A method of joining a multiple member work-piece includes providing a first steel work-piece having a first thickness and a second steel work-piece having a second thickness. The first thickness is at least twice the second thickness. A third material is disposed in contact with the second steel work-piece. For example, the third material may be in the form of a rivet, a plurality of pins, or a coating material. The method includes resistance welding the first and second work-pieces together. A bonded assembly includes the first and second steel members and the third material being bonded together, where the thickness of the first member is at least twice the thickness of the second member.

A system including two pre-fixed substrates, wherein a first substrate and a second substrate. Each of the substrates has an opening in an overlap region, and an adhesive is arranged between the overlap regions, wherein the adhesive connects the two substrates together and is arranged at least partly in the openings. The adhesive is locally cured in the region of the openings. A cured sub-region of the adhesive extends from the first opening into the second opening, and a second sub-region of the adhesive is not cured.

A system including two pre-fixed substrates, wherein a first substrate and a second substrate. Each of the substrates has an opening in an overlap region, and an adhesive is arranged between the overlap regions, wherein the adhesive connects the two substrates together and is arranged at least partly in the openings. The adhesive is locally cured in the region of the openings. A cured sub-region of the adhesive extends from the first opening into the second opening, and a second sub-region of the adhesive is not cured.

Bonding dissimilar materials of medical device components can be carried out by applying an adhesive on at least one surface of two components which are composed of dissimilar materials and contacting the surfaces and exposing the contacted surfaces to heat and/or irradiate the adhesive to cure the adhesive and bond the surfaces. One medical component, e.g., medical tubing, can be composed of a non-polar, polyvinyl chloride free thermoplastic polymeric material and the other medical component, e.g., a medical connector, can be composed of polyacrylate, polyacrylonitrile, acrylonitrile-butadiene-styrene (ABS), methyl methacrylate-acrylonitrile-butadiene-styrene (mABS), polyester, and/or a polycarbonate material. The adhesive formulation can include: (a) a polyolefin oligomer having reactive acrylate groups and alkenyl groups, (b) an initiator, and optionally (c) a solvent.

Bonding dissimilar materials of medical device components can be carried out by applying an adhesive on at least one surface of two components which are composed of dissimilar materials and contacting the surfaces and exposing the contacted surfaces to heat and/or irradiate the adhesive to cure the adhesive and bond the surfaces. One medical component, e.g., medical tubing, can be composed of a non-polar, polyvinyl chloride free thermoplastic polymeric material and the other medical component, e.g., a medical connector, can be composed of polyacrylate, polyacrylonitrile, acrylonitrile-butadiene-styrene (ABS), methyl methacrylate-acrylonitrile-butadiene-styrene (mABS), polyester, and/or a polycarbonate material. The adhesive formulation can include: (a) a polyolefin oligomer having reactive acrylate groups and alkenyl groups, (b) an initiator, and optionally (c) a solvent.

Applying heat activatable adhesive to a substrate, the adhesive is solid at ambient temperature and can be melted at a temperature below its heat activation temperature wherein the adhesive formulation is supplied to a hot melt applicator where it is heated to above its melting point and below its activation temperature and the melt viscosity of the molten adhesive is controlled so that it can be ejected from the hot melt applicator onto a substrate to provide a coherent bead that adheres to the substrate and is dry to the touch on cooling and upon activation the adhesive is capable of expanding with a volume expansion greater than about 250%.

Applying heat activatable adhesive to a substrate, the adhesive is solid at ambient temperature and can be melted at a temperature below its heat activation temperature wherein the adhesive formulation is supplied to a hot melt applicator where it is heated to above its melting point and below its activation temperature and the melt viscosity of the molten adhesive is controlled so that it can be ejected from the hot melt applicator onto a substrate to provide a coherent bead that adheres to the substrate and is dry to the touch on cooling and upon activation the adhesive is capable of expanding with a volume expansion greater than about 250%.

A component comprising a first outer region (11), at least one intermediate region (13) and a second outer region (12). The outer regions (11, 12) have a higher density and/or a higher elastic modulus than the at least one intermediate region (13). A polymer composition (21) can, preferably, be injected into the component (1) such that a mechanical connection (41) is fixed or can be fixed in the polymer composition (21). A method, a kit and the use thereof are also disclosed.

A component comprising a first outer region (11), at least one intermediate region (13) and a second outer region (12). The outer regions (11, 12) have a higher density and/or a higher elastic modulus than the at least one intermediate region (13). A polymer composition (21) can, preferably, be injected into the component (1) such that a mechanical connection (41) is fixed or can be fixed in the polymer composition (21). A method, a kit and the use thereof are also disclosed.

A laminate composite material (1), suitable for the packaging of food products and having a multilayer structure comprising: a first outer layer (21) of paper or plastic film; an inner layer (22) of adhesive; and an intermediate layer (23) interposed between the first and the second layer and made of sodium silicate (Na.sub.2O×SiO.sub.2).