The present application discloses interlayers comprising novel polyesteramides comprising diols with tunable properties based on the monomers and monomer ratios used to prepare the polyesteramides and varying the reaction conditions. The interlayers have improved properties and can be used in many different applications.

Amine-substituted copolymers that may include an amine-substituted 2-amino-ethan-1-ol moiety. Polyamic acids and polyimides, which may be formed by contacting an amine substituted copolymer with a dianhydride, or a dianhydride and a diamine. Articles, such as wires, having a surface on which a polyimide is disposed. Methods for forming polymers.

A polymer being a product of reactants including a diamine and a monomer represented by Chemical Formula 1: ##STR00001##
wherein, in Chemical Formula 1, R.sup.1, R.sup.2, o, p, L.sup.1, A.sup.1, R.sup.a, m, and n are the same as defined in the detailed description.

The purpose of the present invention is to provide a, polyimide film having high transparency and improved bending resistance against multiple times of bending, and a varnish capable of providing such a polyimide film. The varnish according to the present invention contains a polymer (α) and a solvent (β). The polymer (α) is polyimide or a polyimide precursor. The varnish further contains a typical metal element having an atomic weight of 26-201 except alkali metals and alkaline earth metals, or at least one metal element among transition metal elements having an atomic weight of 26-201 or less. At least one of the metal elements contained in the varnish is present in an amount of 0.05-500 ppm relative to the polymer (α).

A negative-type photosensitive resin composition that has a satisfactory imidization rate and can yield a resin layer with high chemical resistance, even under low-temperature curing conditions of 200° C. or below, the negative-type photosensitive resin composition containing a photopolymerization initiator (B) in a proportion of 0.1 part by mass to 20 parts by mass with respect to 100 parts by mass of a polyimide precursor (A), the polyimide precursor (A) being a polyamic acid ester or polyamic acid salt with a specific structure, and the weight-average molecular weight (Mw) of the polyimide precursor (A) being 3,000 or greater and less than 16,000, in terms of polystyrene, according to gel permeation chromatography (GPC).

A method of making polyetherimide comprising reacting a first diamine having four bonds between the amine groups, a second diamine having greater than or equal to five bonds between the amine groups, 4-halophthalic anhydride and 3-halophthalic in the presence of a solvent and a polymer additive to produce a mixture comprising 3,3′-bis(halophthalimide)s, 3,4′-bis(halophthalimide)s, 4,4′-bis(halophthalimide)s, solvent and the polymer additive wherein the molar ratio of 3-halophthalic anhydride to 4-halophthalic anhydride is 98:02 to 50:50 and the molar ratio of the first diamine to the second diamine is 98:02 to 02:98; and reacting the mixture with an alkali metal salt of a dihydroxy aromatic compound to produce a polyetherimide having a cyclics content less than or equal to 5 weight percent, based on the total weight of the polyetherimide, wherein the polymer additive dissolves in the solvent at the imidization reaction temperature and pressure.

A method for manufacturing a polyimide composite film for a flexible metal-clad substrate includes the following steps, providing a polyamide acid solution; providing fluorine polymer particles and mixing the fluorine polymer particles with a dispersant and an organic solution to prepare a fluorine polymer particle dispersion; forming a colloidal polyimide film from the polyamide acid solution; and coating the colloidal polyimide film with the fluorine polymer particle dispersion and then performing baking to form a polyimide composite film.

Disclosed herein are a polyimide film for graphite sheets, a method of fabricating the same, and a graphite sheet fabricated using the same. The polyimide film is fabricated by imidizing a polyamic acid formed by reaction between a dianhydride monomer and a diamine monomer, wherein the reaction is carried out in the presence of a metal compound and the polyamic acid forms a chelate with metal ions.

The embodiments provide a polyamide-imide-based film that comprises a polyamide-imide-based polymer and has an RC value of 0.96 to 1.03 as represented by the following Equation 1, whereby it is uniform in quality and excellent in mechanical properties and optical properties, a process for preparing the same, and a cover window and a display device comprising the same. <Equation 1>RC=CTE.sub.MD/CTE.sub.TD In Equation 1, CTE.sub.MD is an average value of the coefficients of thermal expansion (ppm/° C.) in the MD direction of the film, CTE.sub.TD is an average value of the coefficients of thermal expansion (ppm/° C.) in the TD direction of the film, and the average value is an average of the coefficients of thermal expansion measured at six points in total, in which two arbitrary points are selected in each of region N, region C, and region S partitioned in the TD direction of the film.

The invention pertains to a polyamide-imide (PAI) polymer comprising recurring units according to any of formulae (I) and (II) wherein: Z is a cycloaliphatic moiety selected from the group consisting of substituted or unsubstituted, monocyclic or polycyclic groups having 5 to 50 carbon atoms, preferably 6 to 18 carbon atoms; R is a divalent cycloaliphatic moiety selected from the group consisting of substituted or unsubstituted, monocyclic or polycyclic groups having 5 to 50 carbon atoms, preferably 6 to 20 carbon atoms; m and n are, independently from each other, integers from 0 to 10.

##STR00001##