An alloy comprising or consisting of 40 to 62.5 atomic percent copper, 5 to 40 atomic percent manganese, up to 24 atomic percent nickel, 5 to 24 atomic percent zinc, and 1 to 15 atomic percent aluminium.

An alloy comprising or consisting of 40 to 62.5 atomic percent copper, 5 to 40 atomic percent manganese, up to 24 atomic percent nickel, 5 to 24 atomic percent zinc, and 1 to 15 atomic percent aluminium.

A copper-based alloy sputtering target includes copper and a metal element selected from manganese, chromium, cobalt, aluminum, tin, titanium, and combinations thereof. Based on a total weight of the copper-based alloy sputtering target, copper is present in an amount of not less than 98 wt %, and the metal element is present in an amount ranging from 0.3 wt % to 2.0 wt %. The copper-based alloy sputtering target has an average value of Kernel Average Misorientation of not greater than 2° as determined by Electron Backscatter Diffraction, and an average value of Vickers hardness on a sputtering surface that ranges from 90 Hv to 120 Hv. A method for making the copper-based alloy sputtering target is also disclosed.

A copper-based alloy sputtering target includes copper and a metal element selected from manganese, chromium, cobalt, aluminum, tin, titanium, and combinations thereof. Based on a total weight of the copper-based alloy sputtering target, copper is present in an amount of not less than 98 wt %, and the metal element is present in an amount ranging from 0.3 wt % to 2.0 wt %. The copper-based alloy sputtering target has an average value of Kernel Average Misorientation of not greater than 2° as determined by Electron Backscatter Diffraction, and an average value of Vickers hardness on a sputtering surface that ranges from 90 Hv to 120 Hv. A method for making the copper-based alloy sputtering target is also disclosed.

The present disclosure relates to a copper based microcrystalline alloy and a preparation method thereof, and an electronic product. In percentage by weight and based on the total amount of the copper based microcrystalline alloy, the copper based microcrystalline alloy includes: 30-60 wt % of Cu; 25-40 wt % of Mn; 4-6 wt % of Al; 10-17 wt % of Ni; 0.01-10 wt % of Si; and 0.001-0.03% of Be.

The present disclosure relates to a copper based microcrystalline alloy and a preparation method thereof, and an electronic product. In percentage by weight and based on the total amount of the copper based microcrystalline alloy, the copper based microcrystalline alloy includes: 30-60 wt % of Cu; 25-40 wt % of Mn; 4-6 wt % of Al; 10-17 wt % of Ni; 0.01-10 wt % of Si; and 0.001-0.03% of Be.

Provided is a copper-manganese-nickel based alloy having characteristics (in particular, specific resistance) close to those of a nickel-chromium based alloy. It is also an objective to provide an alloy having high processability compared to a nickel-chromium based alloy. An alloy for a resistive body includes copper, manganese, and nickel, wherein the manganese is 33 to 38% by mass, and the nickel is 8 to 15% by mass.

Provided is a copper-manganese-nickel based alloy having characteristics (in particular, specific resistance) close to those of a nickel-chromium based alloy. It is also an objective to provide an alloy having high processability compared to a nickel-chromium based alloy. An alloy for a resistive body includes copper, manganese, and nickel, wherein the manganese is 33 to 38% by mass, and the nickel is 8 to 15% by mass.

Guitar strings made of a magnetic copper-nickel-tin-manganese alloy are disclosed. Also disclosed are processing steps that can be performed to fabricate the guitar strings from the alloy. Further described herein are alternative uses for the strings on other electric stringed instruments.

Guitar strings made of a magnetic copper-nickel-tin-manganese alloy are disclosed. Also disclosed are processing steps that can be performed to fabricate the guitar strings from the alloy. Further described herein are alternative uses for the strings on other electric stringed instruments.