Reactive ammonium carboxyl ate salts, polyamide amic acid oligomers, and polyamideimide oligomers are made from at least one aromatic diamine, at least one aromatic di-, tri-, or tetra-functional carboxylic acid or functional equivalent thereof, and at least one crosslinkable monomer or crosslinkable end-capper. The crosslinkable monomer or crosslinkable end-capper is reactive with the at least one aromatic diamine or at least one di-, tri- or tetra-functional aromatic carboxylic acid or functional equivalent thereof and has at least one unreacted functional group capable of chain extension and crosslinking after formation of the reactive polyamideimide oligomer. The reactive polyamide amic acid and polyamideimide oligomers have a number average molecular weight (M.sub.n) of about 1,000 to about 10,000 g/mol, calculated using the Carothers equation. The reactive ammonium carboxyl ate salts, polyamide amic acid oligomers, and polyamideimide oligomers are useful in a wide variety of functional materials, manufacturing methods, and articles.

One embodiment relates to a method for preparing a polyamide-imide film which is colorless and transparent and has good mechanical properties, easily and efficiently in terms of yield. Particularly, the embodiment relates to a preparation method capable of obtaining a polyamide-imide film of which the optical characteristics, mechanical properties and flexibility are harmoniously improved without complicated processes, by controlling the amount of imide repeating units and amide repeating units constituting the polyamide-imide film.

One embodiment relates to a method for preparing a polyamide-imide film which is colorless and transparent and has good mechanical properties, easily and efficiently in terms of yield. Particularly, the embodiment relates to a preparation method capable of obtaining a polyamide-imide film of which the optical characteristics, mechanical properties and flexibility are harmoniously improved without complicated processes, by controlling the amount of imide repeating units and amide repeating units constituting the polyamide-imide film.

An embodiment can provide a polyamide-imide film, which has particular punching properties, is colorless and transparent and has excellent mechanical properties and optical properties, and a method for preparing same. The polyamide-imide film comprises a polyamide-imide polymer, which is formed by means of polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, and satisfies the condition of general formula (1) below. General formula (1) 4≤X/Y≤12 X: the maximum hole diameter (mm) comprising cracks when the film is punched at 10 mm/min using a 2.5 mm spherical tip by means of a UTM compression mode Y: the modulus (GPa) of the film.

An embodiment can provide a polyamide-imide film, which has particular punching properties, is colorless and transparent and has excellent mechanical properties and optical properties, and a method for preparing same. The polyamide-imide film comprises a polyamide-imide polymer, which is formed by means of polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, and satisfies the condition of general formula (1) below. General formula (1) 4≤X/Y≤12 X: the maximum hole diameter (mm) comprising cracks when the film is punched at 10 mm/min using a 2.5 mm spherical tip by means of a UTM compression mode Y: the modulus (GPa) of the film.

An insulated conductor of the present invention is an insulated conductor having a conductor and an insulating film provided on a surface of the conductor, in which the insulating film has a low-concentration fluorine layer disposed on a surface side of the conductor and a high-concentration fluorine layer disposed on at least a part of an outside surface of the low-concentration fluorine layer, the low-concentration fluorine layer includes a cured product of a thermosetting resin and a fluororesin and has a fluorine atom content relatively lower than that of the high-concentration fluorine layer, and the high-concentration fluorine layer includes a cured product of a thermosetting resin and a fluororesin and has a fluorine atom content relatively higher than that of the low-concentration fluorine layer.

Provided is a layered product that uses a high temperature-resistant transparent film having sufficient heat resistance, and that is capable of being mechanically released from an inorganic substrate after various processes are performed on the inorganic substrate since the adhesive strength between the high temperature-resistant transparent film and the inorganic substrate is appropriately weak, and that is less warped along with the inorganic substrate. In this layered product, no adhesive is used between the high temperature-resistant transparent film and the inorganic substrate, the release strength between the high temperature-resistant transparent film and the inorganic substrate is at most 0.3 N/cm, and the warpage amount of the layered product when heated at 300° C. is at most 400 .Math.m.

Provided is a layered product that uses a high temperature-resistant transparent film having sufficient heat resistance, and that is capable of being mechanically released from an inorganic substrate after various processes are performed on the inorganic substrate since the adhesive strength between the high temperature-resistant transparent film and the inorganic substrate is appropriately weak, and that is less warped along with the inorganic substrate. In this layered product, no adhesive is used between the high temperature-resistant transparent film and the inorganic substrate, the release strength between the high temperature-resistant transparent film and the inorganic substrate is at most 0.3 N/cm, and the warpage amount of the layered product when heated at 300° C. is at most 400 .Math.m.

To provide an optical film having excellent visibility in the wide angle direction. An optical film including at least one resin selected from the group consisting of a polyimide-based resin and a polyamide-based resin, wherein the optical film satisfies Formula (1):
0≤Ts≤0.35  (1)
wherein Ts represents a scattered light ratio (%) and is defined as Ts=Td/Tt×100, Td and Tt represent a diffuse light transmittance (%) and a total light transmittance (%), measured in accordance with JIS K-7136, respectively.

An object of the present invention is to provide: a compound containing an imide group which is not only cured under film formation conditions of inert gas as well as air, generates no by-product and has excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but can also form an organic underlayer film with favorable adhesion to a substrate. The present invention provides a material for forming an organic film, including: (A) a compound for forming an organic film shown by the following general formula (1A) or (1B); and (B) an organic solvent, ##STR00001##
noting that in the general formula (1A), when W.sub.1 represents any of ##STR00002##
R.sub.1 does not represent any of ##STR00003##