C11D7/3236

Cleaning agent composition for semiconductor device substrate, method of cleaning semiconductor device substrate, method of manufacturing semiconductor device substrate, and semiconductor device substrate

According to the present invention, there is provided a cleaning agent composition for a semiconductor device substrate including at least one of wiring and an electrode in which the wiring and the electrode contain cobalt or a cobalt alloy, the cleaning agent composition including a component (A): at least one compound selected from the group consisting of specific compounds; and a component (B): water.

COLORANT CATCHER MATERIAL
20200181832 · 2020-06-11 ·

A colorant catcher material includes a) a substrate and b) a colorant-catching additive. The colorant-catching additive is selected from the group consisting of polyvinylamines in form of homopolymers, copolymers and/or partial salts thereof, polyethylenimines in form of homopolymers, copolymers and/or partial salts thereof, and mixture thereof. The colorant-catching additive is fixed on the substrate by c) a fixing agent selected from the group consisting of dialdehydes with the carbon number of from 2 to 8. Also disclosed is a method for preparing the colorant catcher material and use of the same for catching colorants or removing dirt in an aqueous medium, particularly a laundry washing solution.

CLEANING AGENT COMPOSITION FOR SEMICONDUCTOR DEVICE SUBSTRATE, METHOD OF CLEANING SEMICONDUCTOR DEVICE SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE SUBSTRATE, AND SEMICONDUCTOR DEVICE SUBSTRATE

According to the present invention, there is provided a cleaning agent composition for a semiconductor device substrate including at least one of wiring and an electrode in which the wiring and the electrode contain cobalt or a cobalt alloy, the cleaning agent composition including a component (A): at least one compound selected from the group consisting of specific compounds; and a component (B): water.

METAL RESIDUE REMOVING LIQUID, METAL RESIDUE REMOVING METHOD, AND METAL WIRING MANUFACTURING METHOD
20240117280 · 2024-04-11 ·

A metal residue removing liquid including a mixed solvent containing a first organic solvent and a second organic solvent, a salt of a base containing no metal ions and hydrofluoric acid, and water, in which the first organic solvent is diethylformamide, and the mixed solvent has a value of 0.6 or more, which is obtained by subtracting a hydrogen bond term of a Hansen solubility parameter from a polar term of the Hansen solubility parameter.

Metal free bleaching composition

The present invention relates to the use of a composition comprising specific a-amino-ketones, H.sub.2O.sub.2, a H.sub.2O.sub.2 precursor or a peracid and optionally an activator as a bleaching mixture for textile materials or dishes either manually or in an automatic washing machine or dish washer. Further aspects of the invention are the composition comprising specific a-aminoketones and H.sub.2O.sub.2, a H.sub.2O.sub.2 precursor or a peracid and a process for bleaching of stains or of soiling on textile materials or dishes in the context of a washing process either manually or in an automatic washing machine or dish washer. Also aspects of the invention are detergent formulations comprising such a composition and novel compounds.