Patent classifications
C08G59/504
PREPREG
The present invention addresses the problem of providing a prepreg that yields a carbon fiber composite material that has exceptional tensile strength, heat resistance, and impact resistance and is suitable as a structural material of an aircraft body, wherein the resin composition used in the prepreg furthermore has exceptional viscosity stability, the prepreg containing a resin composition that contains carbon fibers and at least the constituent elements [A]—[D] as defined.
Polycarbonate containing compounds and methods related thereto
Disclosed herein are crosslinked polycarbonates, composition thereof and methods thereof. The crosslinked polycarbonates can be prepared from allyl or epoxy polycarbonates. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.
SHIMMING ADHESIVE
Provided are two-part shimming adhesives comprising a base part and a hardener part that are curable upon mixing. The base part includes a multifunctional epoxy resin having an epoxide functionality of at least three, a difunctional epoxy resin miscibly blended with the multifunctional epoxy resin. The hardener part includes a polyetheramine. Either the base part or hardener part further comprises an inorganic filler present in an amount from 10 percent to 60 percent, relative to the overall weight of the two-part curable shimming adhesive, and a phosphoric acid ester. The shimming adhesive enables joints to be assembled in one step, providing a significant advantage to the user.
Etheramine mixture containing polyether diamines and method of making and using the same
An etheramine mixture comprising one or more polyether diamines, methods for its production, and its use as a curing agent for epoxy resins. The etheramine mixture may also be used in the preparation of polyamides and polyurea compounds.
MOLDING MATERIAL AND FIBER REINFORCED COMPOSITE MATERIAL
The purpose of the present invention is to provide: a molding material from which a carbon fiber reinforced composite material having excellent impact resistance and tensile strength is obtained; and a molding material from which a glass fiber reinforced composite material, that has high bending strength and impact resistance, has excellent weather resistance, and can suppress a decrease in bending strength after water absorption, is obtained. In order to achieve the purpose, the molding material according to the present invention is a molding material formed of an epoxy resin composition and a carbon fiber and/or a glass fiber, wherein the epoxy resin composition includes all of [A] to [C], the carbon fiber satisfies conditions [a] and [b], and the glass fiber has a surface functional group capable of forming a covalent bond with an isocyanate group. [A] Epoxy resin having at least two oxylan groups in molecule [B] Epoxy resin curing agent having at least two isocyanate groups in molecule [C] Catalyst [a] Having substantially perfect circular cross section [b] Average fiber diameter of 4.0-8.0 μm
METHODS FOR ENHANCING THE BONDING STRENGTH OF THERMOSET ADHESIVES AND SEALANTS VIA DISULFIDE DYNAMIC CHEMISTRY
Curable compositions for dynamic epoxy-based thermoset adhesives and/or sealants are provided. Methods of applying the compositions to form strong, low-stress, cured adhesive polymer films are also provided. The cured polymer films use crosslinkers that include disulfide and carbon-nitrogen bonds, wherein the disulfide bonds impart dynamic chemistry to the polymer network structure in order to the achieve adaptable thermoset adhesives and sealants.
Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material
An epoxy resin, comprising an epoxy compound A that has at least two mesogenic structures and at least one phenylene group, and an epoxy compound B that has at least two mesogenic structures and at least one divalent biphenyl group.
Thermally conductive material, device with thermally conductive layer, composition for forming thermally conductive material, and disk-like liquid crystal compound
The present invention provides a thermally conductive material having excellent thermal conductivity. Furthermore, the present invention provides a device with a thermally conductive layer that has a thermally conductive layer containing the thermally conductive material and a composition for forming a thermally conductive material that is used for forming the thermally conductive material. The thermally conductive material according to an embodiment of the present invention contains a cured substance of a disk-like compound, which has one or more reactive functional groups selected from the group consisting of a hydroxyl group, a carboxylic acid group, a carboxylic acid anhydride group, an amino group, a cyanate ester group, and a thiol group, and a crosslinking compound which has a group reacting with the reactive functional groups.
Bio-based diols from sustainable raw materials, uses thereof to make diglycidyl ethers, and their coatings
The invention relates to diols derived from 5-hydroxymethyl furfural, diformyl furan, or derivatives thereof. The invention further relates to diglycidyl ethers derived from the diols of the invention, curable coating compositions containing the diglycidyl ethers, and objects coated with the curable coating compositions. The invention also relates to composites, composites, adhesives, and films containing the diglycidyl ethers of the invention. The invention also relates to methods of making the diols, diglycidyl ethers, and curable coating compositions.
Curing agent for epoxy resins
The present disclosure provides a curing agent comprising a polyetheramine, a tertiary amine substantially free of an aromatic tertiary amine and glycerin. The curing agent may be combined with an epoxy resin to form a curable composition which is capable of being applied to a substrate and cured to form a cured article.