Provided are a kit and a laminate which are capable of suppressing residues derived from a temporary adhesive in manufacture of a semiconductor. The kit for manufacturing a semiconductor device includes a composition which contains a solvent A; a composition which contains a solvent B; and a composition which contains a solvent C, in which the kit is used when a temporary adhesive layer is formed on a first substrate using a temporary adhesive composition containing a temporary adhesive and the solvent A, at least some of an excessive amount of the temporary adhesive on the first substrate is washed using the composition containing the solvent B, a laminate is manufactured by bonding the first substrate and a second substrate through the temporary adhesive layer, one of the first substrate and the second substrate is peeled off from the laminate at a temperature of lower than 40° C., and then the temporary adhesive remaining on at least one of the first substrate or the second substrate is washed using the composition containing the solvent C, and the solvent A, the solvent B, and the solvent C respectively satisfy a predetermined vapor pressure and a predetermined saturated solubility.

Provided are a kit and a laminate which are capable of suppressing residues derived from a temporary adhesive in manufacture of a semiconductor. The kit for manufacturing a semiconductor device includes a composition which contains a solvent A; a composition which contains a solvent B; and a composition which contains a solvent C, in which the kit is used when a temporary adhesive layer is formed on a first substrate using a temporary adhesive composition containing a temporary adhesive and the solvent A, at least some of an excessive amount of the temporary adhesive on the first substrate is washed using the composition containing the solvent B, a laminate is manufactured by bonding the first substrate and a second substrate through the temporary adhesive layer, one of the first substrate and the second substrate is peeled off from the laminate at a temperature of lower than 40° C., and then the temporary adhesive remaining on at least one of the first substrate or the second substrate is washed using the composition containing the solvent C, and the solvent A, the solvent B, and the solvent C respectively satisfy a predetermined vapor pressure and a predetermined saturated solubility.

A dielectric welding film capable of achieving a tight welding through a short period of dielectric heating, and a welding method using the dielectric welding film are provided. The dielectric welding film is configured to weld a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a thermoplastic resin as an A component and a dielectric filler as a B component and satisfying the conditions (i) and (ii): (i) a melting point or softening point measured in accordance with JIS K 7121 (1987) is in a range from 80 to 200 degrees C.; and (ii) heat of fusion measured in accordance with JIS K 7121 (1987) is in a range from 1 to 80 J/g.

A dielectric welding film capable of achieving a tight welding through a short period of dielectric heating, and a welding method using the dielectric welding film are provided. The dielectric welding film is configured to weld a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a thermoplastic resin as an A component and a dielectric filler as a B component and satisfying the conditions (i) and (ii): (i) a melting point or softening point measured in accordance with JIS K 7121 (1987) is in a range from 80 to 200 degrees C.; and (ii) heat of fusion measured in accordance with JIS K 7121 (1987) is in a range from 1 to 80 J/g.

The present invention relates to an aqueous emulsion including an ethylenically unsaturated monomer unit-containing polymer as a dispersoid and a polyvinyl alcohol as a dispersant. The content of a free polyvinyl alcohol in the aqueous emulsion is 0.2 to 20 parts by mass relative to 100 parts by mass of the ethylenically unsaturated monomer unit-containing polymer. The free polyvinyl alcohol has a degree of saponification of 80.0 to 99.5 mol % and a viscosity-average degree of polymerization of 200 to 5000, and the free polyvinyl alcohol has a symmetry factor (W.sub.0.05h/2f) that satisfies the following expression (1) as determined by gradient high-performance liquid chromatography for reversed-phase separation using a water-acetone eluent according to JIS K 0124 (2011).

0.85≦W.sub.0.05h/2f≦1.30  (1)

(The definitions of the symbols are omitted.)

The present invention relates to an aqueous emulsion including an ethylenically unsaturated monomer unit-containing polymer as a dispersoid and a polyvinyl alcohol as a dispersant. The content of a free polyvinyl alcohol in the aqueous emulsion is 0.2 to 20 parts by mass relative to 100 parts by mass of the ethylenically unsaturated monomer unit-containing polymer. The free polyvinyl alcohol has a degree of saponification of 80.0 to 99.5 mol % and a viscosity-average degree of polymerization of 200 to 5000, and the free polyvinyl alcohol has a symmetry factor (W.sub.0.05h/2f) that satisfies the following expression (1) as determined by gradient high-performance liquid chromatography for reversed-phase separation using a water-acetone eluent according to JIS K 0124 (2011).

0.85≦W.sub.0.05h/2f≦1.30  (1)

(The definitions of the symbols are omitted.)

A dielectric welding film capable of providing excellent adhesiveness to a variety of adherends in a short period of dielectric heating, and an welding method using the dielectric welding film are provided. The dielectric welding film is configured to adhere a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a first thermoplastic resin as an A1 component having a predetermined solubility parameter, a second thermoplastic resin as an A2 component having a solubility parameter larger than the solubility parameter of the first thermoplastic resin, and a dielectric filler as a B component. The welding method uses the dielectric welding film.

A dielectric welding film capable of providing excellent adhesiveness to a variety of adherends in a short period of dielectric heating, and an welding method using the dielectric welding film are provided. The dielectric welding film is configured to adhere a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a first thermoplastic resin as an A1 component having a predetermined solubility parameter, a second thermoplastic resin as an A2 component having a solubility parameter larger than the solubility parameter of the first thermoplastic resin, and a dielectric filler as a B component. The welding method uses the dielectric welding film.

The present invention relates to an adhesive tape comprising at least one carrier that has a thickness of 20 to 250 μm, preferably 50 to 150 μm, and has at least one layer (i) based on preferably uncrosslinked thermoplastic polyurethane that has been produced by means of extrusion, wherein the polyurethane is based on aromatic polyisocyanate, such as aromatic diisocyanate in particular, or (ii) based on preferably uncrosslinked polyurethane that has been produced from a dispersion, wherein a pressure-sensitive adhesive layer is disposed on at least one side, preferably both sides, of the carrier. The invention also relates to processes for producing the adhesive tape and to the use thereof for bonding of components in electrical, electronic, optical or precision mechanical devices, such as, in particular, of windows or lenses in housings of precision mechanical, optical and/or electronic devices.

An adhesive composition having a low dielectric constant, low dielectric loss tangent, excellent folding endurance, and excellent heat resistance. The adhesive composition includes: with respect to the total of 100 parts by mass of the adhesive composition, 70 to 90 parts by mass of the styrene elastomer; 5 to 25 parts by mass of a modified polyphenyleneether resin having a polymerizable group at an end; totally 10 parts by mass or less of an epoxy resin and an epoxy resin curing agent, wherein the styrene ratio of the styrene elastomer is less than 42%.