Provided is a stable lignin-phenol blend for use in lignin modified phenol-formaldehyde resins comprising lignin in an amount between 10-80 wt %, phenol in an amount between 15-90 wt %, and a solubilizer in an amount between 0%-25 wt %.

Provided is a stable lignin-phenol blend for use in lignin modified phenol-formaldehyde resins comprising lignin in an amount between 10-80 wt %, phenol in an amount between 15-90 wt %, and a solubilizer in an amount between 0%-25 wt %.

Aromatic alcohol-lignin-aldehyde resins and process for making and using same. In some examples, a process for making a resin can include heating a first mixture that includes a lignin, an aromatic alcohol, and a base compound to produce a second mixture that can include an activated lignin, the aromatic alcohol, and the base compound. The second mixture can be heated with an aldehyde to produce a third mixture that can include an aromatic alcohol-lignin-aldehyde resin and unreacted free aldehyde. In some examples, an aromatic alcohol-lignin-aldehyde resin can be or include a co-polymer of an activated lignin, an aromatic alcohol, and an aldehyde. A weight ratio of the activated lignin to the aromatic alcohol can be about 20:80 to about 95:5.

Aromatic alcohol-lignin-aldehyde resins and process for making and using same. In some examples, a process for making a resin can include heating a first mixture that includes a lignin, an aromatic alcohol, and a base compound to produce a second mixture that can include an activated lignin, the aromatic alcohol, and the base compound. The second mixture can be heated with an aldehyde to produce a third mixture that can include an aromatic alcohol-lignin-aldehyde resin and unreacted free aldehyde. In some examples, an aromatic alcohol-lignin-aldehyde resin can be or include a co-polymer of an activated lignin, an aromatic alcohol, and an aldehyde. A weight ratio of the activated lignin to the aromatic alcohol can be about 20:80 to about 95:5.

A solid phloroglucinolic resin comprises reacting a phloroglucinolic compound and a ketone in the presence of an acid catalyst. The solid phloroglucinolic resin formed includes multiple phloroglucinolic units defined by formula (I)

##STR00001##

wherein at least one of R1, R2, and R3 combines with a second phloroglucinolic unit to form a di-substituted methylene bridge, wherein the second one of R1, R2, and R3 is a hydrogen atom or combines with a third phloroglucinolic unit to form another di-substituted methylene bridge, and wherein the third one of R1, R2 and R3 is a hydrogen atom.

A material for forming a filling film for inhibiting semiconductor substrate pattern collapse contains: (A) a polymer having a structural unit shown by the following general formula (1); (B) a residual-solvent removal promoter containing a compound shown by the following general formula (2); and (C) an organic solvent. A ratio Mw/Mn of a weight-average molecular weight Mw and a number-average molecular weight Mn of the polymer (A) in terms of polystyrene by a gel permeation chromatography method is 2.50≤Mw/Mn≤9.00. The residual-solvent removal promoter (B) is contained in an amount of 0.1 to 40 parts by mass based on 100 parts by mass of the polymer (A). The material for forming a filling film for inhibiting semiconductor substrate pattern collapse contains no acid generator.

##STR00001##

##STR00002##

A method of forming a pattern, the method comprising: applying a photoresist underlayer composition over a substrate to provide a photoresist underlayer; forming a photoresist layer over the photoresist underlayer; patterning the photoresist layer; and transferring a pattern from the patterned photoresist layer to the photoresist underlayer. The photoresist underlayer composition includes a polymer that includes a repeating unit represented by Formula 1 as described herein, a compound including a substituent group represented by Formula 2 as described herein, and a solvent.

##STR00001##

Provided is a compound containing a phenolic hydroxy group which has excellent heat resistance, a resist composition which has excellent thermal decomposition resistance, optical sensitivity and resolution, and a composition for a resist underlayer coating which has excellent thermal decomposition resistance and dry etching resistance. The compound containing a phenolic hydroxy group has a molecular structure represented by Structural Formula (1) below: ##STR00001##
wherein R.sup.1 is a hydrogen atom, an alkyl group or an aryl group, n is an integer of 2 to 10, R.sup.2 is any one of an alkyl group, an alkoxy group, an aryl group, an aralkyl group and a halogen atom, m is an integer of 0 to 4, and when m is 2 or greater, a plurality of R.sup.2's may be the same as or different from each other and may be bonded to either one of two aromatic rings of the naphthylene skeleton.

Provided is a compound containing a phenolic hydroxy group which has excellent heat resistance, a resist composition which has excellent thermal decomposition resistance, optical sensitivity and resolution, and a composition for a resist underlayer coating which has excellent thermal decomposition resistance and dry etching resistance. The compound containing a phenolic hydroxy group has a molecular structure represented by Structural Formula (1) below: ##STR00001##
wherein R.sup.1 is a hydrogen atom, an alkyl group or an aryl group, n is an integer of 2 to 10, R.sup.2 is any one of an alkyl group, an alkoxy group, an aryl group, an aralkyl group and a halogen atom, m is an integer of 0 to 4, and when m is 2 or greater, a plurality of R.sup.2's may be the same as or different from each other and may be bonded to either one of two aromatic rings of the naphthylene skeleton.

A photosensitive resin composition comprises: a resin having a phenolic hydroxyl group; a photosensitive acid generator; a compound having at least one selected from the group consisting of an aromatic ring, a heterocycle and an alicycle, and at least one selected from the group consisting of a methylol group and an alkoxyalkyl group; an aliphatic compound having two or more functional groups being at least one selected from the group consisting of an acryloyloxy group, a methacryloyloxy group, a glycidyloxy group, an oxetanyl alkyl ether group, a vinyl ether group and a hydroxyl group; and a compound having at least one skeleton selected from the group consisting of an anthracene skeleton, a phenanthrene skeleton, a pyrene skeleton, a perylene skeleton, a carbazole skeleton, a phenothiazine skeleton, a xanthone skeleton, a thioxanthone skeleton, an acridine skeleton, a phenylpyrazoline skeleton, a distyrylbenzene skeleton and a distyrylpyridine skeleton, or a benzophenone compound.