Provided is a positive electrode slurry comprising a polyether phosphate, wherein the polyether phosphate may comprise at least the following structural units:

##STR00001##

and a structural unit (IV) that is a phosphate group, A being hydrogen, halogen or haloalkyl; B is hydroxyl, R, OR, or ROR′, the R and R′ being each independently a linear or branched alkyl group containing 1 to 8 carbons; and E is phenyl, alkyl-substituted phenyl, ether-substituted phenyl, or halophenyl.

Provided is a positive electrode slurry comprising a polyether phosphate, wherein the polyether phosphate may comprise at least the following structural units:

##STR00001##

and a structural unit (IV) that is a phosphate group, A being hydrogen, halogen or haloalkyl; B is hydroxyl, R, OR, or ROR′, the R and R′ being each independently a linear or branched alkyl group containing 1 to 8 carbons; and E is phenyl, alkyl-substituted phenyl, ether-substituted phenyl, or halophenyl.

An electrodeposition composition comprising: (a) a source of copper ions; (b) an acid; (c) a suppressor; and (d) a leveler, wherein the leveler comprises a quaternized dipyridyl compound prepared by reacting a dipyridyl compound with a difunctional alkylating agent or a quaternized poly(epihalohydrin). The electrodeposition composition can be used in a process for forming a copper feature over a semiconductor substrate in wafer level packaging to electrodeposit a copper bump or pillar on an underbump structure of a semiconductor assembly.

An electrodeposition composition comprising: (a) a source of copper ions; (b) an acid; (c) a suppressor; and (d) a leveler, wherein the leveler comprises a quaternized dipyridyl compound prepared by reacting a dipyridyl compound with a difunctional alkylating agent or a quaternized poly(epihalohydrin). The electrodeposition composition can be used in a process for forming a copper feature over a semiconductor substrate in wafer level packaging to electrodeposit a copper bump or pillar on an underbump structure of a semiconductor assembly.

The use of branched copolymers of the general structure (I) as additives for increasing the flow rate and for reducing the viscosity of mineral binder compositions. Further, mineral binder compositions including at least one branched copolymer of the general structure (I):

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The invention relates to block copolymer comprising i) A first block wherein at least 65 mol-% of the repeating units of the first block are repeating units of the formula (I)—[CH.sub.2—CH.sub.2—O]—, ii) A second block wherein at least 90 mol-% of the repeating units of the second block are repeating units of at least one of formulae (II) or (III), wherein the groups R.sup.1, R.sup.2, and R.sup.3 independent of each occurrence are selected from hydrocarbyl groups having 1 to 40 carbon atoms, which are optionally substituted by ether or hydroxyl groups, and wherein the groups R.sup.1 and R.sup.2 are optionally linked to each other such that a nitrogen heterocyclic structure is present, iii) A third block which is different from the first block and the second block and which is more hydrophobic than the first block.

##STR00001##

The invention relates to block copolymer comprising i) A first block wherein at least 65 mol-% of the repeating units of the first block are repeating units of the formula (I)—[CH.sub.2—CH.sub.2—O]—, ii) A second block wherein at least 90 mol-% of the repeating units of the second block are repeating units of at least one of formulae (II) or (III), wherein the groups R.sup.1, R.sup.2, and R.sup.3 independent of each occurrence are selected from hydrocarbyl groups having 1 to 40 carbon atoms, which are optionally substituted by ether or hydroxyl groups, and wherein the groups R.sup.1 and R.sup.2 are optionally linked to each other such that a nitrogen heterocyclic structure is present, iii) A third block which is different from the first block and the second block and which is more hydrophobic than the first block.

##STR00001##

Provided is a thermosetting resin composition which achieves both high heat resistance and high bending strength as a fiber-reinforced composite material, and also has rapid curability that enables high cycle press forming, thermal stability, and storage stability. The thermosetting resin composition of the present invention is a thermosetting resin composition comprising an epoxy resin, an epoxy resin curing agent, an imidazole compound, and an epoxy resin curing accelerator, in which the epoxy resin curing agent is dicyandiamide or a derivative thereof, and the epoxy resin curing accelerator comprises a urea derivative having two or more dimethylureido groups in a molecule.

Provided is a thermosetting resin composition which achieves both high heat resistance and high bending strength as a fiber-reinforced composite material, and also has rapid curability that enables high cycle press forming, thermal stability, and storage stability. The thermosetting resin composition of the present invention is a thermosetting resin composition comprising an epoxy resin, an epoxy resin curing agent, an imidazole compound, and an epoxy resin curing accelerator, in which the epoxy resin curing agent is dicyandiamide or a derivative thereof, and the epoxy resin curing accelerator comprises a urea derivative having two or more dimethylureido groups in a molecule.

The invention relates to polyoxyalkylenes having pendant long-chain acyloxy radicals and to a process for preparation thereof by an alkoxylation reaction using double metal cyanide (DMC) catalysts.