The present invention relates to a resin composition containing a compound having a maleimido group, a divalent group having at least two imido bonds and a saturated or unsaturated divalent hydrocarbon group.

Polymer resins for the vat photopolymerization of thermoplastics are provided, in particular for the vat photopolymerization of thermoplastics with exception thermal stability and mechanical properties. In some aspects, the polymer resins are prepared by ring opening of an aromatic dianhydride with an alcohol containing an acrylate or methacrylate to produce a photocrosslinkable diacid monomer; conversion of the photocrosslinkable diacid monomer to a photocrosslinkable diacyl chloride; and polymerization of the photocrosslinkable diacyl chloride with an aromatic diamine to produce a photocrosslinkable precursor polymer. Upon crosslinking and drying, a thermal imidization can yield aromatic polyimide polymers with high yield and with micron-scale structural resolution.

Polymer resins for the vat photopolymerization of thermoplastics are provided, in particular for the vat photopolymerization of thermoplastics with exception thermal stability and mechanical properties. In some aspects, the polymer resins are prepared by ring opening of an aromatic dianhydride with an alcohol containing an acrylate or methacrylate to produce a photocrosslinkable diacid monomer; conversion of the photocrosslinkable diacid monomer to a photocrosslinkable diacyl chloride; and polymerization of the photocrosslinkable diacyl chloride with an aromatic diamine to produce a photocrosslinkable precursor polymer. Upon crosslinking and drying, a thermal imidization can yield aromatic polyimide polymers with high yield and with micron-scale structural resolution.

Branched amorphous polyamide (co)polymers having a backbone formed by reacting a reaction mixture including at least 25 mol % of a di-amine selected from a secondary di-amine, a branched di-amine, or a combination thereof; and an aliphatic acid blend including a branched aliphatic dimer acid and a branched aliphatic trimer acid. The molar equivalent ratio of the di¬ amine to the aliphatic acid blend is 0.9-1.1. Preferably, the branched amorphous polyamide (co)polymer is not telechelic. The branched amorphous polyamide (co)polymer preferably exhibits one or more of a shear modulus of from 10,000 to 500,000 Pa at 70° C., a complex viscosity of greater than 1,000,000 mPa*s at 70° C., a glass transition temperature of less than 25° C., or a number average molecular weight of greater than 10,000 Da. Biodegradable and/or compostable adhesive articles including the branched amorphous polyamide (co)polymer also are disclosed.

A resin composition, comprising: a modified maleimide resin (A), an active ester resin (B), and an epoxy resin (C); the modified maleimide resin (A) is obtained by means of reacting a maleimide compound (M) having at least two maleimide groups/molecules with an amine compound (N1) having at least one primary amine group/molecule and an amine compound (N2) having at least two primary amine groups/molecules, and the molecular weight distribution is: molecules having a molecular weight between 1000 and 4500 account for 25-60% the total number of molecules.

The present invention provides a resin composition which has excellent handleability and which provides a cured product having excellent toughness and heat resistance. The present invention relates to a thermosetting resin composition including an allyl compound (A) containing at least two or more allyl groups and one or more benzene rings in a molecule, a maleimide compound (B) containing at least two or more maleimide groups in a molecule, a thiol compound (C) containing at least two or more thiol groups in a molecule, and a cyclic compound (D) containing at least two or more hydroxyl groups in a molecule.

Curable polyimides with very good dielectric properties have been prepared. These materials also are ideal for being transformed into flexible films that are ready to be laminated for example between copper foils for applications such as copper clad laminates.

A film forming material for lithography comprising a maleimide resin represented by the following formula (1A)

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An amide acid oligomer (AAO) solution, methods of making the same, powder, AAO solution prepregs, AAO dry prepreg, imide prepregs, and fiber reinforced polyimide composites with high temperature resistance and excellent mechanical properties are disclosed herein. In some embodiments, a method of making an AAO solution includes dissolving an aromatic diamine and an aromatic tetracarboxylic compound in a solvent to form a mixture, wherein the solvent has a boiling point of less than 150° C.; stirring the mixture at a temperature ranging from about 5° C. to about 60° C. for about I hour to about 24 hours to form a reaction solution; adding unsaturated acid anhydride to the reaction solution; and stirring the reaction solution at a temperature ranging from about 5° C. to about 60° C. for about 1 minute to about 180 minutes to form an amide acid oligomer solution, the amide acid oligomer solution having amide acid oligomer in the solvent.

A polyimide composition includes 1 to 99 weight percent, preferably 70 to 99 weight percent, more preferably 75 to 95 weight percent of a first polyimide; and 1 to 99 weight percent, preferably 1 to 30 weight percent, more preferably 2 to 25 weight percent of a second polyimide, wherein the first polyimide and the second polyimide are different, and wherein the polyimide composition has a melt flow rate that is greater than a melt flow rate of the first polyimide and less than a melt flow rate of the second polyimide; an apparent viscosity that is less than an apparent viscosity of the first polyimide and less than an apparent viscosity of the second polyimide; and a notched Izod impact strength that is greater than a notched Izod impact strength of the first polyimide and greater than a notched Izod impact strength of the second polyimide.