The present application discloses interlayers comprising novel polyesteramides comprising diols with tunable properties based on the monomers and monomer ratios used to prepare the polyesteramides and varying the reaction conditions. The interlayers have improved properties and can be used in many different applications.

The present application discloses interlayers comprising novel polyesteramides comprising diols with tunable properties based on the monomers and monomer ratios used to prepare the polyesteramides and varying the reaction conditions. The interlayers have improved properties and can be used in many different applications.

Provided are a thermosetting resin composition containing polyester amide acid (A), epoxy compound (B) having a fluorene skeleton, epoxy curing agent (C) and colorant (D), and the thermosetting resin composition capable of forming a cured film having an excellent balance of satisfactory hardness and adhesion to glass under high-temperature conditions, and also an application of the thermosetting resin composition.

A coating composition comprising a resin material comprising polyester imide polymer one or more titanate material; and one or more OH reactive cross linking material.

A coating composition comprising a resin material comprising polyester imide polymer one or more titanate material; and one or more OH reactive cross linking material.

A polymer being a product of reactants including a diamine and a monomer represented by Chemical Formula 1: ##STR00001##
wherein, in Chemical Formula 1, R.sup.1, R.sup.2, o, p, L.sup.1, A.sup.1, R.sup.a, m, and n are the same as defined in the detailed description.

A polymer being a product of reactants including a diamine and a monomer represented by Chemical Formula 1: ##STR00001##
wherein, in Chemical Formula 1, R.sup.1, R.sup.2, o, p, L.sup.1, A.sup.1, R.sup.a, m, and n are the same as defined in the detailed description.

The present disclosure is directed to systems and methods for providing a dielectric layer on a semiconductor substrate capable of supporting very high density interconnects (i.e., ≥100 IO/mm). The dielectric layer includes a maleimide polymer in which a thiol-terminated functional group crosslinks with an epoxy resin. The resultant dielectric material provides a dielectric constant of less than 3 and a dissipation factor of less than 0.001. Additionally, the thiol functional group forms coordination complexes with noble metals present in the conductive structures, thus by controlling the stoichiometry of epoxy to polyimide, the thiol-polyimide may beneficially provide an adhesion enhancer between the dielectric and noble metal conductive structures.

The present disclosure is directed to systems and methods for providing a dielectric layer on a semiconductor substrate capable of supporting very high density interconnects (i.e., ≥100 IO/mm). The dielectric layer includes a maleimide polymer in which a thiol-terminated functional group crosslinks with an epoxy resin. The resultant dielectric material provides a dielectric constant of less than 3 and a dissipation factor of less than 0.001. Additionally, the thiol functional group forms coordination complexes with noble metals present in the conductive structures, thus by controlling the stoichiometry of epoxy to polyimide, the thiol-polyimide may beneficially provide an adhesion enhancer between the dielectric and noble metal conductive structures.

Rigid polyurethane or polyisocyanurate foams, polyester polyols used to produce them, and methods for formulating the foams are disclosed. The foams comprise a reaction product of a polyisocyanate, a polyester polyol, water, a surfactant, a catalyst and optional ingredients. The polyester polyols comprise a phthalimide-containing polyacid, a phthalimide-containing polyol, or a combination thereof. Rigid foams produced from the polyester polyols exhibit higher thermal stability and/or greater intumescence when compared with foams made from other polyester polyols. The phthalimide-containing polyester polyols should allow formulators to improve the flammability performance of rigid foams with reduced levels of flame retardants and/or lower index and should facilitate the production of thinner insulation panels.