The invention provides a curable resin composition containing (A) a multifunctional benzoxazine compound having at least two benzoxazine rings, the compound being at least one multifunctional benzoxazine compound selected from a multifunctional benzoxazine compound having a structural unit of formula (1) and a multifunctional benzoxazine compound represented by a structure of formula (2), (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, and (D) a curing accelerator which is a bisphenol salt of a diazabicycloalkene. The invention also provides a cured product of the curable resin composition and methods of producing the curable resin composition and the cured product, as well as a semiconductor device using the cured product as a sealant.

The present invention provides a thermally conductive material having excellent thermal conductivity. Furthermore, the present invention provides a device with a thermally conductive layer that has a thermally conductive layer containing the thermally conductive material and a composition for forming a thermally conductive material that is used for forming the thermally conductive material. The thermally conductive material according to an embodiment of the present invention contains a cured substance of a disk-like compound, which has one or more reactive functional groups selected from the group consisting of a hydroxyl group, a carboxylic acid group, a carboxylic acid anhydride group, an amino group, a cyanate ester group, and a thiol group, and a crosslinking compound which has a group reacting with the reactive functional groups.

The present disclosure provides a curing agent comprising a polyetheramine, a tertiary amine substantially free of an aromatic tertiary amine and glycerin. The curing agent may be combined with an epoxy resin to form a curable composition which is capable of being applied to a substrate and cured to form a cured article.

An epoxy resin composition comprising the following components (A) to (E). Component (A) is a compound containing two or more epoxy groups. Component (B) is phenyl monoglycidyl ether having an alkyl group with 1 to 10 carbon atoms. Component (C) is an oxetane compound. Component (D) is a thiol curing agent. Component (E) is a curing accelerator.

An aspect of the present invention provides a semi-cured product composite containing: a porous body; and a semi-cured product of a thermally curable composition impregnated in the porous body, wherein the thermally curable composition contains an epoxy compound and a cyanate compound, and an equivalent ratio of an epoxy group of the epoxy compound to a cyanate group of the cyanate compound in the thermally curable composition is 1.0 or more.

The present invention relates novel furan based amine cross-linkers with improved thermomechanical and water barrier properties. The novelty of this invention is the use of aromatic, and hydrophobic aliphatic aldehydes to bridge two furfuryl amines, which yields a diamine or tetra amines with a significantly enhanced hydrophobic character. These diamine cross-linkers exhibit enhanced water barrier properties and thermomechanical properties when cured with both commercial and synthetic epoxies.

The present invention relates to a halogen-free epoxy resin composition, a prepreg, a laminate and a printed circuit board containing the same. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent. Taking the total equivalent amount of the epoxy groups in the epoxy resin as 1, the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95. By controlling the equivalent ratio of the epoxy groups in the epoxy resin to the active groups in the curing agent to be 0.5-0.95, the present invention ensures the Df value stability of prepregs under different curing temperature conditions while maintaining a low dielectric constant and a low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

A high-CTI and halogen-free epoxy resin composition for copper-clad plates and uses thereof is provided. The formula of the high-CTI and halogen-free epoxy resin composition for copper-clad plates comprises 100˜140 parts of halogen-free phosphorous epoxy resin, 10˜35 parts of dicyclopentadiene phenolic epoxy resin, 32˜60 parts of benzoxazine, 1˜5 parts of phenolic resin, 0.05˜0.5 parts of accelerants; and 25˜70 parts of fillers, by weight. The copper-clad plates, prepared according to embodiments of the present invention, can reach the requirements of high CTI (CTI≧500V), high heat resistance(Tg≧150 ° C., PCT, 2 h>6 min) and the level of flame retardance of UL-94 V0, and they are widely used in the electronic materials of electric machines, electric appliances, white goods and so on.

A reinforcing resin composition includes an epoxy resin (A), a phenolic resin (B), and a benzoxazine compound (C).

A curable resin composition including components (A), (B), (C) and (D) below: component (A): a bisphenol epoxy resin with a softening point of 80° C. or more, component (B): a bisphenol epoxy resin which is liquid at 25° C., component (C): a bi- or more-functional (meth)acrylate compound, and component (D): a curing agent.