A composition includes particular amounts of a poly(phenylene ether); a poly(alkylene terephtalate); a hydrogenated block copolymer of an alkenyl aromatic monomer and a conjugated diene; a compatibilizing agent; an arc suppressant comprising a nitrogen-containing compound, a phosphorus-containing compound, or a combination thereof; glass fiber, a mineral filler; and poly(tetrafluoroethylene). The composition can be particularly useful for use in molded circuit breakers.

A composition includes particular amounts of a poly(phenylene ether); a poly(alkylene terephtalate); a hydrogenated block copolymer of an alkenyl aromatic monomer and a conjugated diene; a compatibilizing agent; an arc suppressant comprising a nitrogen-containing compound, a phosphorus-containing compound, or a combination thereof; glass fiber, a mineral filler; and poly(tetrafluoroethylene). The composition can be particularly useful for use in molded circuit breakers.

A composition useful for the injection molding of fluid engineering parts includes specific amounts of a poly(phenylene ether), a homopolystyrene, a hydrogenated block copolymer of an alkenyl aromatic monomer and a conjugated diene, a linear low density polyethylene, and a reinforcing filler. A method of making the composition and articles prepared from the composition are also described.

A composition useful for the injection molding of fluid engineering parts includes specific amounts of a poly(phenylene ether), a homopolystyrene, a hydrogenated block copolymer of an alkenyl aromatic monomer and a conjugated diene, a linear low density polyethylene, and a reinforcing filler. A method of making the composition and articles prepared from the composition are also described.

A kind of plastic is provided. With a total of 100 parts by weight, the plastic includes the following components in parts by weight: 25 to 90 parts of matrix resin; 1 to 60 parts of laser reflecting agent; and 0 to 70 parts of inorganic filler, where the inorganic filler is capable of being chemically corroded. When the matrix resin includes a resin component capable of being chemically corroded, parts by weight of the inorganic filler are greater than or equal to 0 parts; or when the matrix resin is fully a resin component incapable of being chemically corroded, parts by weight of the inorganic filler are greater than 0 parts. For the plastic, a low roughness surface can be obtained through chemical roughening, to form a desirable coating binding surface, and help implement metallization.

A poly(arylene ether) copolymer is the product of oxidative copolymerization of monomers including a monohydric phenol and a dihydric phenol of the formula

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wherein R.sup.3, R.sup.4, R.sup.5, and R.sup.6 are as defined herein. The poly(arylene ether) copolymer includes less than 0.1 weight percent of incorporated amine groups. A method of the manufacture of a poly(arylene ether) copolymer is also disclosed. A curable composition including the poly(arylene ether) copolymer and cured products derived therefrom are also described.

The present invention aims to provide resin particles that have excellent heat resistance and that, when used as base particles of conductive particles, are applicable to mounting by thermocompression bonding at low pressure to produce a connection structure having excellent connection reliability. The present invention also aims to provide conductive particles, a conductive material, and a connection structure each including the resin particles. Provided are resin particles having a 5% weight loss temperature of 350° C. or higher, a 10% K value at 25° C. of 100 N/mm.sup.2 or more and 2,500 N/mm.sup.2 or less, and a 30% K value at 25° C. of 100 N/mm.sup.2 or more and 1,500 N/mm.sup.2 or less.

A core/shell polymer material suitable for three-dimensional printing is provided. The core/shell polymer material may include at least one amorphous polymer as a core particle and at least one semicrystalline polymer as a shell material surrounding the core particle.

A polymer composition includes: from about 20 wt. % to about 80 wt. % of a polymer base resin; from about 10 wt. % to about 60 wt. % of a thermally conductive filler; and from about 5 wt. % to about 60 wt. % of a dielectric ceramic filler having a Dk of at least 20 when measured at 1.1 GHz or greater. The polymer composition exhibits a dielectric constant greater than 3.0 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150. The polymer composition exhibits a dissipation factor of less than 0.002 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150.

The present invention relates to a flame retardant resin composition having excellent flame retardancy and improved thermal deformation properties, and a flame retardant resin molded article manufactured therefrom, and provides a flame retardant resin composition including a) a base resin including a polyarylene ether-based polymer; an aromatic vinyl-based polymer and a copolymer of vinylcyan monomer-conjugated diene monomer-aromatic vinyl monomer; b) an organophosphorus-based flame retardant; c) a hypophosphite compound; and d) a sulfur-containing compound including at least two sulfur atoms, wherein b) the organophosphorus-based flame retardant, c) the hypophosphite compound and d) the sulfur-containing compound are included in a weight ratio of 15 to 24:2 to 4:2 to 5.