The invention generally relates to shape memory films that are tri-functionally crosslinked and that comprise multiple, non-terminal, phenylethynyl moieties. In addition, the present invention relates methods of fabricating such films. Due to the improved properties of such SMPs, the SMP designer can program in to the SMP thermomechanical property enhancements that make the SMP suitable, among other things, for advanced sensors, high temperature actuators, responder matrix materials and heat responsive packaging.

The invention generally relates to shape memory films that are tri-functionally crosslinked and that comprise multiple, non-terminal, phenylethynyl moieties. In addition, the present invention relates methods of fabricating such films. Due to the improved properties of such SMPs, the SMP designer can program in to the SMP thermomechanical property enhancements that make the SMP suitable, among other things, for advanced sensors, high temperature actuators, responder matrix materials and heat responsive packaging.

The present invention relates to a method for manufacturing a polyimide-based film and a polyimide-based film manufactured thereby and, particularly, to a method for manufacturing a polyimide-based film and a polyimide-based film manufactured thereby, wherein the polyimide-based film is useful as a cover substrate for a flexible electronic device since flexure characteristics thereof, represented by yield elongation, are excellent.

Provided is a method for producing a material that suppresses a decrease in the life of an insulation against surge voltage, that is, a material that provides a long dielectric breakdown lifetime. The method is a method for producing a fullerene-derivative-containing resin composition containing a fullerene derivative and a resin that has an affinity for a polar solvent, including: a step (I) of dispersing a fullerene derivative in a polar solvent; and a step (II) of mixing the polar solvent in which the fullerene derivative is dispersed with a resin that has an affinity for the polar solvent.

This invention relates to a polyamide-imide precursor, a polyamide-imide obtained by imidizing the same, a polyamide-imide film, and an image display device including the film. The polyamide-imide precursor includes, in a molecular structure thereof, a first block, obtained by copolymerizing monomers including dianhydride and diamine, and a second block, obtained by copolymerizing monomers including an aromatic dicarbonyl compound and aromatic diamine. The dianhydride includes biphenyltetracarboxylic acid dianhydride (BPDA) and 2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), and the diamine includes bistrifluoromethylbenzidine (TFDB).

This invention relates to a polyamide-imide precursor, a polyamide-imide obtained by imidizing the same, a polyamide-imide film, and an image display device including the film. The polyamide-imide precursor includes, in a molecular structure thereof, a first block, obtained by copolymerizing monomers including dianhydride and diamine, and a second block, obtained by copolymerizing monomers including an aromatic dicarbonyl compound and aromatic diamine. The dianhydride includes biphenyltetracarboxylic acid dianhydride (BPDA) and 2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), and the diamine includes bistrifluoromethylbenzidine (TFDB).

The present invention relates to a polyamide-imide precursor, a polyamide-imide obtained by imidizing the same, a polyamide-imide film, and an image display device including the film. The polyamide-imide precursor includes, in a molecular structure thereof, a first block, obtained by copolymerizing monomers including dianhydride and diamine, a second block, obtained by copolymerizing monomers including an aromatic dicarbonyl compound and the diamine, and a third block, obtained by copolymerizing monomers including the aromatic dicarbonyl compound and aromatic diamine. The dianhydride for forming the first block includes 2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), and the diamine for forming the first block and the second block includes 9,9-bis(3-fluoro-4-aminophenyl)fluorene (FFDA).

The present invention relates to a polyamide-imide precursor, a polyamide-imide obtained by imidizing the same, a polyamide-imide film, and an image display device including the film. The polyamide-imide precursor includes, in a molecular structure thereof, a first block, obtained by copolymerizing monomers including dianhydride and diamine, a second block, obtained by copolymerizing monomers including an aromatic dicarbonyl compound and the diamine, and a third block, obtained by copolymerizing monomers including the aromatic dicarbonyl compound and aromatic diamine. The dianhydride for forming the first block includes 2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), and the diamine for forming the first block and the second block includes 9,9-bis(3-fluoro-4-aminophenyl)fluorene (FFDA).

The invention aims to provide a photosensitive colored resin composition and a heat resistant colored resin film produced therefrom that has the function of absorbing light in the shorter visible wavelength range with high sensitivity to serve effectively as planarizing film, insulation layer, and barrier rib used in organic luminescence apparatuses and display elements and the function of reducing external light reflection. The photosensitive colored resin composition includes an alkali-soluble resin (a), a photosensitive compound (b), and a compound (c) having an absorption maximum in the wavelength range of 400 nm or more and less than 490 nm, the photosensitive compound (b) containing a photosensitive compound (b1), the photosensitive compound (b1) being such that its maximum absorption wavelength in the range of 350 nm or more and 450 nm or less is located within the wavelength range of 350 nm or more and 390 nm or less.

Reactive ammonium carboxyl ate salts, polyamide amic acid oligomers, and polyamideimide oligomers are made from at least one aromatic diamine, at least one aromatic di-, tri-, or tetra-functional carboxylic acid or functional equivalent thereof, and at least one crosslinkable monomer or crosslinkable end-capper. The crosslinkable monomer or crosslinkable end-capper is reactive with the at least one aromatic diamine or at least one di-, tri- or tetra-functional aromatic carboxylic acid or functional equivalent thereof and has at least one unreacted functional group capable of chain extension and crosslinking after formation of the reactive polyamideimide oligomer. The reactive polyamide amic acid and polyamideimide oligomers have a number average molecular weight (M.sub.n) of about 1,000 to about 10,000 g/mol, calculated using the Carothers equation. The reactive ammonium carboxyl ate salts, polyamide amic acid oligomers, and polyamideimide oligomers are useful in a wide variety of functional materials, manufacturing methods, and articles.