The present invention concerns a metal or metal alloy deposition composition, particularly a copper or copper alloy deposition composition, for electrolytic deposition of a metal or metal alloy layer, particularly for electrolytic deposition of a copper or copper alloy layer, comprising at least one type of metal ions to be deposited, preferably copper ions, and at least one imidazole based plating compound. The present invention further concerns a method for preparation of the plating compound, the plating compound itself and its use in a metal or metal alloy deposition composition. The inventive metal or metal alloy deposition composition can be preferably used for filling recessed structures, in particular those having higher diameter to depth aspect ratios.

A composition for forming a resist underlayer film enables the formation of a desired resist pattern; and a method for forming a resist pattern using this resist underlayer film forming composition. A resist underlayer film forming composition contains an organic solvent and a polymer that has a structure represented by formula (1) or (2) at an end of the polymer chain. (In formula (1) and formula (2), X represents a divalent organic group; A represents an aryl group having 6-40 carbon atoms; R1 represents a halogen atom, an alkyl group having 1-40 carbon atoms or an alkoxy group having 1-40 carbon atoms; each of R2 and R3 independently represents a hydrogen atom, an optionally substituted alkyl group having 1-10 carbon atoms, an aryl group having 6-40 carbon atoms or a halogen atom; each of n1 and n3 independently represents an integer of 1-12; and n2 represents an integer of 0-11.)

This disclosure relates to CO.sub.2-philic crosslinked polyethylene glycol membranes useful for natural gas purification processes. Also provided are methods of using the membranes to remove CO.sub.2 and H.sub.2S from natural gas.

This disclosure relates to CO.sub.2-philic crosslinked polyethylene glycol membranes useful for natural gas purification processes. Also provided are methods of using the membranes to remove CO.sub.2 and H.sub.2S from natural gas.

Poly(aryl alkylene) polymers or poly(aryl-crown ether-alkylene) polymers with pendant cationic groups are provided which have an alkaline-stable cation, such as imidazolium, introduced into a rigid aromatic polymer backbone free of ether bonds. Hydroxide exchange membranes or hydroxide exchange ionomers formed from these polymers exhibit superior chemical stability, hydroxide conductivity, decreased water uptake, good solubility in selected solvents, and improved mechanical properties in an ambient dry state as compared to conventional hydroxide exchange membranes or ionomers. Hydroxide exchange membrane fuel cells and hydroxide exchange membrane electrolyzers comprising the poly(aryl alkylene) polymers or poly(aryl-crown ether-alkylene) polymers with pendant cationic groups exhibit enhanced performance and durability at relatively high temperatures.

This disclosure relates to CO.sub.2-philic crosslinked polyethylene glycol membranes useful for natural gas purification processes. Also provided are methods of using the membranes to remove CO.sub.2 and H.sub.2S from natural gas.

The present invention provides a (poly)alkylene glycol-containing compound having higher detergency for composite stains of hydrophilic stains and hydrophobic stains than conventional (poly)alkylene glycol-containing compounds. The present invention relates to a (poly)alkylene glycol-containing compound including: a hydrophobic structural moiety (A); a (poly)alkylene glycol moiety (B); and one lactam ring-containing structural unit (C), in its structure, the hydrophobic structural moiety (A) being present in a proportion of 2.5 to 60% by mass in 100% by mass of the (poly)alkylene glycol-containing compound.

Polyether (meth)acrylates based on cyanuric acid or substituted cyanuric acid and multifunctional alcohol, which optionally include triethanolamine units, have wide applications in UV curable adhesives, coatings, inks, sealants, paints or 3D printing. These polyether acrylates have rigid cyanurate structure endowing the material with extra strength and thermal stability. Furthermore, triethanolamine unit, when present, endows the material with anti-oxygen inhibition property in UV curing process. These polyether (meth)acrylates have low viscosity and high reactivity towards UV curing. The cured resins have high resilience and strength. The process of making the polyether (meth)acrylates includes the synthesis of trifunctional polyether polyols through controlled polymerization of propylene oxide using multifunctional alcohol (such as glycerol and sucrose), cyanuric acid or substituted cyanuric acid, and optionally triethanolamine, in the presence of a catalyst, followed by the synthesis of polyether (meth)acrylates through transesterification or through direct esterification of the trifunctional polyether polyols.

The present invention provides a polyalkylene glycol-containing compound having higher detergency than conventional polyalkylene glycol-containing compounds. The present invention relates to a polyalkylene glycol-containing compound represented by the following formula (1-1).

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The present invention concerns a metal or metal alloy deposition composition, particularly a copper or copper alloy deposition composition, for electrolytic deposition of a metal or metal alloy layer, particularly for electrolytic deposition of a copper or copper alloy layer, comprising at least one type of metal ions to be deposited, preferably copper ions, and at least one imidazole based plating compound. The present invention further concerns a method for preparation of the plating compound, the plating compound itself and its use in a metal or metal alloy deposition composition. The inventive metal or metal alloy deposition composition can be preferably used for filling recessed structures, in particular those having higher diameter to depth aspect ratios.