The present disclosure relates to a method of immobilizing a phenolic compound having a M.sub.w≥500 g/mol, wherein the method comprises the steps of ionizing the phenolic compound by subjecting it to a base; and contacting, under agitation, the ionized phenolic compound with a cross-linked resin comprising the functionality of —C(═0)—CHXCH.sub.2R, wherein X is chosen from the group consisting of Br, Cl, I, CN, OMs, OTs, or OTf, and R is H, CH.sub.3 or an branched or unbranched alkyl having 1 to 8 carbon atoms, in the presence of a base and a solvent. The present disclosure also relates to a method of removing phenolic compounds having a M.sub.w≥500 g/mol from a composition comprising compounds having at least one alkoxy silane group. The present disclosure also relates to the use of a method according to the present disclosure as well as to a product, from which at least one phenolic compound having a M.sub.w>500 g/mol has been removed by a method according to the present disclosure.

The present disclosure relates to a method of immobilizing a phenolic compound having a M.sub.w≥500 g/mol, wherein the method comprises the steps of ionizing the phenolic compound by subjecting it to a base; and contacting, under agitation, the ionized phenolic compound with a cross-linked resin comprising the functionality of —C(═0)—CHXCH.sub.2R, wherein X is chosen from the group consisting of Br, Cl, I, CN, OMs, OTs, or OTf, and R is H, CH.sub.3 or an branched or unbranched alkyl having 1 to 8 carbon atoms, in the presence of a base and a solvent. The present disclosure also relates to a method of removing phenolic compounds having a M.sub.w≥500 g/mol from a composition comprising compounds having at least one alkoxy silane group. The present disclosure also relates to the use of a method according to the present disclosure as well as to a product, from which at least one phenolic compound having a M.sub.w>500 g/mol has been removed by a method according to the present disclosure.

Provided is a technique suitable for multilayering thin semiconductor elements via adhesive bonding while avoiding wafer damage in a method of manufacturing a semiconductor device, the method in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method of the present invention includes bonding and removing. In the bonding step, a back surface 1b side of a thinned wafer 1T in a reinforced wafer 1R having a laminated structure including a supporting substrate S, a temporary adhesive layer 2, and the thinned wafer 1T is bonded via an adhesive to an element forming surface 3a of a wafer 3. A temporary adhesive for forming the temporary adhesive layer 2 contains a polyvalent vinyl ether compound, a compound having two or more hydroxy groups or carboxy groups and thus capable of forming a polymer with the polyvalent vinyl ether compound, and a thermoplastic resin. The adhesive contains a polymerizable group-containing polyorganosilsesquioxane. In the removing step, a temporary adhesion by the temporary adhesive layer 2 between the supporting substrate S and the thinned wafer 1T is released to remove the supporting substrate S.

The present invention provides a curable resin composition excellent in surface curability and internal curability in bonding adherend members without use of an organic tin catalyst. The curable resin composition includes the following components (A) to (E): component (A): an epoxy resin having 2 or more epoxy groups in a molecule; component (B): a bismuth catalyst; component (C): water having a pH of 8.0 or more; component (D): an organic polymer having 2 or more hydrolyzable silyl groups in a molecule; and component (E): a curing agent for an epoxy resin.

One-part condensation curable silyl-modified polymer (SMP) based sealant compositions in particular one-part condensation curable SMP based sealant compositions containing a catalyst comprising (i) a titanate and/or zirconate and (ii) a metal carboxylate salt which compositions upon cure provide elastomeric sealants having low modulus and a high elastic recovery.

One-part condensation curable silyl-modified polymer (SMP) based sealant compositions in particular one-part condensation curable SMP based sealant compositions containing a catalyst comprising (i) a titanate and/or zirconate and (ii) a metal carboxylate salt which compositions upon cure provide elastomeric sealants having low modulus and a high elastic recovery.

Provided are: a fluorine-containing ether compound, a fluorine-containing ether composition, and a coating liquid that are capable of forming a surface layer having excellent durability; and an article that has a surface layer having excellent durability. The present invention provides a fluorine-containing ether compound represented by formula (A1) or formula (A2) below.

R.sup.fO—(R.sup.f1O).sub.m—R.sup.1-L.sup.1-R.sup.2-Q.sup.1(-T).sub.n  formula (A1)

(T-).sub.nQ.sup.1-R.sup.2-L.sup.1-R.sup.1—O—(R.sup.f1O).sub.m—R.sup.1-L.sup.1-R.sup.2-Q.sup.1(-T).sub.n  formula (A2)

In the formulae, symbols are as defined in the description.

Provided are: a fluorine-containing ether compound, a fluorine-containing ether composition, and a coating liquid that are capable of forming a surface layer having excellent durability; and an article that has a surface layer having excellent durability. The present invention provides a fluorine-containing ether compound represented by formula (A1) or formula (A2) below.

R.sup.fO—(R.sup.f1O).sub.m—R.sup.1-L.sup.1-R.sup.2-Q.sup.1(-T).sub.n  formula (A1)

(T-).sub.nQ.sup.1-R.sup.2-L.sup.1-R.sup.1—O—(R.sup.f1O).sub.m—R.sup.1-L.sup.1-R.sup.2-Q.sup.1(-T).sub.n  formula (A2)

In the formulae, symbols are as defined in the description.

A mixture of polymers (A) and (B), each of the polymers (A) and (B) having a polyoxyalkylene main chain structure and a terminal structure bonded to an end of the main chain structure, is provided. The terminal structures include hydrolyzable silyl groups and further include terminal olefin groups and/or internal olefin groups. The number of the terminal structures per molecule of the polymer (A) is 1.5 or more on average and the number of the terminal structures per molecule of the polymer (B) is 1.2 or less on average. In each of the polymers (A) and (B), the total number of the hydrolyzable silyl, terminal olefin, and internal olefin groups is more than 1.0 on average per terminal structure. In the whole mixture, the percentage of the hydrolyzable silyl groups to the total of the hydrolyzable silyl, terminal olefin, and internal olefin groups is from 40 to 75%.

A tire comprises an interior surface and an exterior surface, an accommodating region arranged on one of said interior and exterior surfaces, an adhesive layer arranged on the accommodating region and a member attached to the accommodating region by the adhesive layer, in which the adhesive layer is based on a silanized polyether.