Provided are a thermosetting resin composition containing polyester amide acid (A), epoxy compound (B) having a fluorene skeleton, epoxy curing agent (C) and colorant (D), and the thermosetting resin composition capable of forming a cured film having an excellent balance of satisfactory hardness and adhesion to glass under high-temperature conditions, and also an application of the thermosetting resin composition.

The present invention relates to poly(aryl ether) polymers which can for example be used in lithographic processes for the photofabrication of three-dimensional (3D) articles. The invention further relates to compositions including these poly(aryl ether) polymers. Still further, the invention relates to lithographic methods to form 3D articles or objects that incorporate the aforementioned polymer compositions.

A polyimide copolymer according to an embodiment of the present disclosure includes a plurality of structural units. The plurality of structural units include a structural unit derived from dianhydride having an alicyclic structure and a structural unit derived from aromatic diamine including an ether group, thereby mechanical properties, thermal stability and optical characteristics of the polyimide film may be improved.

Provided is a layered product that uses a high temperature-resistant transparent film having sufficient heat resistance, and that is capable of being mechanically released from an inorganic substrate after various processes are performed on the inorganic substrate since the adhesive strength between the high temperature-resistant transparent film and the inorganic substrate is appropriately weak, and that is less warped along with the inorganic substrate. In this layered product, no adhesive is used between the high temperature-resistant transparent film and the inorganic substrate, the release strength between the high temperature-resistant transparent film and the inorganic substrate is at most 0.3 N/cm, and the warpage amount of the layered product when heated at 300° C. is at most 400 .Math.m.

A method of making polyetherimide comprising reacting a first diamine having four bonds between the amine groups, a second diamine having greater than or equal to five bonds between the amine groups, 4-halophthalic anhydride and 3-halophthalic in the presence of a solvent and a polymer additive to produce a mixture comprising 3,3′-bis(halophthalimide)s, 3,4′-bis(halophthalimide)s, 4,4′-bis(halophthalimide)s, solvent and the polymer additive wherein the molar ratio of 3-halophthalic anhydride to 4-halophthalic anhydride is 98:02 to 50:50 and the molar ratio of the first diamine to the second diamine is 98:02 to 02:98; and reacting the mixture with an alkali metal salt of a dihydroxy aromatic compound to produce a polyetherimide having a cyclics content less than or equal to 5 weight percent, based on the total weight of the polyetherimide, wherein the polymer additive dissolves in the solvent at the imidization reaction temperature and pressure.

Provided are a composition for forming a polyimide film for a cover window which may satisfy performance required for an advanced cover window, a method for preparing the same, and a use thereof. According to an implementation, a polyimide film for a cover window, which has excellent visibility without optical stain while colorless and transparent optical properties were not deteriorated and has excellent heat resistance and mechanical properties, and thus, is for use in optical applications, may be provided. In addition, a polyimide film for a cover window according to an implementation may be useful in various display devices.

An embodiment relates to a polyimide based film for a cover window that may satisfy required performance of an advanced cover window, and a use thereof, and the polyimide based film for a cover window according to the embodiment has excellent visibility without optical stains without deterioration in colorless and transparent optical physical properties, and excellent heat resistance and mechanical physical properties, and thus, may be usefully used for optical applications or the purpose of replacing existing tempered glass. In addition, the polyimide based film for a cover window according to an embodiment may be usefully used in a multilayer structure and a display device.

The present invention relates to a transparent polyimide film containing a polyimide and a phosphate ester. The content of the phosphate ester based on 100 parts by mass of the polyimide is 3 parts by mass or more, preferably 5 to 100 parts by mass. It is preferable to use a phosphate ester that has a high birefringence reduction effect and with which a decrease in the tensile modulus of the film is small. In production of the polyimide film, it is preferable to employ a method in which: a solvent-soluble polyimide resin and a phosphate ester are dissolved in an organic solvent exhibiting solubility with respect to the polyimide resin to prepare a polyimide solution; the polyimide solution is applied onto a substrate; and the organic solvent is removed.

A tetracarboxylic dianhydride represented by the following general formula (1): ##STR00001##
[in the formula (1), R.sup.1, R.sup.2, and R.sup.3 each independently represent a hydrogen atom and the like, and n represents an integer of 0 to 12], wherein a ratio of a summed amount of a specific stereoisomer (A) and a specific stereoisomer (B) is 50% by mole or more relative to a total amount of stereoisomers based on three-dimensional configurations of two norbornane rings in the general formula (1), and a content ratio of the stereoisomer (A) is 30% by mole or more relative to the total amount of the stereoisomers.

The present invention provides a polyimide film, which comprises a polyimide having a structure represented by formula (I):

##STR00001## in which A is a residue group of an aromatic diamine containing a sulfonyl group in its main chain moiety, R.sub.1 is a residue group of an aromatic dianhydride, R.sub.2 is a residue group of an aliphatic dianhydride, m and n are each independently a positive integer, a diamine monomer constituting the polyimide is only composed of the aromatic diamine containing the sulfonyl group in its main chain moiety, and the polyimide is surface-dried at 75° C. to 155° C. in the process of forming the polyimide film. The polyimide film of the present invention has transparency and UV absorption properties.