Patent classifications
C09D161/06
COATING FOR PROTECTING A SUBSTRATE
A mixture curable to provide a fibre reinforced coating material for protecting a substrate. The mixture comprises a phenolic resin or a polyfurfuryl alcohol resin, a hardener, a thixotropic additive, and fibres.
COATING FOR PROTECTING A SUBSTRATE
A mixture curable to provide a fibre reinforced coating material for protecting a substrate. The mixture comprises a phenolic resin or a polyfurfuryl alcohol resin, a hardener, a thixotropic additive, and fibres.
COMPOSITION CONTAINING ADDITION CONDENSATION PRODUCT, METHOD FOR PRODUCING SAME, USE OF SAME, POLYMERIZATION VESSEL, AND METHOD FOR PRODUCING POLYMER
An addition condensation product, i.e., an addition condensation product of an aromatic compound with a carbonyl compound, is obtained as a condensation reaction product in the state of uniform solution or the like, in which clumping caused by agglomeration of the condensation product of the aromatic compound with the carbonyl compound can be prevented by the presence of a surfactant at the time of the condensation reaction. In addition, a coating solution prepared by using an original solution or an adjusted solution whose viscosity is 2.0 mPa.Math.s or greater exhibits an excellent polymer scale adhesion inhibition effect when applied to an inner wall and the like of a polymerization vessel; and in addition, a low-accumulative coating film is formed when the solution is applied to an inner wall and the like of a polymerization vessel.
COMPOSITION CONTAINING ADDITION CONDENSATION PRODUCT, METHOD FOR PRODUCING SAME, USE OF SAME, POLYMERIZATION VESSEL, AND METHOD FOR PRODUCING POLYMER
An addition condensation product, i.e., an addition condensation product of an aromatic compound with a carbonyl compound, is obtained as a condensation reaction product in the state of uniform solution or the like, in which clumping caused by agglomeration of the condensation product of the aromatic compound with the carbonyl compound can be prevented by the presence of a surfactant at the time of the condensation reaction. In addition, a coating solution prepared by using an original solution or an adjusted solution whose viscosity is 2.0 mPa.Math.s or greater exhibits an excellent polymer scale adhesion inhibition effect when applied to an inner wall and the like of a polymerization vessel; and in addition, a low-accumulative coating film is formed when the solution is applied to an inner wall and the like of a polymerization vessel.
HARD MASK-FORMING COMPOSITION AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
A hard mask-forming composition which forms a hard mask used in lithography, including: a resin containing an aromatic ring and a polar group; and a compound containing at least one of an oxazine ring fused to an aromatic ring, and a fluorene ring.
HARD MASK-FORMING COMPOSITION AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
A hard mask-forming composition which forms a hard mask used in lithography, including: a resin containing an aromatic ring and a polar group; and a compound containing at least one of an oxazine ring fused to an aromatic ring, and a fluorene ring.
RESIN COMPOSITION, ANTI-ETCHING LAYER AND ETCHING METHOD
A resin composition, an anti-etching layer and an etching method are provided. The resin composition includes a resin (A), a crosslinking agent (B), a surfactant (C), and a solvent (D). The resin (A) includes a hydroxyl type polystyrene resin (A-1), a hydroxyl type phenolic resin (A-2), a polyhydroxy phenol resin (A-3), or a combination thereof. The crosslinking agent (B) includes a structure of novolac epoxy resin type (B-1), polymethyl methacrylate type (B-2), maleimide type (B-3) or hyperbranched oligomer (B-4).
RESIN COMPOSITION, ANTI-ETCHING LAYER AND ETCHING METHOD
A resin composition, an anti-etching layer and an etching method are provided. The resin composition includes a resin (A), a crosslinking agent (B), a surfactant (C), and a solvent (D). The resin (A) includes a hydroxyl type polystyrene resin (A-1), a hydroxyl type phenolic resin (A-2), a polyhydroxy phenol resin (A-3), or a combination thereof. The crosslinking agent (B) includes a structure of novolac epoxy resin type (B-1), polymethyl methacrylate type (B-2), maleimide type (B-3) or hyperbranched oligomer (B-4).
Cationic Curing Composition for Plastic Substrate, Coating Material, Plastic Product and Application
The disclosure provides a cationic curing composition for a plastic substrate, a coating material including the composition and an application of the composition in the field of energy curing. The cationic curing composition includes a polyhydroxy resin, an epoxy compound, an oxetanyl-containing compound, and a cationic initiator, the polyhydroxy resin is a polyester resin, an acrylic resin and/or a phenolic resin, and the molar ratio of a hydroxyl, a three-membered epoxy group to a four-membered epoxy group in the cationic curing composition is 1:(3-20):(1-25). A plastic product includes the plastic substrate and a coating layer, and the coating layer is formed by curing the cationic curing composition.
Cationic Curing Composition for Plastic Substrate, Coating Material, Plastic Product and Application
The disclosure provides a cationic curing composition for a plastic substrate, a coating material including the composition and an application of the composition in the field of energy curing. The cationic curing composition includes a polyhydroxy resin, an epoxy compound, an oxetanyl-containing compound, and a cationic initiator, the polyhydroxy resin is a polyester resin, an acrylic resin and/or a phenolic resin, and the molar ratio of a hydroxyl, a three-membered epoxy group to a four-membered epoxy group in the cationic curing composition is 1:(3-20):(1-25). A plastic product includes the plastic substrate and a coating layer, and the coating layer is formed by curing the cationic curing composition.