The present disclosure relates to a B-stageable epoxy adhesive composition and an article manufactured therefrom. The B-stageable epoxy adhesive composition comprises (A) 20% to 50% by weight of a first epoxy resin with an epoxide equivalent of 5000 g/eq or more; (B) 5% to 20% by weight of a second epoxy resin with an epoxide equivalent of 800 g/eq or less and having 2 to 4 epoxy functional groups; (C) 5% to 30% by weight of a carboxyl terminated polyester; (D) 5% to 15% by weight of a poly-isocyanate modified polyester; and (E) 0.1% to 0.5% by weight of a crosslinking agent containing 2 or more aziridine groups, all the content percentages are based on the total weight of the B-stageable epoxy adhesive composition. The B-stageable epoxy adhesive composition and the related products could be widely used as insulation protection for battery management, bus bar, transformers and other markets with a good balance between a high bonding strength and a high temperature resistance, and others.

Compounds containing, in one molecule thereof, a structure represented by formula (1), a structure represented by formula (2), and a structure represented by formula (3) (all the symbols are those described in the specification).

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are useful as epoxy resin curing agents.

A curing agent and method for producing the same are provided, the method includes: esterification reaction: reacting a polyhydric alcohol with a polybasic acid anhydride to obtain an ester-based emulsifier (A); chain extension reaction: reacting an ester-based emulsifier (A) with a bifunctional epoxy resin to obtain a polymer intermediate (B); and reacting the polymer intermediate (B) with a polyamine compound to obtain a curing agent (C).

The present invention relates to a thermosetting material for use in a 3D printing process comprising: a) at least one epoxy resin A, b) at least one elastomer-modified epoxy resin B, c) at least one resin C with a dynamic viscosity of below 4 Pas at 150° C., d) at least one of a curing agent D capable of reacting with A, B and optionally C, e) and optionally additional compounds,
wherein the glass transition temperature of the uncured material is at least 30° C., preferably at least 40° C. as measured with DSC at a heating rate of 20° C./min.

The invention further relates to a method of producing a cured 3D thermoset object and the use of the above-mentioned thermosetting material in a 3D printing process.

The present invention aims to provide a means by which a cured product to be obtained has a low dielectric loss tangent and higher heat resistance. Specifically, provided is an active ester resin that is a reaction product of a first aromatic compound having two or more phenolic hydroxy groups, a second aromatic compound having a phenolic hydroxy group, and a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof, in which at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has an unsaturated bond-containing substituent.

To provide an epoxy resin composition that exhibits excellent low-dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application, as well as an active ester resin that provides the epoxy resin composition. An active ester resin having a polyaryloxy unit containing a dicyclopentenyl group and represented by the following formula (1), and a polyarylcarbonyl unit. Here, R.sup.1 represents a hydrocarbon group having 1 to 8 carbon atoms, R.sup.2 represents a hydrogen atom, or formula (1a) or formula (1b), and at least one R.sup.2 is formula (1a) or formula (1b); and n represents a number of repetitions of 1 to 5.

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Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.

The present invention relates to a thermosetting material for use in additive manufacturing, the material comprising at least one thermosetting resin and at least two curing compounds different from said thermosetting resin that are able to cure this/these thermosetting resin(s), wherein at least one curing compound is provided for curing during the additive manufacturing process and at least one curing compound is provided for curing during a post-curing step. The invention furthermore relates to a method of producing a cured 3D thermoset object comprising at least the steps of subjecting the material according to the present invention to an additive manufacturing process, obtaining a partially cured 3D thermoset object and subsequently subjecting the partially cured 3D thermoset object to a post-curing process to further cure the 3D thermoset object Additionally, the invention relates to the use of the material in an SLS, FFF, CBAM, FGF or powder bed additive manufacturing process.

The instant invention provides a curable formulation suitable for laminating adhesive applications, and laminating adhesives made therefrom. The curable formulation suitable for laminating adhesive applications according to the present invention comprises a) a blend comprising i) an epoxy terminated polyester and at least one of ii) a maleate (poly) ester or iii) a diacrylate terminated oligomer or polymer and b) an aliphatic amine curing agent.

One-component (1K) adhesive compositions (“PEEP” compositions) and a process for making them are disclosed. A polyepoxide is reacted with a polyether polyol composition, a polyester polyol composition, or both in the presence of a heat-activated Lewis acid catalyst at a temperature within the range of 100° C. to 220° C. for a time effective to cure the adhesive. The compositions are storage-stable under ambient conditions. Compared with conventional epoxy compositions, the 1K PEEP compositions offer improved room temperature lap shear strength, better resilience, and higher elongation. The 1K PEEP systems deliver a desirable balance of physical and mechanical properties while avoiding polyisocyanates and polyamine crosslinkers.