In an embodiment is provided a polymer that includes a plurality of N-J-N or N—C—S repeating units, wherein each J is independently a carbon atom, an alkyl group, or an aryl group; a plurality of hydrophilic groups bonded with the repeating units; and a plurality of hydrophobic groups bonded with the hydrophilic groups and the repeating units. In another embodiment is provided hydrogels of such polymers. The hydrogels may be used as delivery vehicles for various payloads. In another embodiment is provided methods of forming such polymers.

Provided is a process for forming an antimicrobial polymer composition comprising: contacting together at least one initiator, at least one promoter, at least one reductant, and at least one monomer, under emulsion polymerization conditions to form a base polymer; and mixing with the base polymer an antimicrobial complex; wherein the at least one initiator is a peroxidic compound and the at least one reductant is an ascorbic compound.

Provided is a process for forming an antimicrobial polymer composition comprising: contacting together at least one initiator, at least one promoter, at least one reductant, and at least one monomer, under emulsion polymerization conditions to form a base polymer; and mixing with the base polymer an antimicrobial complex; wherein the at least one initiator is a peroxidic compound and the at least one reductant is an ascorbic compound.

The present invention provides an adhesive film hardly suffering from fisheyes and deposition of dirt and dusts thereonto and having excellent mechanical strength and heat resistance as well as good adhesion properties, which can be suitably used as various surface protective films, etc. The present invention relates to an adhesive film comprising a polyester film and an adhesive layer formed on at least one surface of the polyester film, in which the adhesive layer comprises a resin having a glass transition point of not higher than 0° C., and an antistatic agent, and a thickness of the adhesive layer is not more than 10 μm.

Coated substrates include a metal substrate and a polytriazole polymer applied to a surface of the metal substrate. The polytriazole polymer may include substituted phenyls, substituted benzyls, or both substituted phenyls and substituted benzyls. The substituted phenyls and the substituted benzyls may be independently substituted with hydrogen, bromo, fluoro, chloro, iodo, hydroxy, methyl, trifluoromethyl, dimethylamino, tert-butyl, carboxyl, triphenylmethyl, tris(4-fluorophenyl)methyl, tris(4-methylphenyl)methyl, (4-hydroxyphenyl)diphenylmethyl, and difluoromethoxy groups. The polytriazole polymer may have a degree of polymerization from 50 to 400.

Coated substrates include a metal substrate and a polytriazole polymer applied to a surface of the metal substrate. The polytriazole polymer may include substituted phenyls, substituted benzyls, or both substituted phenyls and substituted benzyls. The substituted phenyls and the substituted benzyls may be independently substituted with hydrogen, bromo, fluoro, chloro, iodo, hydroxy, methyl, trifluoromethyl, dimethylamino, tert-butyl, carboxyl, triphenylmethyl, tris(4-fluorophenyl)methyl, tris(4-methylphenyl)methyl, (4-hydroxyphenyl)diphenylmethyl, and difluoromethoxy groups. The polytriazole polymer may have a degree of polymerization from 50 to 400.

A photosensitive resin composition including: an alkali-soluble resin (A); a photo acid generator (B); a thermal cross-linking agent (C); a phenolic antioxidant (D); and a compound (E.sub.2) having a phenolic hydroxyl group indicating an acid dissociation constant pKa of 6.0 to 9.5 at 25° C.; or a photosensitive resin composition including: an alkali-soluble resin (A); a photo acid generator (B); a thermal cross-linking agent (C); a phenolic antioxidant (D); and a compound (E) having a phenolic hydroxyl group other than (D); wherein the compound (E) having a phenolic hydroxyl group other than (D) contains a compound (E.sub.1) having an electron-withdrawing group and a phenolic hydroxyl group in the molecule. Provided is a photosensitive resin composition whose cured film has high bending resistance even after a reliability test, and also has excellent chemical resistance.

A coating composition that includes a polymer having (i) a barrier segment with aromatic groups and urethane linkages, urea linkages, or a combination thereof and (ii) an elastomeric segment that is different from (i). The barrier segment makes up at least 30 weight % of the polymer based on the total solids weight of the polymer. Further, the composition also includes an adhesion promoter having: (a) at least one epoxy functional polymer and a thiol functional crosslinker reactive with the epoxy functional polymer; and/or (b) a hydrazide functional component.

A coating composition that includes a polymer having (i) a barrier segment with aromatic groups and urethane linkages, urea linkages, or a combination thereof and (ii) an elastomeric segment that is different from (i). The barrier segment makes up at least 30 weight % of the polymer based on the total solids weight of the polymer. Further, the composition also includes an adhesion promoter having: (a) at least one epoxy functional polymer and a thiol functional crosslinker reactive with the epoxy functional polymer; and/or (b) a hydrazide functional component.

A multi-component composition containing at least one poly(meth)acrylate polyol PA and at least one melamine formaldehyde resin. The multi-component composition further includes at least one catalyst and core-shell particles. The multi-component composition is used in applications related to floor substrate preferably a bowling lane for forming a top coat exhibiting impact resistance, low coefficient of friction and excellent adhesion to the substrate.