A thermally conductive filler capable of exhibiting high thermal conductive properties with its specific gravity being reduced, a thermally conductive composite material and a wire harness that contains such a thermally conductive filler, and a method for forming a thermally conductive filler that can be used to form such a thermally conductive filler. A thermally conductive filler includes a hollow particle having a polar group on its surface, and a thermally conductive layer containing an inorganic compound that covers the surface of the hollow particle. Also, a thermally conductive composite material contains the thermally conductive filler and a matrix material, the thermally conductive filler being dispersed in the matrix material. Furthermore, a wire harness contains the thermally conductive composite material.

Disclosed are an anti-icing material with stealth function, a preparation method and use thereof. The anti-icing material with stealth function according to the disclosure includes an electrically insulating and thermally insulating layer, a patterned heating layer, an electrically insulating and thermally conducting layer, and a hydrophobic layer, that are disposed sequentially through stacking, wherein the patterned heating layer has a patterned hollowed-out structure.

Disclosed are an anti-icing material with stealth function, a preparation method and use thereof. The anti-icing material with stealth function according to the disclosure includes an electrically insulating and thermally insulating layer, a patterned heating layer, an electrically insulating and thermally conducting layer, and a hydrophobic layer, that are disposed sequentially through stacking, wherein the patterned heating layer has a patterned hollowed-out structure.

A polymer composition is disclosed that comprises a polymer matrix containing at least one thermotropic liquid crystalline polymer and at least one hollow inorganic filler having a dielectric constant of about 3.0 or less at a frequency of 100 MHz wherein the weight ratio of the at least one thermotropic liquid crystalline polymer to the at least one hollow inorganic filler is from about 0.1 to about 10 and wherein the polymer composition exhibits a dielectric constant of about 4 or less and a dissipation factor of about 0.02 or less, as determined at a frequency of 10 GHz.

A polymer composition is disclosed that comprises a polymer matrix containing at least one thermotropic liquid crystalline polymer and at least one hollow inorganic filler having a dielectric constant of about 3.0 or less at a frequency of 100 MHz wherein the weight ratio of the at least one thermotropic liquid crystalline polymer to the at least one hollow inorganic filler is from about 0.1 to about 10 and wherein the polymer composition exhibits a dielectric constant of about 4 or less and a dissipation factor of about 0.02 or less, as determined at a frequency of 10 GHz.

A polymer composition is disclosed that comprises a polymer matrix containing at least one thermotropic liquid crystalline polymer and at least one hollow inorganic filler having a dielectric constant of about 3.0 or less at a frequency of 100 MHz wherein the weight ratio of the at least one thermotropic liquid crystalline polymer to the at least one hollow inorganic filler is from about 0.1 to about 10 and wherein the polymer composition exhibits a dielectric constant of about 4 or less and a dissipation factor of about 0.02 or less, as determined at a frequency of 10 GHz.

The invention relates to a hollow glass microsphere and polymer composite having enhanced viscoelastic and rheological properties.

The invention relates to a hollow glass microsphere and polymer composite having enhanced viscoelastic and rheological properties.

The invention relates to a hollow glass microsphere and polymer composite having enhanced viscoelastic and rheological properties.

The present disclosure relates to a pressure sensitive adhesive assembly comprising at least a first pressure sensitive adhesive layer comprising a hollow non-porous particulate filler material, wherein the surface of the hollow non-porous particulate filler material is provided with a hydrophobic surface modification. The present disclosure also relates to a method of manufacturing such a pressure sensitive adhesive assembly.