Provided is an adhesive agent composition for a wet-type friction member, including a resol-type phenol resin, a polyvinyl butyral, and a solvent, in which a weight average molecular weight of the resol-type phenol resin is equal to or more than 1200 and equal to or less than 2000.

Provided is an adhesive agent composition for a wet-type friction member, including a resol-type phenol resin, a polyvinyl butyral, and a solvent, in which a weight average molecular weight of the resol-type phenol resin is equal to or more than 1200 and equal to or less than 2000.

The present document describes a composition for the pretreatment of surfaces, which comprises plasticizers, degassers, pH adjusting agents, pigments, a phenol formaldehyde resin based adhesive, process of making the same and method of using the same.

The present document describes a composition for the pretreatment of surfaces, which comprises plasticizers, degassers, pH adjusting agents, pigments, a phenol formaldehyde resin based adhesive, process of making the same and method of using the same.

A wafer laminate has an adhesive layer (2) sandwiched between a support (1) and a wafer (3), with a circuit-forming surface of the wafer facing the adhesive layer. The adhesive layer (2) includes a light-shielding resin layer (2a), an epoxy-containing siloxane skeleton resin layer (2b), and a non-silicone thermoplastic resin layer (2c).

A wafer laminate has an adhesive layer (2) sandwiched between a support (1) and a wafer (3), with a circuit-forming surface of the wafer facing the adhesive layer. The adhesive layer (2) includes a light-shielding resin layer (2a), an epoxy-containing siloxane skeleton resin layer (2b), and a non-silicone thermoplastic resin layer (2c).

The present invention relates to a sizing composition for mineral fibers, especially glass fibers or rock fibers, containing a liquid phenolic resin having a free formaldehyde content, expressed with respect to the total weight of liquid, of 0.1% or less and an extender.

Preferably, the liquid phenolic resin is mainly composed of phenol-formaldehyde and phenol-formaldehyde-amine condensates and has a water dilutability, at 20° C., at least equal to 1000%.

Another subject of the present invention is the insulating products based on mineral fibers treated by said sizing composition.

The present invention relates to a sizing composition for mineral fibers, especially glass fibers or rock fibers, containing a liquid phenolic resin having a free formaldehyde content, expressed with respect to the total weight of liquid, of 0.1% or less and an extender.

Preferably, the liquid phenolic resin is mainly composed of phenol-formaldehyde and phenol-formaldehyde-amine condensates and has a water dilutability, at 20° C., at least equal to 1000%.

Another subject of the present invention is the insulating products based on mineral fibers treated by said sizing composition.

The present invention relates to a sizing composition for mineral fibers, especially glass fibers or rock fibers, containing a liquid phenolic resin having a free formaldehyde content, expressed with respect to the total weight of liquid, of 0.1% or less and an extender.

Preferably, the liquid phenolic resin is mainly composed of phenol-formaldehyde and phenol-formaldehyde-amine condensates and has a water dilutability, at 20° C., at least equal to 1000%.

Another subject of the present invention is the insulating products based on mineral fibers treated by said sizing composition.

An adhesive composition is disclosed. The adhesive composition comprises an epoxy-containing component; rubber particles having a core-shell structure; and a curing component comprising a mixture of an amine-containing compound substantially free of hydroxyl functional groups and a polymeric phenol-containing compound, wherein the amine-containing compound comprises primary and/or secondary amino groups, and wherein the curing component chemically reacts with the epoxy-containing component upon activation from an external energy source. Also disclosed are methods of preparing the adhesive composition and for forming a bonded substrate with the adhesive composition. Further disclosed are curing components for an adhesive composition and methods of making the curing components.