and the dicarboxylic acid (a2) is succinic acid or a dicarboxylic acid mixture containing succinic acid.

Support-provided insulating layer, laminate, and wiring board

By producing a resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule thereof and containing a hexanediol structure, (B) an ultraviolet ray active ester group-containing compound, and (C) an epoxy resin curing accelerator, even in a state where an irregular shape of the surface of an insulating resin layer is small, a high adhesive force to a wiring conductor can be easily revealed.

Thermoplastic polyester resin composition and molded article

A thermoplastic polyester resin composition includes 0.05 to 10 parts by weight of an epoxy compound (B) and 0.001 to 1 part by weight of a hindered amine compound (C) with respect to 100 parts by weight of a thermoplastic polyester resin (A) having an amount of carboxyl groups of 50 eq/t or less. The thermoplastic polyester resin composition is capable of producing a molded article which is excellent in mechanical properties and heat resistance, as well as in long-term hydrolysis resistance, and has a small decrease in mechanical properties and hydrolysis resistance even when melt-processed at a high temperature of 270° C. or more.

Curing agent composition and curing agent coating formula thereof

A curing agent composition and a curing agent coating formula thereof are provided. The curing agent composition includes 5 to 25 wt % of an ester group-containing amine end group adduct, 2 to 25 wt % of a C8-C22 hydrophobic saturated or unsaturated fatty amine, 2 to 25 wt % of a polyamine compound, 2 to 20 wt % of a silane compound, and 10 to 60 wt % of an ether solvent.

Coating compositions, dielectric coatings formed therefrom, and methods of preparing dielectric coatings

The present invention relates to a powder coating composition for preparing a dielectric coating. The powder coating composition includes: (a) an epoxy functional polymer; (b) a poly-carboxylic acid functional polyester polymer reactive with the epoxy functional polymer and which has an acid value of less than 100 mg KOH/g; and (c) a poly-carboxylic acid functional (meth)acrylate polymer reactive with the epoxy functional polymer. Further, if a colorant is present, the powder coating composition comprises 35 weight % or less of the colorant, based on the total solids weight of the coating composition.