Patent classifications
C08G59/60
Prepregs and production of composite material using prepregs
A prepreg having at least one layer of fibres and a curable thermosetting resin system at least partly impregnating the at least one layer of fibres, wherein the curable thermosetting resin system includes a curable thermosetting resin including at least two epoxide groups, a curing agent that includes at least one amine group, and an accelerator that includes an azole group; wherein the curable thermosetting resin, the curing agent and the accelerator are provided in respective concentrations in the prepreg to provide that, after curing the thermosetting resin at a cure temperature of at least 140° C. for a period of from 1 to 6 minutes, (i) the cured thermosetting resin has a glass transition temperature Tg which is greater than the cure temperature and is within the range of from 150° C. to 180° C. and (ii) the cured thermosetting resin is at least 90% cured.
Prepregs and production of composite material using prepregs
A prepreg having at least one layer of fibres and a curable thermosetting resin system at least partly impregnating the at least one layer of fibres, wherein the curable thermosetting resin system includes a curable thermosetting resin including at least two epoxide groups, a curing agent that includes at least one amine group, and an accelerator that includes an azole group; wherein the curable thermosetting resin, the curing agent and the accelerator are provided in respective concentrations in the prepreg to provide that, after curing the thermosetting resin at a cure temperature of at least 140° C. for a period of from 1 to 6 minutes, (i) the cured thermosetting resin has a glass transition temperature Tg which is greater than the cure temperature and is within the range of from 150° C. to 180° C. and (ii) the cured thermosetting resin is at least 90% cured.
Curing agent for water-based epoxy resin, water-based epoxy resin composition, and cured product thereof
Provided is a curing agent for a water-based epoxy resin, which contains the following component (A) and component (B): (A); at least one selected from the group consisting of a polyamide amine-based curing agent (a1), a reaction product (a2) of a polyamine compound and a polyepoxy compound, and a Mannich reaction product (a3) of a polyamine compound, a phenol compound, and an aldehyde compound; (B): at least one selected from the group consisting of a reaction product (b1) of styrene and an amine compound represented by the following formula (1), and a reaction product (b2) of epichlorohydrin and an amine compound represented by the following formula (1);
H.sub.2N—CH.sub.2-A-CH.sub.2—NH.sub.2 (1) wherein A is a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group.
Encapsulation composition for storage or confinement of waste which is toxic to health and/or the environment
The invention relates to an encapsulation composition for the storage or the confinement of waste which is toxic to health and/or the environment, comprising a resin composition containing at least one epoxy resin, and a hardening composition containing at least one polyamidoamine and at least one aromatic polyamine, said encapsulation composition having an aromaticity rate which is equal to, or higher than, 35%. The invention also relates to the use of said composition for encapsulating said waste.
Encapsulation composition for storage or confinement of waste which is toxic to health and/or the environment
The invention relates to an encapsulation composition for the storage or the confinement of waste which is toxic to health and/or the environment, comprising a resin composition containing at least one epoxy resin, and a hardening composition containing at least one polyamidoamine and at least one aromatic polyamine, said encapsulation composition having an aromaticity rate which is equal to, or higher than, 35%. The invention also relates to the use of said composition for encapsulating said waste.
EPOXY RESIN, METHOD FOR PRODUCING EPOXY RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT, FIBER REINFORCED COMPOSITE MATERIAL, AND MOLDED ARTICLE
Provided are a curable resin composition capable of providing excellent heat resistance and toughness for a cured product, in which these physical properties are less deteriorated even in a case of being exposed to humidity and heat conditions, and a cured product, a fiber reinforced composite material, and a molded article thereof. The curable resin composition includes an epoxy resin and a curing agent, in which the epoxy resin is an epoxy resin obtained by the polyglycidyl-etherification of a phenol novolac resin. The phenol novolac resin contains bisphenol F having different binding sites, and in the bisphenol F components, the content of the [o, p′[ conjugate is in a range of 30% to 45% relative to the total of the [o, p′[ conjugate+the [o, o′] conjugate+the [p, p′[ conjugate in terms of the area ratio according to a liquid chromatography measurement.
EPOXY RESIN, METHOD FOR PRODUCING EPOXY RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT, FIBER REINFORCED COMPOSITE MATERIAL, AND MOLDED ARTICLE
Provided are a curable resin composition capable of providing excellent heat resistance and toughness for a cured product, in which these physical properties are less deteriorated even in a case of being exposed to humidity and heat conditions, and a cured product, a fiber reinforced composite material, and a molded article thereof. The curable resin composition includes an epoxy resin and a curing agent, in which the epoxy resin is an epoxy resin obtained by the polyglycidyl-etherification of a phenol novolac resin. The phenol novolac resin contains bisphenol F having different binding sites, and in the bisphenol F components, the content of the [o, p′[ conjugate is in a range of 30% to 45% relative to the total of the [o, p′[ conjugate+the [o, o′] conjugate+the [p, p′[ conjugate in terms of the area ratio according to a liquid chromatography measurement.
EPOXY CURING AGENTS, COMPOSITIONS AND USES THEREOF
The present invention relates to epoxy curing agents which are obtained from the reaction of a polyalkylene polyether modified polyepoxide resin and a polyamine component. They polyamine component is a reaction product of a polyethylene polyamine having 3 to 10 nitrogen atoms, for example, diethylenetriamine (DETA), and at least one aldehyde having 1 to 8 carbon atoms, for example, formaldehyde. The epoxy curing agent may be used as part of a two component coating system in the curing of liquid or pre-dispersed curable epoxy resins.
NON-COMBUSTIBLE WATERBORNE SELF LEVELLING EPOXY FLOOR
An epoxy composition including a waterborne hardener component containing an amine functional adduct, which is a reaction product of at least one polyether amine, at least one polyalkylene amine, at least one arylaliphatic or cycloaliphatic amine, at least one polyether epoxy resin and at least one aromatic liquid epoxy resin, a resin component containing at least one liquid epoxy resin and mineral fillers, wherein the composition contains mineral fillers in the range of 85 to 95 weight-% based on the total solids of the composition. The epoxy composition enables floor coatings with low emission, low shrinkage and high impact resistance, which can be applied in a layer thickness of 1 to 3 mm or more in one step, cure to a decorative, faultless and glossy surface without the need to be overcoated and generate a low enough heat upon burning to fulfill the fire classification A2fl according to EN 13501-1.
Curable compositions and related methods
Provided is a curable composition containing a reactive mixture of components including an polyethersulfone having a chemical group reactive with an epoxide, a cycloaliphatic polyepoxide resin, a polyepoxide having a functionality greater than two, a liquid diepoxide resin, a first curative containing 9,9-bis(aminophenyl)fluorene or a derivative therefrom and having a curing onset temperature of from 150° C. to 200° C. The components can further comprise a second curative having a curing onset temperature of from 60° C. to 180° C. When thermally curing this composition, the second epoxy curative starts to cure before the first epoxy curative, thereby inhibiting vertical flow of the adhesive during the curing process.