A mobile bearing prosthetic implant may include a fossa implant seated in the fossa cavity of the skull and secured to the zygomatic arch. The fossa implant may define a primary recess constructed and arranged to mimic the articular eminence of the temporal bone such that a floating bearing connected to a ramus implant may translate along the original path that the condylar head would take during movement of the jaw. The floating bearing may be constructed and arranged to move from the first jaw angle recess to the second jaw angle recess and is positionable therebetween such that a longitudinal axis of the floating bearing is perpendicular to the direction of movement of the floating bearing within the fossa implant.

A mobile bearing prosthetic implant may include a fossa implant seated in the fossa cavity of the skull and secured to the zygomatic arch. The fossa implant may define a primary recess constructed and arranged to mimic the articular eminence of the temporal bone such that a floating bearing connected to a ramus implant may translate along the original path that the condylar head would take during movement of the jaw. The floating bearing may be constructed and arranged to move from the first jaw angle recess to the second jaw angle recess and is positionable therebetween such that a longitudinal axis of the floating bearing is perpendicular to the direction of movement of the floating bearing within the fossa implant.

A rubber resin material with high dielectric constant and a metal substrate with high dielectric constant are provided. The rubber resin material with high dielectric constant includes a rubber resin composition with high dielectric constant and inorganic fillers. The rubber resin composition with high dielectric constant includes: 40 wt % to 70 wt % of a liquid rubber, 10 wt % to 30 wt % of a polyphenylene ether resin, and 20 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. A dielectric constant of the rubber resin material with high dielectric constant is higher than or equal to 2.0.

A rubber resin material with high dielectric constant and a metal substrate with high dielectric constant are provided. The rubber resin material with high dielectric constant includes a rubber resin composition with high dielectric constant and inorganic fillers. The rubber resin composition with high dielectric constant includes: 40 wt % to 70 wt % of a liquid rubber, 10 wt % to 30 wt % of a polyphenylene ether resin, and 20 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. A dielectric constant of the rubber resin material with high dielectric constant is higher than or equal to 2.0.

Provided are a thermosetting resin composition and a prepreg, laminate and printed circuit board using same. The thermosetting resin composition comprises a resin component, the resin component comprising a modified cyclic olefin copolymer having a structure as shown in formula I and another unsaturated resin. By introducing a methacrylate end group having a certain polarity into a cyclic olefin copolymer, a modified cyclic olefin copolymer is formed. The modified cyclic olefin copolymer can form a thermosetting material by means of cross-linking with itself or another unsaturated resin, whereby the bonding property can be significantly improved while retaining the excellent dielectric properties of the cyclic olefin copolymer itself. The laminate prepared using the thermosetting resin composition has good dielectric properties, a good peel strength and a good heat resistance, and can meet all the performance requirements for printed circuit board substrates in the current high-frequency and high-speed communication field.

A poroelastic biomaterial including a polyaryletherketone (PAEK) matrix polymer and a plurality of tortuous channels extending from one surface to another surface of the biomaterial is disclosed. Advantageously, the poroelastic biomaterial can have a porosity from about 5% to about 40% and high mechanical properties. The poroelastic biomaterials can be fabricated into orthopedic implant devices and can be used as a tissue scaffolds.

A poroelastic biomaterial including a polyaryletherketone (PAEK) matrix polymer and a plurality of tortuous channels extending from one surface to another surface of the biomaterial is disclosed. Advantageously, the poroelastic biomaterial can have a porosity from about 5% to about 40% and high mechanical properties. The poroelastic biomaterials can be fabricated into orthopedic implant devices and can be used as a tissue scaffolds.

A rubber resin material with high thermal conductivity and a metal substrate with high thermal conductivity are provided. The rubber resin material includes inorganic fillers and a rubber resin composition with high thermal conductivity. The rubber resin composition with high thermal conductivity includes 40 wt % to 70 wt % of a liquid rubber, 10 wt % to 30 wt % of a polyphenylene ether resin, and 20 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. The inorganic fillers undergo a surface modification process to have at least one of an acryl group and an ethylene group.

A rubber resin material with high thermal conductivity and a metal substrate with high thermal conductivity are provided. The rubber resin material includes inorganic fillers and a rubber resin composition with high thermal conductivity. The rubber resin composition with high thermal conductivity includes 40 wt % to 70 wt % of a liquid rubber, 10 wt % to 30 wt % of a polyphenylene ether resin, and 20 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. The inorganic fillers undergo a surface modification process to have at least one of an acryl group and an ethylene group.

A composition [composition (C)] comprising from 1 to 90% by weight (wt. %) of at least one poly(aryl ether ketone) [(PAEK) polymer], from 1 to 25 wt. % of at least one polyphenylsulfone polymer [(PPSU) polymer], from 1 to 90 wt. % of at least one polyethersulfone polymer [(PES)polymer], and from 0.1 to 50 wt. % of at least one reinforcing filler, where all wt. % are based on the total weight of the composition (C) and the (PES) polymer has as melt flow rate(MFR) at a temperature of 380° C. and under a load of 2.16 kg according to ASTM D1238 of greater than 35 g/10 min.