The present disclosure relates a photosensitive resin composition containing (A) an alkali-soluble resin having an imide bond and a phenolic hydroxyl group and (B) a compound that generates acid by light, a patterned cured film using the photosensitive resin composition, a method for producing a patterned cured film, and a semiconductor element.

Provided is a rubber composition having excellent adhesiveness to a metal member even if no cobalt salt is contained. The rubber composition contains a rubber component, a rubber-metal adhesion promoter containing Bi, and an organic acid salt of metal other than Bi, where a content of metal element other than Bi with respect to a content of Bi element (content of metal element other than Bi/content of Bi element) in the rubber composition is more than 14 and 100 or less in terms of molar ratio, a content of the rubber-metal adhesion promoter is more than 1.5 parts by mass with respect to 100 parts by mass of the rubber component, and the amount of substance of metal element other than Bi contained in the organic acid salt of metal other than Bi in the rubber composition is 0.01 mol or more.

Provided is a rubber composition having excellent adhesiveness to a metal member even if no cobalt salt is contained. The rubber composition contains a rubber component, a rubber-metal adhesion promoter containing Bi, and an organic acid salt of metal other than Bi, where a content of metal element other than Bi with respect to a content of Bi element (content of metal element other than Bi/content of Bi element) in the rubber composition is more than 14 and 100 or less in terms of molar ratio, a content of the rubber-metal adhesion promoter is more than 1.5 parts by mass with respect to 100 parts by mass of the rubber component, and the amount of substance of metal element other than Bi contained in the organic acid salt of metal other than Bi in the rubber composition is 0.01 mol or more.

A resin composition having favorable heat stability while capable of primary curing at 140° C or lower, and having excellent heat resistance after curing, and a pre-preg having excellent heat resistance while a molded product after molding maintains mechanical characteristics are provided. The resin composition of the present invention comprises a constituent element (A): a cyanate ester resin, a constituent element (B): an imidazole compound, and a constituent element (C): silica, in which an average particle size of the silica is 0.4 μm or less. The pre-preg of the present invention comprises carbon fibers, and the resin composition of the present invention.

A resin composition having favorable heat stability while capable of primary curing at 140° C or lower, and having excellent heat resistance after curing, and a pre-preg having excellent heat resistance while a molded product after molding maintains mechanical characteristics are provided. The resin composition of the present invention comprises a constituent element (A): a cyanate ester resin, a constituent element (B): an imidazole compound, and a constituent element (C): silica, in which an average particle size of the silica is 0.4 μm or less. The pre-preg of the present invention comprises carbon fibers, and the resin composition of the present invention.

A thermosetting resin composition and a prepreg are provided. The thermosetting resin composition includes a maleimide resin, a cyanate ester resin, and a crosslinking agent. The crosslinking agent is a silane-modified diallyl bisphenol compound whose structure is represented by Formula (1):

##STR00001##

In Formula (1), X is a linear or branched C1 to C6 alkyl, cycloalkyl, or sulfonyl group, R1 is a linear or branched C1 to C6 alkyl or aryl group, R2 is a C1 to C6 alkyl group, R3 is a functional group with a crosslinkable double bond, and n+m is a positive integer from 1 to 8.

A thermosetting resin composition and a prepreg are provided. The thermosetting resin composition includes a maleimide resin, a cyanate ester resin, and a crosslinking agent. The crosslinking agent is a silane-modified diallyl bisphenol compound whose structure is represented by Formula (1):

##STR00001##

In Formula (1), X is a linear or branched C1 to C6 alkyl, cycloalkyl, or sulfonyl group, R1 is a linear or branched C1 to C6 alkyl or aryl group, R2 is a C1 to C6 alkyl group, R3 is a functional group with a crosslinkable double bond, and n+m is a positive integer from 1 to 8.

The present invention provides a resin composition which is highly sensitive and exhibits high chemical resistance even in the case of being baked at a low temperature of 250° C. or less and can suppress the generation of outgas after curing. The present invention is a resin composition which contains (a) an alkali-soluble resin containing polyimide, polybenzoxazole, polyamide-imide, a precursor of any one of these compounds and/or a copolymer of these compounds and (b) an alkali-soluble resin having a monovalent or divalent group represented by the following general formula (1) in a structural unit and in which the modification rate of a phenolic hydroxyl group in the alkali-soluble resin (b) is 5% to 50%. ##STR00001##
(In general formula (1), O represents an oxygen atom. R.sup.1 represents a hydrogen atom or a hydrocarbon group which has 1 to 20 carbon atoms and may be substituted and R.sup.2 represents an alkyl group having 1 to 5 carbon atoms. s and t each independently represent an integer from 0 to 3. Provided that (s+t)≥1. d represents an integer from 0 to 2. u represents an integer from 1 to 2, and * represents a chemical bond.)

A resin composition contains a (A) thermoplastic component, a (B) thermosetting component, and a (C) inorganic filler, 5%-weight-reduction temperature of a hardened substance of the resin composition being 440 degrees C. or more.

A resin composition contains a (A) thermoplastic component, a (B) thermosetting component, and a (C) inorganic filler, 5%-weight-reduction temperature of a hardened substance of the resin composition being 440 degrees C. or more.