Patent classifications
C09J151/003
Cyanoacrylate compositions
Cyanoacrylate compositions, methods for forming same, and applications thereof are disclosed. The compositions demonstrate improved thermal ageing performance, including improved tensile strength performance after heat ageing in high humidity.
POLYMERS DERIVED FROM A POLY(TETRAHYDROFURAN)(METH)ACRYLATE MACROMER, ADHESIVE COMPOSITIONS, AND ARTICLES
An adhesive composition that contains two polymeric materials, a method of making the adhesive composition, and an article that contains the adhesive composition are provided. One of the polymeric materials is derived from a (meth)acrylate macromer having a poly(tetrahydrofuran) group. The articles include a layer of the adhesive composition positioned next to a substrate. The articles can be, for example, an adhesive tape or can be part of another article such as, for example, an electronic device that is impact resistant and/or flexible.
METHOD FOR PRODUCING REMOVABLE PRESSURE-SENSITIVE ADHESIVES (PSAs) USING BIO-BASED STARTING MATERIALS
The present invention refers to a method for producing preferably water-based polymeric compositions, preferably dispersions (i.e. latices), which are particularly useful as or in adhesives, especially pressure-sensitive adhesives (PSAs), particularly pressure-sensitive adhesives removable under neutral or basic (i.e. alkaline) conditions, as well as to the polymeric compositions thus produced and to their various applications, including the copolymers comprised by these polymeric compositions.
Grafted polyvinyl alcohol polymer, formulations containing the same, and creping methods
A grafted polyvinyl alcohol polymer includes a polyvinyl alcohol main chain and a plurality of side chains grafted to the polyvinyl alcohol main chain. One or more of the side chains from the plurality of side chains include one or more units selected from: an aliphatic carboxylic acid, an aliphatic amide, an amino alkyl (meth)acrylate, a hydroxylated alkyl (meth)acrylate, or any combinations thereof. The grafted polyvinyl alcohol polymer can be included in a formulation that also includes water, and the formulation can be used as an adhesive in a creping process.
Adhesive sheet for temporary fixation and method of manufacturing semiconductor device using the same
An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.
Chlorinated polyolefin resin composition
An object is to provide a chlorinated polyolefin resin composition being superior in adhesion, solution stability, and chipping resistance. The chlorinated polyolefin resin composition contains a component (A): a polyolefin resin A having a melting point (Tm.sub.A) obtained with a differential scanning calorimeter (DSC) in the range of 90 to 160° C., and a component (B): a polyolefin resin B having a melting point (Tm.sub.B) obtained with a differential scanning calorimeter (DSC) in the range of 50 to 130° C., at least any one of the component (A) and the component (B), or a copolymer thereof being a chlorinated polyolefin resin (where |Tm.sub.A−Tm.sub.B|≥5° C.).
Acrylic Resin Powder, Resin Composition, Hot-Melt Adhesive Composition Including Acrylic Resin Powder, and Production Method Therefor
The present invention relates to an acrylic resin powder containing a multistage polymer (G) having an alkyl (meth)acrylate ester (ma) monomer unit and an alkyl (meth)acrylate ester (mb) monomer unit, in which an alkyl group in the alkyl (meth)acrylate esters (ma) and (mb) has 4 to 8 carbon atoms, a glass transition temperature of the multistage polymer (G) is 50° C. or higher, a mass average molecular weight is 10,000 or more and 300,000 or less, a softening temperature that is measured by a flow tester temperature-rising method is 150° C. to 200° C., and the acrylic resin powder is soluble in acetone.
PRESSURE SENSITIVE ADHESIVE HAVING LOW VOC CHARACTERISTICS
The present disclosure relates to a precursor composition of a pressure sensitive adhesive comprising: a) a (co)polymeric base component having a weight-average molecular weight (M.sub.w) no greater than 500,000 g/mol and comprising at least one reactive functional group (X); and b) a multi-functional oligomeric branching compound comprising an oligomer backbone and having a weight-average molecular weight (M.sub.w) greater than 250 g/mol, wherein the multi-functional oligomeric branching compound comprises at least two complementary reactive functional groups (Y) which are capable of chemically reacting with the at least one reactive functional group (X) of the (co)polymeric base component.
Adhesive Composition
The present disclosure provides an adhesive composition. The adhesive composition contains (A) multi-stage latex polymer particles, (B) a linear diamine base, and (C) an ethoxylated surfactant. The (A) multi-stage latex polymer particles include (i) a first-stage polymer containing acrylic acid monomer and a first vinyl monomer, and (ii) a second-stage polymer containing a meth acrylic acid monomer and a second vinyl monomer, with the proviso that the second vinyl monomer is different than the meth acrylic acid monomer. The first-stage polymer is bound to the second-stage polymer.
Adhesive Composition
The present disclosure provides an adhesive composition. The adhesive composition contains (A) multi-stage latex polymer particles, (B) a linear diamine base, and (C) an ethoxylated surfactant. The (A) multi-stage latex polymer particles include (i) a first-stage polymer containing acrylic acid monomer and a first vinyl monomer, and (ii) a second-stage polymer containing a meth acrylic acid monomer and a second vinyl monomer, with the proviso that the second vinyl monomer is different than the meth acrylic acid monomer. The first-stage polymer is bound to the second-stage polymer.