Provided is a curable resin composition for obtaining a cured product that can satisfy both high heat resistance and high adhesiveness to metal, a cured product thereof, and methods of producing the curable resin composition and the cured product, and a semiconductor device using the cured product as a sealant. A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, (D) a triazole-based compound, and optionally (E) a curing accelerator and (F) an inorganic filler, a cured product thereof, and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

A hardener component is useful for a multi-component epoxy resin material, and includes a benzoxazine amine adduct as an accelerator and an amine as a hardener. The benzoxazine amine adduct is present in the hardener component in a proportion of from 8.5 wt. % to 75 wt. %. The multi-component material including the benzoxazine amine adduct in the hardener component already has a quick curing time at room temperature and can therefore be used advantageously for the chemical fastening of construction elements.

The present disclosure provides a curing agent comprising a polyetheramine, a tertiary amine and an alkanolamine. The curing agent may be combined with an epoxy resin to form a curable composition which is capable of being applied to a substrate and cured to form a cured article.

The present disclosure provides a curing agent comprising a polyetheramine, a tertiary amine and an alkanolamine. The curing agent may be combined with an epoxy resin to form a curable composition which is capable of being applied to a substrate and cured to form a cured article.

The present disclosure provides a curing agent comprising a polyetheramine, a tertiary amine and an alkanolamine. The curing agent may be combined with an epoxy resin to form a curable composition which is capable of being applied to a substrate and cured to form a cured article.

The present disclosure provides a curing agent comprising a polyetheramine, a tertiary amine and an alkanolamine. The curing agent may be combined with an epoxy resin to form a curable composition which is capable of being applied to a substrate and cured to form a cured article.

An epoxy composition that includes an epoxy-terminated prepolymer, an alkanolamine hardener having at least one hydroxyl group and an organometallic compound, where amine groups of the alkanolamine hardener react with epoxy groups of the epoxy-terminated prepolymer in a stoichiometric ratio to form a cured epoxy composition. The epoxy-terminated prepolymer is formed from a reaction product of an amine terminated polymeric polyol and a molar excess of epoxy groups in an epoxy monomer, relative to a molar amount of amine groups in the amine terminated polymeric polyol.

An epoxy composition that includes an epoxy-terminated prepolymer, an alkanolamine hardener having at least one hydroxyl group and an organometallic compound, where amine groups of the alkanolamine hardener react with epoxy groups of the epoxy-terminated prepolymer in a stoichiometric ratio to form a cured epoxy composition. The epoxy-terminated prepolymer is formed from a reaction product of an amine terminated polymeric polyol and a molar excess of epoxy groups in an epoxy monomer, relative to a molar amount of amine groups in the amine terminated polymeric polyol.

A triazine ring-containing phenol resin obtained by reacting melamine, para-alkylphenol, and formalin is used to provide an epoxy resin composition capable of providing a cured product with excellent flame retardancy, excellent dielectric characteristics such as a low dielectric tangent and a low dielectric constant, and excellent thermal conductivity, a cured product thereof, and a prepreg, a circuit board, a build-up film, a build-up board, a semiconductor sealing material, a semiconductor device, a fiber reinforced composite material, and a formed article using the epoxy resin composition.

The present invention relates to a cross-linkable composition comprising an epoxy oligomer comprising at least six hydroxy groups, to a coating obtained by curing the cross-linkable composition and to an optical lens comprising said coating on a surface thereof, in particular on the edge surface thereof. The invention also relates to a method of preparing a coating for an optical lens and to a method of coating a surface of an optical lens, in particular the edge surface of an optical lens.