The present invention relates to a support-attached resin film for an interlayer insulating layer, including a support, and a resin composition layer formed on one side surface of the support in which the support has particles exposed on the one side surface, and an average maximum height of exposed portions of the particles is 1.0 μm or less, or the support has no particles exposed on the one side surface, a multilayer printed wiring board using the support-attached resin film for an interlayer insulating layer, and the multilayer printed-wiring board.

Provided is a curing agent for a water-based epoxy resin, which contains the following component (A) and component (B): (A); at least one selected from the group consisting of a polyamide amine-based curing agent (a1), a reaction product (a2) of a polyamine compound and a polyepoxy compound, and a Mannich reaction product (a3) of a polyamine compound, a phenol compound, and an aldehyde compound; (B): at least one selected from the group consisting of a reaction product (b1) of styrene and an amine compound represented by the following formula (1), and a reaction product (b2) of epichlorohydrin and an amine compound represented by the following formula (1);
H.sub.2N—CH.sub.2-A-CH.sub.2—NH.sub.2  (1) wherein A is a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group.

An epoxy resin composition for fiber reinforced composite materials comprising components (A) to (E): component (A), an epoxy resin; component (B), a dicyandiamide or a derivative thereof; component (C), a polyisocyanate compound; component (D), a urea compound as represented by formula (1): ##STR00001##
(wherein R.sup.1 and R.sup.2 are each independently H, CH.sub.3, OCH.sub.3, OC.sub.2H.sub.5, NO.sub.2, halogen, or NH—CO NR.sup.3R.sup.4; and R.sup.3 and R.sup.4 are each independently a hydrocarbon group, allyl group, alkoxy group, alkenyl group, aralkyl group, or an alicyclic compound containing both R.sup.3 and R.sup.4, all containing 1 to 8 carbon atoms); and component (E), at least one compound selected from the group consisting of quaternary ammonium salts, phosphonium salts, imidazole compounds, and phosphine compounds.

An epoxy resin composition for fiber reinforced composite materials comprising components (A) to (E): component (A), an epoxy resin; component (B), a dicyandiamide or a derivative thereof; component (C), a polyisocyanate compound; component (D), a urea compound as represented by formula (1): ##STR00001##
(wherein R.sup.1 and R.sup.2 are each independently H, CH.sub.3, OCH.sub.3, OC.sub.2H.sub.5, NO.sub.2, halogen, or NH—CO NR.sup.3R.sup.4; and R.sup.3 and R.sup.4 are each independently a hydrocarbon group, allyl group, alkoxy group, alkenyl group, aralkyl group, or an alicyclic compound containing both R.sup.3 and R.sup.4, all containing 1 to 8 carbon atoms); and component (E), at least one compound selected from the group consisting of quaternary ammonium salts, phosphonium salts, imidazole compounds, and phosphine compounds.

A curing agent for epoxy resins, including 1-amino-3-aminomethyl-3,5,5-trimethylcyclohexane and N-benzyl-1,2-ethandiamine in an amount for the ratio of the number of its amine hydrogens to be in the range of 90/10 to 20/80. The curing agent permits suitable epoxy resin compositions that have excellent workability and that cure particularly rapidly in cold and damp conditions, without blushing-induced surface defects, thus achieving coatings of in particular high hardness, high glass transition temperature and surprisingly little tendency to yellowing.

A curing agent for epoxy resins, including 1-amino-3-aminomethyl-3,5,5-trimethylcyclohexane and N-benzyl-1,2-ethandiamine in an amount for the ratio of the number of its amine hydrogens to be in the range of 90/10 to 20/80. The curing agent permits suitable epoxy resin compositions that have excellent workability and that cure particularly rapidly in cold and damp conditions, without blushing-induced surface defects, thus achieving coatings of in particular high hardness, high glass transition temperature and surprisingly little tendency to yellowing.

It is to provide an epoxy resin comprising a phenol compound having a curing acceleration effect even when a low reactive curing agent is used, and allowing the amount of the curing agent used to be reduced. Here is used an epoxy resin composition comprising a glycidylamine-type epoxy resin, an aromatic polyamine and 1,1,2,2-tetrakis(4-hydroxyphenyl)ethane. The aromatic polyamine and 1,1,2,2-tetrakis(4-hydroxyphenyl)ethane optionally form a clathrate compound.

It is to provide an epoxy resin comprising a phenol compound having a curing acceleration effect even when a low reactive curing agent is used, and allowing the amount of the curing agent used to be reduced. Here is used an epoxy resin composition comprising a glycidylamine-type epoxy resin, an aromatic polyamine and 1,1,2,2-tetrakis(4-hydroxyphenyl)ethane. The aromatic polyamine and 1,1,2,2-tetrakis(4-hydroxyphenyl)ethane optionally form a clathrate compound.

The invention relates to an encapsulation composition for the storage or the confinement of waste which is toxic to health and/or the environment, comprising a resin composition containing at least one epoxy resin, and a hardening composition containing at least one polyamidoamine and at least one aromatic polyamine, said encapsulation composition having an aromaticity rate which is equal to, or higher than, 35%. The invention also relates to the use of said composition for encapsulating said waste.

The invention relates to an encapsulation composition for the storage or the confinement of waste which is toxic to health and/or the environment, comprising a resin composition containing at least one epoxy resin, and a hardening composition containing at least one polyamidoamine and at least one aromatic polyamine, said encapsulation composition having an aromaticity rate which is equal to, or higher than, 35%. The invention also relates to the use of said composition for encapsulating said waste.