The present invention relates to a method for manufacturing a polyimide-based film and a polyimide-based film manufactured thereby and, particularly, to a method for manufacturing a polyimide-based film and a polyimide-based film manufactured thereby, wherein the polyimide-based film is useful as a cover substrate for a flexible electronic device since flexure characteristics thereof, represented by yield elongation, are excellent.

Thermosetting resin compositions useful for liquid compression molding encapsulation of a reconfigured wafer are provided. The so-encapsulated molded wafer offers improved resistance to warpage, compared to reconfigured wafers encapsulated with known encapsulation materials.

A polyetherimide composition comprises: a polyetherimide; and an organophosphorus stabilizer present in an amount effective to provide greater than 0.01 ppm to less than 20 ppm, preferably greater than 0.01 ppm to less than 10 ppm, and more preferably greater than 0.01 ppm to less than 4.8 ppm of phosphorus based on the total weight of the polyetherimide composition, the organophosphorus stabilizer having a molecular weight of 300 to 2,000 Daltons and a phosphorus content of 1 to 15 wt %; wherein a molded sample of the polyetherimide composition has a UL 94 V0 rating at a thickness of 1.5 mm.

A polyetherimide composition comprises: a polyetherimide; and an organophosphorus stabilizer present in an amount effective to provide greater than 0.01 ppm to less than 20 ppm, preferably greater than 0.01 ppm to less than 10 ppm, and more preferably greater than 0.01 ppm to less than 4.8 ppm of phosphorus based on the total weight of the polyetherimide composition, the organophosphorus stabilizer having a molecular weight of 300 to 2,000 Daltons and a phosphorus content of 1 to 15 wt %; wherein a molded sample of the polyetherimide composition has a UL 94 V0 rating at a thickness of 1.5 mm.

Provided is a method for producing a material that suppresses a decrease in the life of an insulation against surge voltage, that is, a material that provides a long dielectric breakdown lifetime. The method is a method for producing a fullerene-derivative-containing resin composition containing a fullerene derivative and a resin that has an affinity for a polar solvent, including: a step (I) of dispersing a fullerene derivative in a polar solvent; and a step (II) of mixing the polar solvent in which the fullerene derivative is dispersed with a resin that has an affinity for the polar solvent.

Provided is a method for producing a material that suppresses a decrease in the life of an insulation against surge voltage, that is, a material that provides a long dielectric breakdown lifetime. The method is a method for producing a fullerene-derivative-containing resin composition containing a fullerene derivative and a resin that has an affinity for a polar solvent, including: a step (I) of dispersing a fullerene derivative in a polar solvent; and a step (II) of mixing the polar solvent in which the fullerene derivative is dispersed with a resin that has an affinity for the polar solvent.

A fiber-reinforced composite material includes a matrix resin, and reinforcing fibers, in which the matrix resin includes a polyaryl ketone resin and a resin having a nitrogen atom in a repeating structural unit. A surface of the fiber-reinforced composite material includes a portion in which a contact angle with water is 60° or less.

A fiber-reinforced composite material includes a matrix resin, and reinforcing fibers, in which the matrix resin includes a polyaryl ketone resin and a resin having a nitrogen atom in a repeating structural unit. A surface of the fiber-reinforced composite material includes a portion in which a contact angle with water is 60° or less.

Provided are a coloring composition including a colorant, a first resin including a repeating unit represented by Formula (b-10), and a second resin different from the first resin, in which the second resin is at least one selected from a polyimide precursor, a polyimide resin, a polybenzoxazole precursor, a polybenzoxazole resin, or a polysiloxane resin; a film formed of the coloring composition; an optical filter; a solid-state imaging element; and an image display device. In Formula (b-10), Ar.sup.10 represents a group including an aromatic carboxyl group, L.sup.11 represents —COO— or —CONH—, L.sup.12 represents a trivalent linking group, and P.sup.10 represents a polymer chain.

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The present invention provides an amide acid oligomer which has specific composition and which is capable of providing a cured product having excellent physical properties, in particular, an excellent glass transition temperature, etc.