In an embodiment, an alloy is exposed to a hydrophilic solvent at least until at least one Group I or Group II element is substantially removed so as to produce a nanomaterial that substantially includes a metal, semimetal or non-metal material and that exhibits a desired set of microstructure characteristics. The hydrophilic solvent is configured to be reactive with respect to the at least one Group I or Group II element and substantially unreactive with respect to the metal, semimetal or non-metal material. In another embodiment, an active material is infiltrated into pores of a nanoporous metal or metal oxide, after which the infiltrated nanoporous metal or metal oxide material is annealed to produce an active material-based nanocomposite material. A protective coating layer is deposited on at least part of a surface of the active material-based nanocomposite material.

A method for making a three-dimensional hierarchical layered porous copper, the method includes providing a copper-zinc alloy precursor being composed of a β′ phase and a γ phase, and treating the copper-zinc alloy precursor by electrochemical dealloying. The present application further provides a three-dimensional hierarchical layered porous copper including a first surface layer, an intermediate layer, and a second surface layer stacked in that order. The first surface layer includes a plurality of micron-scale pores and a plurality of first nanoscale pores. The intermediate layer includes a plurality of second nanoscale pores. The second surface layer includes the plurality of micron-scale pores and the plurality of first nanoscale pores.

The present invention relates to a HEA foam prepared by selective dissolution of a second phase within a two-phase separating alloy comprising the HEA and a manufacturing method thereof. The manufacturing method of the HEA foam of the present invention has the effect of preparing a novel HEA foam, which was not available in the past, by leaving only a first phase after manufacturing a two-phase separating alloy comprising a first phase by HEA, wherein at least 3 metal elements act as a common solvent.

Furthermore, the HEA foam of the present invention has a structure, wherein pores are distributed inside the HEA, in which at least 3 metal elements act as a common solvent. By adding a functional characteristic of low heat conductivity, etc., to the existing high strength characteristic of HEA, the HEA foam of the present invention can exhibit a complex effect by the combination of the two particular effects, thereby being capable of exhibiting excellent physical characteristics.

A disclosed process produces at least one concentrated copper product together with at least one crude solder product, starting from a black copper composition with at least 50% of copper together with at least 1.0% wt of tin and at least 1.0% wt of lead The process includes the step of partially oxidizing the black copper thereby forming a first copper refining slag, followed by partially reducing the first copper refining slag to form a first lead-tin based metal composition and a first spent slag. The total feed to the reducing step includes an amount of copper that is at least 1.5 times as high as the sum of the amounts of Sn plus Pb present, and the first spent slag includes at most 20% wt total of copper, tin and lead together.

A method for making a three-dimensional hierarchical layered porous copper, the method includes providing a copper-zinc alloy precursor being composed of a β′ phase and a γ phase, and treating the copper-zinc alloy precursor by electrochemical dealloying. The present application further provides a three-dimensional hierarchical layered porous copper including a first surface layer, an intermediate layer, and a second surface layer stacked in that order. The first surface layer includes a plurality of micron-scale pores and a plurality of first nanoscale pores. The intermediate layer includes a plurality of second nanoscale pores. The second surface layer includes the plurality of micron-scale pores and the plurality of first nanoscale pores.

Metal compositions and production processes are described. A process for the production of a metal composition includes a first distillation step separating off by evaporation primarily lead from a solder mixture of lead, tin, and antimony, thereby producing as a first concentrated lead stream. The process includes a second distillation step separating primarily lead and antimony from the metal composition, thereby producing a second concentrated lead stream and a second bottom product. The method also includes a third distillation step separating primarily lead and antimony from the second concentrated lead stream, thereby producing a third concentrated lead stream and a third bottom product.

A process for producing a solder product and a copper product from a first lead-tin based metal composition having at least 40% wt of copper and at least 5.0% wt together of tin and lead. The process includes the steps of partially oxidizing a first liquid bath having the first lead-tin based metal composition, thereby forming a first dilute copper metal composition and a first solder refining slag, followed by separating the slag from the metal composition, and partially oxidizing a second liquid bath having the first dilute copper metal composition, thereby forming a first high-copper metal composition and a third solder refining slag, followed by separating the third solder refining slag from the first high-copper metal composition,
whereby the solder product is derived from the first solder refining slag.

A method for the hydrometallurgical processing of a noble metal-tin alloy consisting of (i) 0.45 to 25% by weight of at least one metal A selected from the group consisting of gold and platinum, (ii), 35 to 99.2% by weight of at least one metal B selected from the group consisting of palladium, silver, and copper, (iii) 0.3 to 30% by weight tin, and (iv) 0 to 50% by weight of at least one element other than gold, platinum, palladium, silver, copper, and tin, and has a weight ratio of metal A:tin of 0.7:1, comprising the steps of:

(a1) specifically selecting a noble metal-tin alloy
or
(a2) specifically producing a noble metal-tin alloy;
(b) dissolving nitric acid-soluble components of the noble metal-tin alloy with nitric acid while forming a nitric acid-containing solution comprising the at least one metal B in the form of the dissolved nitrate, and an undissolved residue;
(c) separating the undissolved residue from the nitric acid-containing solution; and
(d) dissolving the separated residue in a medium that comprises hydrochloric acid and at least one oxidation agent.

The present invention relates to a HEA foam prepared by selective dissolution of a second phase within a two-phase separating alloy comprising the HEA and a manufacturing method thereof. The manufacturing method of the HEA foam of the present invention has the effect of preparing a novel HEA foam, which was not available in the past, by leaving only a first phase after manufacturing a two-phase separating alloy comprising a first phase by HEA, wherein at least 3 metal elements act as a common solvent. Furthermore, the HEA foam of the present invention has a structure, wherein pores are distributed inside the HEA, in which at least 3 metal elements act as a common solvent. By adding a functional characteristic of low heat conductivity, etc., to the existing high strength characteristic of HEA, the HEA foam of the present invention can exhibit a complex effect by the combination of the two particular effects, thereby being capable of exhibiting excellent physical characteristics.

Provided is a method for producing a hot-dip Al-based metal-plated steel sheet including a plated layer having a surface on which fine spangle are stably formed. A method for producing a hot-dip Al-based metal-plated steel sheet, includes a composition adjusting step of adding a B-containing master alloy so as to adjust a composition of an Al-based hot-dip plating bath (3) containing aluminum as a main component, the composition being adjusted so that the Al-based hot-dip plating bath has a B concentration of not less than 0.005 mass % and a K concentration of more than 0 mass % and less than 0.0005 mass %, the K concentration being reduced in the Al-based hot-dip plating bath by supplying gas into the Al-based hot-dip plating bath so as to remove a suspended matter on a surface of the Al-based hot-dip plating bath.